S32G398AACK1VUCR

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 3 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 283 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G398
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G398AACK1VUCR – 8× ARM® Cortex®‑A53 1.3GHz, 3× ARM® Cortex®‑M7 400MHz Multi-Core Microprocessor

The S32G398AACK1VUCR is a multi-core microprocessor IC from NXP Semiconductors, combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores in a compact 525‑FCPBGA (19×19) package. The device integrates high-performance application cores alongside real-time microcontroller cores to address embedded processing needs.

Designed for embedded and industrial applications, the part delivers a mix of compute performance, deterministic control, networking interfaces and on-chip security primitives to simplify system integration and meet industrial temperature requirements.

Key Features

  • Core Architecture & Performance  Dual-core families: ARM® Cortex®‑A53 and ARM® Cortex®‑M7. Core configuration indicated as 8× A53 at 1.3 GHz and 3× M7 at 400 MHz for task-parallel and real-time workloads.
  • Memory Interfaces  Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM to support high-bandwidth application and system memory requirements.
  • Networking & Connectivity  Three 2.5Gbps Ethernet interfaces provide high-speed wired networking; includes a single USB 2.0 OTG port and CANbus support for common embedded communication needs.
  • Security Features  On-chip security primitives including ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for hardware-enforced isolation and secure boot/building blocks.
  • Multimedia Acceleration  DSP/NEON multimedia coprocessor support for accelerated signal and media processing workloads.
  • Package & Mounting  525‑FCPBGA (19×19) surface-mount package (525‑FBGA/FCBGA family) suitable for compact embedded board designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40°C to 105°C and RoHS compliance for broad environmental compatibility.

Typical Applications

  • Industrial Networking & Control  Use the multi‑gigabit Ethernet interfaces and CANbus to implement high-throughput industrial communication nodes and real-time controllers.
  • Secure Embedded Gateways  Combine ARM® Cortex®‑A53 application processing with on-chip security features to implement secure edge routing and protocol translation.
  • Real-Time Control Systems  Leverage ARM® Cortex®‑M7 cores for deterministic control tasks alongside A53 cores for higher-level processing in embedded control platforms.
  • High-Bandwidth Embedded Compute  Support memory-intensive and multimedia workloads using DDR3L/LPDDR4 interfaces and NEON/DSP acceleration.

Unique Advantages

  • Heterogeneous Multi-Core Integration: Combines high-performance Cortex‑A53 application cores with Cortex‑M7 real-time cores for consolidated system design and task partitioning.
  • Built-in Industrial Connectivity: Multiple 2.5Gbps Ethernet ports plus CANbus and USB OTG reduce the need for external networking controllers and simplify BOM.
  • Comprehensive On-Chip Security: Hardware security primitives including TrustZone, cryptography, RNG and secure fusebox enable stronger system-level protection and secure provisioning.
  • Memory Flexibility: Support for DDR3L and LPDDR4 memory technologies allows designers to optimize for cost or bandwidth as required.
  • Designed for Industrial Environments: Industrial qualification and −40°C to 105°C operating range provide robustness for embedded deployments.
  • Compact Surface-Mount Package: 525‑FCPBGA (19×19) packaging supports dense PCB layouts while offering necessary I/O for embedded systems.

Why Choose S32G398AACK1VUCR?

The S32G398AACK1VUCR positions itself as a flexible, integrated microprocessor option for embedded and industrial designs that require a combination of application-level processing, real-time control and secure connectivity. Its heterogeneous mix of ARM® Cortex®‑A53 and Cortex®‑M7 cores, along with multiple 2.5Gbps Ethernet interfaces, CANbus, and on-chip security primitives, streamlines system architecture and reduces external component count.

Engineers targeting industrial networking, secure edge processing or high-bandwidth embedded compute will find the device’s industrial temperature qualification, compact FCPBGA package and memory interface options suited to demanding deployments where performance and integration matter.

Request a quote or contact sales to discuss availability and pricing for S32G398AACK1VUCR and to submit a sourcing inquiry today.

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