S32G274ASBK0VUCT

S32G274A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 630 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G274
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G274ASBK0VUCT – ARM Cortex-A53 and Cortex-M7 Microprocessor

The S32G274ASBK0VUCT from NXP Semiconductors is a heterogeneous microprocessor combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. The device is described in the product data as "3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz" and the specifications list an operating speed of 400 MHz.

Engineered for automotive-grade and embedded networking applications, the device integrates multi-core processing, multiple GbE interfaces, memory controllers for DDR3L and LPDDR4, and a comprehensive set of security features, making it suitable for designs that require integration, connectivity, and AEC-Q100 qualification.

Key Features

  • Processing Cores  ARM® Cortex®-A53 (64-bit) and ARM® Cortex®-M7 (32-bit) architectures are combined in a multi-core configuration described as "3 Core, 64-Bit/4 Core, 32-Bit"; operating speed indicated as 400 MHz in specifications.
  • Memory Controllers  Integrated controllers for DDR3L and LPDDR4 memory types to support system memory requirements.
  • High-Speed Networking  Four Gigabit Ethernet (GbE) interfaces enable robust wired networking and in-vehicle or embedded networking topologies.
  • Connectivity  Includes USB 2.0 OTG (1) and DMA for peripheral connectivity and efficient data movement.
  • Security  Built-in security features include ARM TrustZone (TZ), cryptography, a random number generator, secure fusebox, secure memory, and XRDC to address secure boot and runtime protection needs.
  • Automotive Qualification  Grade: Automotive with AEC-Q100 qualification indicated in the product data.
  • Package & Mounting  Supplied in a 525-FCPBGA (19×19) package (525-FBGA / FCBGA family); surface-mount device.
  • Thermal Range  Operating temperature range from -40 °C to 105 °C to support extended-temperature embedded environments.
  • Graphics  No graphics acceleration included.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Automotive networking and gateway systems  Multiple GbE interfaces and automotive AEC-Q100 qualification support secure, high-bandwidth in-vehicle networking and gateway functions.
  • Secure telematics and connectivity modules  Integrated security features (TrustZone, cryptography, RNG, secure memory) enable secure data handling and communication for telematics and connected services.
  • Industrial and embedded control  Heterogeneous cores and DDR3L/LPDDR4 memory support deterministic control tasks alongside application-level processing in industrial embedded systems.
  • Edge network appliances  Ethernet-rich I/O and DMA support for data plane processing and protocol handling at the network edge.

Unique Advantages

  • Heterogeneous processing: Combines 64-bit Cortex-A53 and 32-bit Cortex-M7 cores to partition application and real-time workloads efficiently.
  • Integrated networking interfaces: Four GbE ports provide built-in high-speed wired connectivity, reducing external PHY/count requirements.
  • Comprehensive security toolkit: On-chip TrustZone, cryptography, RNG, secure fusebox and secure memory deliver layered protection for sensitive applications.
  • Automotive-grade qualification: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive and harsh environments.
  • Memory flexibility: Support for DDR3L and LPDDR4 memory controllers enables designers to choose memory technologies to match performance and cost targets.
  • Surface-mount BGA package: 525-FCPBGA (19×19) package provides a compact, industry-standard footprint for high-density board designs.

Why Choose S32G274ASBK0VUCT?

The S32G274ASBK0VUCT positions itself as an integrated microprocessor solution for designs that require mixed application and real-time processing, robust networking, and built-in security. Its combination of ARM® Cortex® cores, multiple GbE interfaces, and dedicated security features addresses the needs of embedded and automotive networking systems.

Backed by NXP Semiconductors and offered in an AEC-Q100-qualified automotive grade, the device suits customers building systems that demand temperature resilience, hardware security, and consolidated connectivity, helping reduce component count and simplify system architecture.

Request a quote or contact sales for pricing and availability of the S32G274ASBK0VUCT.

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