S32G274ASBK1VUCR

S32G274A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 1,322 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G274
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G274ASBK1VUCR – ARM Cortex‑A53 and ARM Cortex‑M7 Microprocessor

The S32G274ASBK1VUCR is a multi‑core microprocessor IC featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores, designed for embedded applications. The device combines 64‑bit and 32‑bit processing elements with on‑chip multimedia DSP/NEON capabilities and multiple memory controller options to address performance and integration needs in embedded and automotive-grade systems.

Targeted for embedded and automotive use, the device provides integrated interfaces, hardware security primitives and an extended operating temperature range to support robust in‑vehicle and industrial deployments.

Key Features

  • Core configuration  ARM® Cortex®‑A53 and ARM® Cortex®‑M7 core processors; product data lists "3 Core, 64‑Bit/4 Core, 32‑Bit" as the core/bus configuration.
  • Clock speeds  Speed entries in product data include 400 MHz and 1 GHz.
  • Memory controllers  Integrated controllers for DDR3L and LPDDR4 memory types to support system memory requirements.
  • Connectivity  Ethernet capability listed as "1/2.5Gbps (4)" and USB 2.0 OTG (1) for networked and peripheral connectivity.
  • Security  Hardware security features include ARM TrustZone (ARM TZ), cryptography, random number generator, secure fusebox, secure memory and XRDC.
  • Co‑processing  Multimedia and NEON DSP co‑processor capabilities for accelerating signal and media tasks.
  • Interfaces and system  Additional interfaces include DMA; graphics acceleration is listed as "No."
  • Package & mounting  Supplied in a 525‑FCPBGA (19×19) FCBGA package, surface mount.
  • Automotive grade & qualification  Grade listed as Automotive with qualification AEC‑Q100.
  • Operating range  Operating temperature specified as −40 °C to 105 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • Automotive embedded systems  Use in automotive designs that require AEC‑Q100 qualification, multi‑core processing and integrated security features.
  • Networked embedded controllers  Leverage multiple Ethernet ports and USB OTG for connected control and gateway applications in embedded environments.
  • Secure control and monitoring  Built‑in cryptography, secure memory and TrustZone support secure boot and runtime isolation for safety‑aware systems.

Unique Advantages

  • Multi‑architecture processing: Combines ARM Cortex‑A53 and Cortex‑M7 cores to address mixed 64‑bit and 32‑bit workload requirements as listed in the product data.
  • Integrated memory support: On‑chip DDR3L and LPDDR4 controllers reduce external memory design complexity.
  • Broad connectivity set: Multiple Ethernet speeds and USB OTG provide flexible options for networked and peripheral interfaces.
  • Hardware security primitives: Built‑in cryptography, random number generator, secure fusebox and secure memory support system security requirements.
  • Automotive qualification: AEC‑Q100 qualification and an extended −40 °C to 105 °C operating range enable use in automotive environments.
  • Compliance and manufacturability: RoHS compliance and a standard 525‑FCPBGA package support production deployment and assembly processes.

Why Choose S32G274ASBK1VUCR?

The S32G274ASBK1VUCR positions itself as a robust, automotive‑grade microprocessor option for embedded systems that require a mix of 64‑bit and 32‑bit processing, integrated memory controllers, hardware security, and multi‑port connectivity. Its listed AEC‑Q100 qualification and extended temperature range make it suitable for environments demanding reliability and thermal tolerance.

This device is appropriate for engineers designing secure, connected embedded and automotive systems that benefit from integrated security features, multimedia co‑processing and flexible memory interface options as specified in the product data.

Request a quote or contact sales to obtain pricing, availability and assistance integrating the S32G274ASBK1VUCR into your next design.

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