S32G379AACK1VUCT

IC MPU S32G3 1.3GZ/400MHZ 525BGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 1,031 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G379
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCN5A992CEthernet2.5Gbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G379AACK1VUCT – IC MPU S32G3 1.3GZ/400MHZ 525BGA

The S32G379AACK1VUCT is a microprocessor IC in the S32G379 series from NXP Semiconductors designed for embedded applications. It integrates ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a 4-core, 32/64-bit configuration with reported operating frequencies of 1.3GHz and 400MHz, targeting compute and real-time control tasks.

Built with industrial qualification and a broad set of interfaces and security features, this device is suited for embedded systems that require heterogeneous processing, secure operation, and robust network connectivity.

Key Features

  • Core and Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a 4-core, 32/64-bit configuration supporting both high-performance and real-time processing.
  • Performance  Dual reported clock domains including a 1.3GHz indication and a 400MHz operating speed for mixed workload handling.
  • Memory Controller  Supports DDR3L SDRAM and LPDDR4 DRAM memory controllers for flexible system memory options.
  • Connectivity  High-speed networking capability listed as 2.5Gbps (3) and USB 2.0 OTG (1); additional interfaces include CANbus for control and communication networks.
  • Security  Hardware security features include ARM TrustZone (ARM TZ), cryptography, a random number generator, a secure fusebox, secure memory, and XRDC to support secure boot and trusted execution models.
  • Package and Mounting  Available in a 525-FCPBGA (19×19) supplier device package (525-FBGA/FCBGA family) and designed for surface mount assembly.
  • Environmental and Qualification  Industrial qualification with an operating temperature range of −40°C to 105°C; RoHS compliant.
  • Graphics  No graphics acceleration.

Typical Applications

  • Industrial Networking and Control  Industrial systems that require robust Ethernet throughput and CANbus connectivity can use this MPU for real-time control and communication tasks.
  • Secure Edge Gateways  Devices that need on-device security and trusted execution can leverage the built-in ARM TZ, cryptography, RNG, and secure memory features to protect data and credentials.
  • Embedded Compute Modules  Embedded platforms requiring heterogeneous processing (application and real-time cores) and flexible DRAM support (DDR3L, LPDDR4) can integrate this MPU for mixed workloads.

Unique Advantages

  • Heterogeneous Processing:  Combines ARM® Cortex®-A53 and Cortex®-M7 cores to address both high-level application processing and deterministic real-time tasks within a single device.
  • Broad Memory Support:  DDR3L and LPDDR4 memory controller support enables designers to choose memory architectures that match performance and power needs.
  • Integrated Security Primitives:  Comprehensive hardware security features (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) reduce the need for external security components.
  • Industrial Readiness:  Industrial qualification and an extended operating temperature range (−40°C to 105°C) support deployment in demanding environments.
  • Compact Board-Level Footprint:  525-FCPBGA (19×19) package enables a high-functionality solution in a compact surface-mount form factor.
  • Standards-Focused Connectivity:  High-speed Ethernet capability and CANbus support make the device suitable for networked embedded systems and communication modules.

Why Choose S32G379AACK1VUCT?

The S32G379AACK1VUCT positions itself as a versatile embedded MPU by combining multi-core ARM® processing, on-chip security, and multiple high-speed interfaces in a single industrial-qualified package. Its support for DDR3L and LPDDR4, together with Ethernet and CANbus connectivity, lets designers address mixed compute and networking requirements without fragmenting the BOM.

Designed and supplied by NXP Semiconductors, this device is intended for embedded system designers seeking a compact, secure, and industrial-grade MPU platform for applications that demand both application-level throughput and real-time control.

Request a quote or submit an inquiry to our sales team to get pricing and availability for the S32G379AACK1VUCT. Include your required quantity and any lead-time or packaging preferences to expedite your request.

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