S32G274ASBK0VUCR
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 326 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G274 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GbE (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit/4 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1GHz | Supplier Device Package | 525-FCPBGA (19×19) | ||
| USB | USB 2.0 OTG (1) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G274ASBK0VUCR – ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)
The S32G274ASBK0VUCR is a multicore microprocessor IC that integrates ARM® Cortex®-A53 and ARM® Cortex®-M7 architectures. It is supplied in a 525-FCPBGA (19×19) package and is offered for embedded applications requiring a combination of 64-bit and 32-bit processing.
Designed with automotive-grade qualification (AEC-Q100) and a broad operating temperature range, the device targets embedded and automotive system designs that require multi-core processing, high-speed memory interfaces, and multiple Gigabit Ethernet ports.
Key Features
- Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores are integrated on a single device to support mixed 64-bit and 32-bit processing workflows.
- Core Count and Bus Width Implemented as 3 Core, 64-Bit and 4 Core, 32-Bit configurations to enable partitioned workloads across application and real-time domains.
- Performance Frequency points listed at 400 MHz and 1 GHz to address varying performance and control requirements.
- Memory Support Integrated memory controllers supporting DDR3L and LPDDR4 to accommodate high-bandwidth system memory implementations.
- Networking Four Gigabit Ethernet (GbE) ports provide multiple high-speed network interfaces for connectivity and data aggregation.
- USB Single USB 2.0 OTG interface for peripheral connectivity and host/device flexibility.
- Security On-chip security features include ARM TrustZone (TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC to support secure system partitioning and cryptographic functions.
- Peripherals and DMA Additional interfaces include DMA support and multimedia/NEON co-processor capability for enhanced data handling and signal processing acceleration.
- Packaging and Mounting Supplied in a 525-FBGA (FCBGA) surface-mount package (525-FCPBGA, 19×19) suitable for compact embedded board designs.
- Automotive Qualification & Temperature Range AEC-Q100 qualification and an operating temperature range of −40 °C to 105 °C for deployment in temperature-demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Automotive Embedded Systems Suited for automotive designs that require AEC-Q100 qualification and multiple GbE interfaces for vehicle networking and data exchange.
- Networked Embedded Controllers Multiport GbE and integrated memory controllers make the device applicable for embedded controllers that handle high-throughput networking tasks.
- Secure Edge Processing On-chip security features support applications that require secure boot, secure storage, and cryptographic services within embedded or automotive domains.
Unique Advantages
- Multicore Flexibility: Mixed 64-bit and 32-bit core configurations allow separation of application and real-time workloads on a single device, simplifying system partitioning.
- Integrated Networking: Four GbE ports enable high-density networking without the need for additional external switch silicon, reducing BOM and board complexity.
- Broad Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory technologies that match bandwidth and power targets.
- Comprehensive Security: A suite of hardware security features (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) assists in implementing secure system architectures.
- Automotive-Ready Qualification: AEC-Q100 qualification and −40 °C to 105 °C operating range provide traceable suitability for temperature-demanding and industry-regulated environments.
- Compact System Integration: 525-FCPBGA (19×19) surface-mount packaging supports compact board layouts for space-constrained embedded systems.
Why Choose S32G274ASBK0VUCR?
The S32G274ASBK0VUCR positions itself as an integrated multicore solution for embedded and automotive designs that need a blend of 64-bit application processing and 32-bit real-time control. With multiple Gigabit Ethernet ports, modern memory controller support, and a comprehensive set of hardware security features, it simplifies system design for connected, security-conscious applications.
Its AEC-Q100 qualification, RoHS compliance, and wide operating temperature range deliver reliability and supply-chain compatibility for long-term automotive and industrial deployments. The combination of cores, connectivity, and security features makes this device appropriate for engineers targeting scalable, robust embedded platforms.
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Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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