S32G398ASCK1VUCT

8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 3 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 1,556 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G398
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G398ASCK1VUCT – 8XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1

The S32G398ASCK1VUCT is a multi-core microprocessor IC in the S32G3 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It combines high-speed 64-bit and 32-bit processing elements with integrated memory controllers and multiple high-speed interfaces.

Targeted at embedded and industrial applications, this device provides on-chip security features, multiple 2.5Gbps Ethernet ports, CANbus support and DDR3L/LPDDR4 memory controllers to address networked, secure and compute-intensive embedded designs. The part is qualified for industrial temperature operation.

Key Features

  • Processor Cores  ARM® Cortex®-A53 and ARM® Cortex®-M7 processor cores; configuration listed as 3 Core, 64-Bit and 8 Core, 32-Bit with clock rates up to 1.3GHz and 400MHz respectively.
  • Co-processors / DSP  Multimedia and NEON support for accelerated signal and media processing.
  • Memory Subsystem  Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM to support high-bandwidth system memory.
  • High-speed Networking  Multiple 2.5Gbps Ethernet interfaces (3) provided for high-throughput connectivity.
  • Peripheral Interfaces  USB 2.0 OTG (1) and CANbus support for common embedded connectivity requirements.
  • Security  Hardware security features including ARM TrustZone, cryptography engines, random number generator, secure fusebox, secure memory and XRDC.
  • Package & Mounting  525-FCPBGA (19×19) package (525-FBGA / FCBGA case), surface mount device.
  • Operating Range & Qualification  Industrial qualification with operating temperature range from −40°C to 105°C and RoHS compliance.
  • Graphics  No dedicated graphics acceleration is provided.

Typical Applications

  • Industrial Networking  Use the integrated 2.5Gbps Ethernet interfaces and industrial temperature rating for high-performance networked equipment in industrial environments.
  • Secure Gateways and Communication Appliances  Built-in security features (TrustZone, cryptography, RNG, secure memory) make the device suitable for secure gateway designs and encrypted communications.
  • Embedded Control Systems  Multi-core ARM processing combined with CANbus and USB interfaces supports embedded control and communication in industrial control platforms.

Unique Advantages

  • Heterogeneous multi-core architecture: Combines ARM Cortex-A53 and Cortex-M7 cores to address both high-performance and real-time processing needs as indicated by the listed core configuration and clock rates.
  • Integrated high-speed connectivity: Three 2.5Gbps Ethernet interfaces provide high-throughput networking capability without external PHY-only dependency noted in the feature set.
  • Comprehensive hardware security: Multiple on-chip security primitives—including TrustZone, cryptography blocks and secure memory—help simplify secure system design.
  • Flexible memory support: DDR3L and LPDDR4 memory controllers enable use of a range of system memory options for varied performance and power trade-offs.
  • Industrial-ready thermal range: Qualified for −40°C to 105°C operation, supporting deployment in demanding temperature environments.
  • Compact BGA package: 525-FCPBGA (19×19) surface-mount package supports high-density board integration.

Why Choose S32G398ASCK1VUCT?

The S32G398ASCK1VUCT positions itself as a robust, multi-core embedded processor combining ARM® Cortex®-A53 and Cortex®-M7 cores with extensive I/O, memory controllers and hardware security features. Its combination of high-speed Ethernet ports, DDR3L/LPDDR4 support and industrial qualification makes it a practical choice for engineers developing networked and secure embedded systems.

This part is suitable for designs requiring integrated connectivity, hardware-enforced security and operation across industrial temperature ranges, offering a scalable platform backed by the documented S32G3 series feature set.

Request a quote or contact sales to discuss availability, pricing and how S32G398ASCK1VUCT can fit into your next embedded or industrial design.

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