S32G379ASCK1VUCR

4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 1,351 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G379
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G379ASCK1VUCR – ARM® Cortex®-A53 and Cortex®-M7 Mixed‑Core Microprocessor

The S32G379ASCK1VUCR from NXP Semiconductors is a mixed‑core microprocessor in the S32G3 family featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores. It combines high‑performance application cores and real‑time microcontroller cores with integrated networking and security features for embedded and industrial systems.

With multi‑GHz application performance alongside 400 MHz real‑time cores, multi‑Gbps Ethernet, flexible memory controller support, and industrial temperature qualification, this device addresses embedded gateway, secure edge processing and industrial control use cases that require integration and robust operation.

Key Features

  • Core Architecture  ARM® Cortex®‑A53 application cores and ARM® Cortex®‑M7 microcontroller cores in a mixed‑core S32G3 configuration, delivering a combination of application processing and real‑time control.
  • Clock Speeds  Application and real‑time performance indicated by nominal 1.3 GHz for A53 cores and 400 MHz for M7 cores as part of the S32G3 family.
  • Memory Support  Integrated controllers compatible with DDR3L SDRAM and LPDDR4 DRAM for flexible memory subsystem design.
  • Networking Interfaces  High‑speed Ethernet capability with 2.5 Gbps ports (3) and CANbus support for modern embedded networking and fieldbus connectivity.
  • USB  Includes USB 2.0 OTG interface for peripheral connectivity.
  • Security  On‑chip security features including ARM TrustZone (TZ), cryptography, a random number generator, secure fusebox, secure memory and XRDC for hardware‑level protection and partitioning.
  • Package & Mounting  Delivered in a 525‑FCPBGA (19×19) FCBGA package, designed for surface‑mount PCB assembly.
  • Qualification & Temperature  Industrial qualification with an operating temperature range of -40°C to 105°C for reliable deployment in industrial environments.
  • Graphics  No graphics acceleration included, focusing the device on compute, control and networking tasks.

Typical Applications

  • Industrial Control and Automation  Use the mixed‑core design and industrial temperature range for real‑time control, protocol handling and networked automation systems.
  • Secure Edge Gateways  Leverage multi‑Gbps Ethernet and hardware security features to build secure embedded gateways and protocol translators.
  • Networked Controllers  Deploy CANbus and Ethernet interfaces together with real‑time M7 cores for distributed control nodes and field controllers.
  • Embedded Communications  Implement high‑throughput communication stacks using the 2.5 Gbps Ethernet ports and supported memory interfaces.

Unique Advantages

  • Mixed‑Core Integration: Combines ARM® Cortex®‑A53 and Cortex®‑M7 cores to address both application processing and deterministic real‑time tasks in a single device, reducing BOM and enabling system consolidation.
  • High‑Speed Networking: Multiple 2.5 Gbps Ethernet ports and CANbus support simplify design of networked and gateway systems that require robust connectivity.
  • Comprehensive Hardware Security: Built‑in TrustZone, cryptography, RNG, secure fusebox, secure memory and XRDC help implement layered device security without extensive external components.
  • Flexible Memory Options: Support for DDR3L and LPDDR4 DRAM gives designers options for performance and power tradeoffs across embedded applications.
  • Industrial Readiness: Surface‑mount FCPBGA package and an operating range of -40°C to 105°C make the device suitable for industrial environments requiring extended temperature operation.

Why Choose S32G379ASCK1VUCR?

The S32G379ASCK1VUCR positions itself as a highly integrated solution for embedded and industrial systems that demand both application performance and deterministic real‑time control. Its combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multi‑gigabit Ethernet, CANbus, flexible DRAM support and a suite of hardware security features enables consolidated system architectures with clear partitioning between high‑level functions and real‑time tasks.

This part is suited for developers and system architects building embedded gateways, secure edge devices and industrial controllers who need a balance of compute, connectivity and security within an industrial temperature‑qualified package.

Request a quote or contact sales to discuss availability, pricing and how S32G379ASCK1VUCR can meet your embedded design requirements.

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