S32G378AACK1VUCR

8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1.3GHz 525-FCPBGA (19x19)

Quantity 893 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G378
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1.3GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G378AACK1VUCR – 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2

The S32G378AACK1VUCR is an NXP Semiconductors microprocessor IC from the S32G378 series that combines ARM® Cortex®-A53 and ARM® Cortex®-M7 processing cores in a multi-core 32/64-bit architecture. The device integrates a range of high-speed interfaces and memory controllers to support complex embedded workloads.

Designed for industrial embedded applications, this device delivers a balance of compute capability, secure hardware features, and robust I/O integration—making it suitable for system-level designs that require networking, control interfaces, and industrial-grade operating temperature support.

Key Features

  • Cores & Performance — ARM® Cortex®-A53 and ARM® Cortex®-M7 core processors with a 4-core, 32/64-bit configuration and listed speed of 400 MHz for responsive embedded processing.
  • Memory Support — Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM to support a range of system memory configurations and performance profiles.
  • High-Speed Networking — Multiple 2.5 Gbps Ethernet ports (3) for high-throughput network connectivity and system-level data transfer.
  • Peripheral Interfaces — Includes USB 2.0 OTG support and additional CANbus interfaces for peripheral connectivity and control-network integration.
  • Security & Protection — Hardware security capabilities including ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for access control and trusted execution.
  • Package & Mounting — Supplied in a 525-FCPBGA (19×19) surface-mount package suitable for compact system boards and automated assembly.
  • Industrial Qualification & Temperature Range — Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in industrial environments.
  • RoHS Compliance — Device is RoHS compliant.

Typical Applications

  • Industrial Embedded Control — Use in industrial control systems where multi-core processing and industrial temperature operation are required for reliable control and monitoring.
  • Networked Gateways and Communications — High-speed Ethernet ports enable implementation of data aggregation, protocol translation, and secure gateway functions.
  • CANbus-Based Control Networks — CANbus interfaces support integration with control and sensor networks in equipment and distributed systems.
  • Secure Edge Processing — On-chip security features allow secure local processing and protected storage for edge compute nodes and critical control logic.

Unique Advantages

  • Multi-core processing flexibility: Combines ARM Cortex-A53 and Cortex-M7 cores in a 4-core, 32/64-bit configuration to balance application and real-time workloads on a single device.
  • Robust networking throughput: Three 2.5 Gbps Ethernet ports provide high-bandwidth connectivity for networking-intensive embedded applications.
  • Comprehensive hardware security: Multiple built-in security primitives (TrustZone, cryptography, RNG, secure fusebox, secure memory, XRDC) reduce the need for external security components.
  • Flexible memory interfaces: Support for DDR3L and LPDDR4 memory enables designers to choose memory types that match performance and power goals.
  • Industrial-grade operation: Qualification for industrial use and an operating range of −40 °C to 105 °C support deployment in harsh environments.
  • Compact, production-ready package: 525-FCPBGA (19×19) surface-mount packaging facilitates automated assembly and space-constrained board designs.

Why Choose S32G378AACK1VUCR?

The S32G378AACK1VUCR positions itself as a highly integrated microprocessor IC for industrial embedded designs that require a mix of application-level and real-time compute, extensive networking, and strong hardware security. Its combination of ARM® Cortex® cores, multiple high-speed Ethernet ports, flexible memory interfaces, and industrial temperature qualification make it suitable for gateway, control, and secure edge applications.

For teams building systems that demand integration, predictable thermal performance, and a comprehensive set of on-chip security and connectivity features, this NXP S32G378 series device offers a compact hardware foundation that supports scalable embedded solutions.

Request a quote or submit an inquiry to receive pricing and availability for the S32G378AACK1VUCR and to begin evaluation for your design needs.

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