S32G398AABK1VUCT

8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 3 Core, 64-Bit/8 Core, 32-Bit 1.1GHz, 400MHz 525-FCPBGA (19x19)

Quantity 1,165 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G398
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed1.1GHz, 400MHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G398AABK1VUCT – 8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1

The S32G398AABK1VUCT is a microprocessor IC from the S32G398 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It combines multi-core 64-bit and 32-bit architectures with industrial-grade operating range and integrated interfaces for embedded applications.

Designed for embedded systems that require multi-core processing, secure operation, and multiple high-speed network interfaces, this device delivers combined application and real-time control capabilities in a 525-FCPBGA (19×19) package.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 cores provided as "3 Core, 64-Bit / 8 Core, 32-Bit" configurations to address mixed application and real-time processing.
  • Performance  1.1 GHz core speed for high-level processing and a 400 MHz option for real-time control cores as indicated by the product naming.
  • Memory Controllers  Integrated support for DDR3L SDRAM and LPDDR4 DRAM to accommodate varied memory bandwidth and capacity requirements.
  • Networking and Connectivity  Three 2.5Gbps Ethernet ports and one USB 2.0 OTG interface, plus CANbus support for automotive-style field busses and industrial communication.
  • Security  On-chip security features including ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for resource domain protection.
  • Co-Processors  Multimedia acceleration and NEON support for vector processing to assist compute-intensive signal and multimedia tasks.
  • Package and Mounting  525-FCPBGA (19×19) FCBGA package intended for surface-mount assembly in compact system designs.
  • Operating Conditions  Industrial qualification with an operating temperature range of −40°C to 105°C.
  • Graphics  No graphics acceleration included, focusing compute resources on application and real-time processing.

Typical Applications

  • Industrial Embedded Systems  Multi-core processing and industrial temperature qualification make the device suitable for control and monitoring systems in industrial environments.
  • Networked Gateways and Routers  Multiple 2.5Gbps Ethernet ports and USB 2.0 OTG enable high-throughput connectivity and peripheral integration for gateway applications.
  • Secure Connected Devices  On-chip ARM TrustZone, cryptography, secure memory, and RNG support secure boot, secure communication, and protection of critical assets.
  • Real-Time Control and Sensor Aggregation  Combined Cortex-A53 and Cortex-M7 cores allow separation of application-level tasks and deterministic real-time control for sensor and actuator management.

Unique Advantages

  • Hybrid Multi-Core Architecture: Provides both 64-bit application processing and 32-bit real-time control cores in one device to simplify heterogeneous designs.
  • High-Speed Networking Integration: Three 2.5Gbps Ethernet ports and CANbus support reduce external components for networked embedded systems.
  • Comprehensive On-Chip Security: Multiple hardware security primitives (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) enable robust device-level protection.
  • Flexible Memory Support: DDR3L and LPDDR4 controller support provides options for balancing cost, power, and performance.
  • Industrial Temperature Range: −40°C to 105°C operating range and industrial qualification suitable for harsh environments.
  • Compact Surface-Mount Package: 525-FCPBGA (19×19) package offers a compact footprint for space-constrained embedded designs.

Why Choose S32G398AABK1VUCT?

The S32G398AABK1VUCT positions itself as an integrated microprocessor solution for embedded designs that require a mix of high-level application processing and deterministic real-time control. Its combined ARM® Cortex®-A53 and Cortex®-M7 cores, together with multiple Ethernet interfaces and comprehensive security features, address designs that need performance, connectivity, and device-level protection.

This device is well suited to engineers developing industrial embedded systems, secure networked devices, and real-time control applications that benefit from integrated memory controller support and an industrial operating range. The integration of networking, security, and mixed-core processing helps reduce BOM complexity while enabling scalable system architectures.

Request a quote or contact sales to discuss pricing, availability, and design-in support for the S32G398AABK1VUCT.

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