S32G274AABK0VUCR

S32G274A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/4 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 916 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G274
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/4 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G274AABK0VUCR – ARM Cortex‑A53 and Cortex‑M7 Multi‑Core Microprocessor

The S32G274AABK0VUCR is a multi‑core microprocessor from NXP Semiconductors combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores in a single device. The product data lists both 64‑bit and 32‑bit core clusters and core operating points of 1 GHz and 400 MHz.

With integrated memory controllers, multiple Gigabit Ethernet ports and on‑chip security features, this device is presented for embedded and automotive applications where connectivity, partitioned processing and qualified robustness are required.

Key Features

  • Core Architecture — Combines ARM® Cortex®‑A53 (64‑bit) and ARM® Cortex®‑M7 (32‑bit) cores with a listed core count of 3 cores (64‑bit) and 4 cores (32‑bit).
  • Core Operating Points — Core speeds in the product data include 1 GHz and 400 MHz as provided for this part.
  • Memory Support — Integrated controllers for DDR3L and LPDDR4 memory technologies to support system memory requirements.
  • High‑Speed Networking — Four Gigabit Ethernet (GbE) interfaces for multi‑port network connectivity.
  • USB Connectivity — One USB 2.0 OTG interface for peripheral and host connectivity.
  • Security and Isolation — On‑chip security features include ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for resource domain control.
  • Peripherals and System Interfaces — Additional interfaces include DMA for efficient data movement between peripherals and memory.
  • Automotive Qualification and Temperature Range — Device grade is listed as Automotive with AEC‑Q100 qualification and an operating temperature range of -40 °C to 105 °C.
  • Package and Mounting — Available in a 525‑FCPBGA (19×19) / 525‑FBGA FCBGA package intended for surface‑mount assembly.
  • Standards Compliance — RoHS status is listed as compliant.

Typical Applications

  • Automotive networking and gateway systems — Multiple GbE ports and listed AEC‑Q100 qualification make the device suitable for in‑vehicle networking and gateway functions in automotive environments.
  • Secure connected edge devices — On‑chip cryptography, TrustZone and secure memory features support secure edge use cases that require data protection and partitioning.
  • Real‑time control and sensor aggregation — The combination of Cortex‑M7 and Cortex‑A53 cores supports mixed‑criticality designs where real‑time control and higher‑level processing coexist.

Unique Advantages

  • Heterogeneous multi‑core architecture: Coexistence of 64‑bit and 32‑bit cores enables partitioned workloads for application processing and real‑time control.
  • Integrated networking interfaces: Four GbE ports provide native multi‑port connectivity without requiring extensive external PHY logic.
  • Comprehensive on‑chip security: Multiple hardware security primitives (TrustZone, crypto, RNG, secure fusebox, secure memory, XRDC) support secure system design and trusted boot/operation strategies.
  • Automotive‑grade qualification: AEC‑Q100 qualification and a wide operating temperature range support deployments in automotive and harsh environments.
  • Flexible memory options: Support for DDR3L and LPDDR4 memory controllers enables designers to choose appropriate memory technologies for performance and cost targets.
  • Compact BGA packaging: 525‑FCPBGA (19×19) package provides a high‑density, surface‑mount solution for space‑constrained boards.

Why Choose S32G274AABK0VUCR?

The S32G274AABK0VUCR positions itself as an integrated solution for embedded and automotive systems that require mixed‑criticality processing, multi‑port networking and hardware‑level security. Its combination of Cortex‑A53 and Cortex‑M7 cores, multiple GbE interfaces, and memory controller flexibility target designs that combine application processing with real‑time control.

Backed by NXP Semiconductors and offered in an AEC‑Q100 qualified grade with a wide operating temperature range, the part addresses design longevity and environmental robustness for demanding deployments.

Request a quote or submit a product inquiry to obtain pricing, availability and support information for S32G274AABK0VUCR.

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