S32G378ASCK1VUCR

4XA53 - 1.3GHZ, 3XM7 - 400MHZ, 1
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 147 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G378
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G378ASCK1VUCR – ARM Cortex-A53 & Cortex-M7 Microprocessor IC

The S32G378ASCK1VUCR is an embedded microprocessor IC from the S32G378 series featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 core processors. Product data lists a 4-core, 32/64-bit architecture with operating points referenced at 400 MHz and 1.3 GHz.

Designed for industrial embedded applications, the device combines multicore processing, high-speed networking interfaces and on-chip security primitives to support secure, connected edge and control designs requiring industrial-temperature operation.

Key Features

  • Core Architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 core processors with a 4-core, 32/64-bit configuration and listed operating speeds at 400 MHz and 1.3 GHz.
  • Memory Support  Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM to support high-bandwidth system memory configurations.
  • High-Speed Networking  Multiple 2.5 Gbps Ethernet interfaces (2.5Gbps (3) specified) for real-time data and high-throughput network connectivity.
  • Peripheral Interfaces  USB 2.0 OTG support and CANbus connectivity provide standard I/O options for embedded and industrial communication needs.
  • Security Features  Hardware security primitives including ARM TrustZone (ARM TZ), cryptography, a random number generator, secure fusebox, secure memory and XRDC to enable system-level protection and secure boot/operation strategies.
  • Package & Mounting  525-FCPBGA supplier device package (19 × 19 mm) in a 525-FBGA/FCBGA form factor designed for surface-mount assembly.
  • Industrial Qualification & Temperature Range  Qualification: Industrial with an operating temperature range of –40 °C to 105 °C suitable for demanding ambient environments.
  • RoHS Compliance  RoHS status: Compliant.

Typical Applications

  • Industrial Control Systems  Real-time control and coordination in industrial automation leveraging the multicore architecture and industrial temperature rating.
  • Secure Edge Gateways  Edge gateway and protocol-bridging designs that need multi-gigabit Ethernet throughput, CANbus connectivity and on-chip security features.
  • Embedded Communication Nodes  High-performance embedded nodes that require DDR3L/LPDDR4 memory support and USB/CAN interfaces for device connectivity and data exchange.
  • Networked IoT/Edge Compute  Edge compute platforms that combine multicore processing and hardware security to run networked workloads in industrial environments.

Unique Advantages

  • Multicore, heterogeneous processing: Combines ARM® Cortex®-A53 and Cortex®-M7 processors in a 4-core, 32/64-bit configuration to partition application and real-time tasks efficiently.
  • High-bandwidth networking: Multiple 2.5 Gbps Ethernet interfaces provide room for high-throughput data paths and networked industrial communication.
  • Comprehensive hardware security: Built-in ARM TrustZone, cryptography, RNG, secure fusebox and secure memory features support secure boot, trusted execution and data protection strategies.
  • Industrial-grade operation: Industrial qualification and –40 °C to 105 °C operating temperature enable deployment in harsh ambient conditions.
  • Flexible memory options: On-chip support for DDR3L and LPDDR4 memory controllers simplifies system memory design choices for varied performance and power targets.
  • Compact surface-mount package: 525-FCPBGA (19 × 19 mm) package supports high-density PCB designs and automated assembly.

Why Choose S32G378ASCK1VUCR?

The S32G378ASCK1VUCR positions itself as a highly integrated industrial embedded processor that balances multicore compute, robust connectivity and built-in security. Its combination of ARM® Cortex® cores, multi-gigabit Ethernet, CANbus and memory-controller flexibility makes it suitable for designs that require secure, networked edge compute in industrial environments.

For engineers and procurement teams building scalable, long-life embedded systems, this device delivers a clear set of verifiable capabilities—multicore processing, hardware security primitives, industrial temperature rating and compact BGA packaging—backed by the S32G378 series specification set.

If you would like pricing, availability or technical support for S32G378ASCK1VUCR, request a quote or submit a purchase inquiry to receive detailed commercial and supply information.

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