S32G274AABK1VUCT

IC MPU AEC-Q100 1GHZ 525FCPBGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 1,056 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G274
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G274AABK1VUCT – ARM® Cortex®-A53 / Cortex®-M7 Microprocessor IC

The S32G274AABK1VUCT is a microprocessor IC in the S32G274 series from NXP Semiconductors that integrates ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It combines multi-core application processing and real-time control in a single device, with documented core counts and frequencies for mixed 64-bit and 32-bit workloads.

Designed for embedded and automotive systems, the device offers multi-gigabit Ethernet connectivity, hardware security features, and support for DDR3L and LPDDR4 memory, delivered in a 525-FCPBGA (19×19) surface-mount package and qualified to AEC-Q100.

Key Features

  • Core architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 cores; described as 3 Core, 64-Bit and 4 Core, 32-Bit configurations with listed clock points at 1 GHz and 400 MHz.
  • Memory interfaces  Integrated controllers for DDR3L and LPDDR4 memory to support system memory configurations.
  • Ethernet connectivity  Four Ethernet interfaces documented as 1/2.5 Gbps (4), enabling multiple high-speed network links.
  • USB  One USB 2.0 OTG interface for peripheral and host connectivity.
  • Security features  Hardware security suite including ARM TrustZone, cryptography, random number generator, secure fusebox, secure memory, and XRDC.
  • Package and mounting  525-FCPBGA supplier package (19×19) in a surface-mount format.
  • Operating range and qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of -40 °C to 105 °C.
  • Additional interfaces  DMA available; the device lists no graphics acceleration.
  • RoHS compliance  Device is RoHS compliant.

Typical Applications

  • Automotive networking and gateways  Supports multiple 1/2.5 Gbps Ethernet links and hardware security, suitable for in-vehicle communication and gateway functions.
  • Embedded control and real-time processing  Combined Cortex-A53 and Cortex-M7 cores provide application and real-time control domains in a single device.
  • Secure connected systems  On-chip cryptography, RNG and secure memory enable secure boot and trusted execution environments for connected embedded applications.

Unique Advantages

  • Heterogeneous multi-core processing: Combines 64-bit and 32-bit cores at documented frequencies to consolidate application and real-time workloads.
  • Multi-port Ethernet support: Four 1/2.5 Gbps Ethernet interfaces enable robust networked system architectures and multiple link endpoints.
  • Automotive qualification and extended temperature: AEC-Q100 qualification and -40 °C to 105 °C operating range provide suitability for automotive-grade deployments.
  • Comprehensive hardware security: TrustZone, cryptography, RNG, secure fusebox and secure memory support system-level security requirements.
  • Flexible memory support: DDR3L and LPDDR4 memory controllers allow designers to select appropriate system memory options.
  • Compact surface-mount package: 525-FCPBGA (19×19) package supports high-density board designs.

Why Choose S32G274AABK1VUCT?

The S32G274AABK1VUCT positions itself as a multi-domain microprocessor IC that balances application-level performance and real-time control through its combined ARM® Cortex®-A53 and Cortex®-M7 cores. Its integrated Ethernet, memory controllers, and hardware security features make it suitable for embedded and automotive systems that require networking, security, and mixed-signal control in a single device.

Backed by NXP Semiconductors and delivered in a 525-FCPBGA (19×19) surface-mount package with AEC-Q100 qualification and a -40 °C to 105 °C operating range, this device is aimed at designers seeking a qualified, integrated processing platform for automotive and embedded applications where multi-core processing, secure operations, and multi-gigabit networking are required.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the S32G274AABK1VUCT.

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