S32G274ASBK0VUCR

S32G274A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 326 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G274
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G274ASBK0VUCR – ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

The S32G274ASBK0VUCR is a multicore microprocessor IC that integrates ARM® Cortex®-A53 and ARM® Cortex®-M7 architectures. It is supplied in a 525-FCPBGA (19×19) package and is offered for embedded applications requiring a combination of 64-bit and 32-bit processing.

Designed with automotive-grade qualification (AEC-Q100) and a broad operating temperature range, the device targets embedded and automotive system designs that require multi-core processing, high-speed memory interfaces, and multiple Gigabit Ethernet ports.

Key Features

  • Core Architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores are integrated on a single device to support mixed 64-bit and 32-bit processing workflows.
  • Core Count and Bus Width Implemented as 3 Core, 64-Bit and 4 Core, 32-Bit configurations to enable partitioned workloads across application and real-time domains.
  • Performance Frequency points listed at 400 MHz and 1 GHz to address varying performance and control requirements.
  • Memory Support Integrated memory controllers supporting DDR3L and LPDDR4 to accommodate high-bandwidth system memory implementations.
  • Networking Four Gigabit Ethernet (GbE) ports provide multiple high-speed network interfaces for connectivity and data aggregation.
  • USB Single USB 2.0 OTG interface for peripheral connectivity and host/device flexibility.
  • Security On-chip security features include ARM TrustZone (TZ), cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC to support secure system partitioning and cryptographic functions.
  • Peripherals and DMA Additional interfaces include DMA support and multimedia/NEON co-processor capability for enhanced data handling and signal processing acceleration.
  • Packaging and Mounting Supplied in a 525-FBGA (FCBGA) surface-mount package (525-FCPBGA, 19×19) suitable for compact embedded board designs.
  • Automotive Qualification & Temperature Range AEC-Q100 qualification and an operating temperature range of −40 °C to 105 °C for deployment in temperature-demanding environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Automotive Embedded Systems Suited for automotive designs that require AEC-Q100 qualification and multiple GbE interfaces for vehicle networking and data exchange.
  • Networked Embedded Controllers Multiport GbE and integrated memory controllers make the device applicable for embedded controllers that handle high-throughput networking tasks.
  • Secure Edge Processing On-chip security features support applications that require secure boot, secure storage, and cryptographic services within embedded or automotive domains.

Unique Advantages

  • Multicore Flexibility: Mixed 64-bit and 32-bit core configurations allow separation of application and real-time workloads on a single device, simplifying system partitioning.
  • Integrated Networking: Four GbE ports enable high-density networking without the need for additional external switch silicon, reducing BOM and board complexity.
  • Broad Memory Support: DDR3L and LPDDR4 controller support enables designers to choose memory technologies that match bandwidth and power targets.
  • Comprehensive Security: A suite of hardware security features (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) assists in implementing secure system architectures.
  • Automotive-Ready Qualification: AEC-Q100 qualification and −40 °C to 105 °C operating range provide traceable suitability for temperature-demanding and industry-regulated environments.
  • Compact System Integration: 525-FCPBGA (19×19) surface-mount packaging supports compact board layouts for space-constrained embedded systems.

Why Choose S32G274ASBK0VUCR?

The S32G274ASBK0VUCR positions itself as an integrated multicore solution for embedded and automotive designs that need a blend of 64-bit application processing and 32-bit real-time control. With multiple Gigabit Ethernet ports, modern memory controller support, and a comprehensive set of hardware security features, it simplifies system design for connected, security-conscious applications.

Its AEC-Q100 qualification, RoHS compliance, and wide operating temperature range deliver reliability and supply-chain compatibility for long-term automotive and industrial deployments. The combination of cores, connectivity, and security features makes this device appropriate for engineers targeting scalable, robust embedded platforms.

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