S32G254ASBK1VUCR

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 703 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time21 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254ASBK1VUCR – ARM Cortex-A53 and -M7 Microprocessor

The S32G254ASBK1VUCR is a microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores, designed for embedded applications with automotive-grade qualification. It combines a mixed core architecture with integrated memory controllers, multi-gigabit Ethernet connectivity and on-chip security features to support robust embedded system designs.

Key Features

  • Core architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores with a listed core configuration of "3 Core, 64-Bit/2 Core, 32-Bit" and a specified speed of 400 MHz.
  • Memory support Integrated RAM controllers for DDR3L and LPDDR4 to interface with common high-performance memory types.
  • High-speed networking Four Ethernet ports supporting 1/2.5 Gbps to enable multi-link Ethernet connectivity for networked embedded systems.
  • USB and DMA USB 2.0 OTG (1) and DMA for peripheral connectivity and efficient data movement.
  • Security On-chip security features including ARM TrustZone (TZ), cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for hardware-enforced resource partitioning.
  • Co-processing Multimedia and NEON co-processor support for accelerated signal and multimedia processing tasks.
  • Package and mounting Supplied in a 525-FCPBGA (19×19) package; package cases listed as 525-FBGA and FCBGA and designed for surface-mount assembly.
  • Automotive qualification Grade: Automotive with AEC-Q100 qualification for designs requiring automotive-grade components.
  • Operating range Rated for an operating temperature range of -40 °C to 105 °C for deployment in demanding environments.

Typical Applications

  • Automotive control systems Automotive-grade qualification and the operating temperature range make this device suitable for embedded control modules in automotive environments.
  • In-vehicle networking and gateways Multiple 1/2.5 Gbps Ethernet ports enable use in Ethernet-based vehicle networks and gateway functions.
  • Secure embedded platforms Comprehensive on-chip security primitives support designs that require hardware-backed isolation and cryptographic services.
  • Mixed 64-/32-bit processing The combined 64-bit and 32-bit core configuration supports heterogeneous processing workloads within a single device.

Unique Advantages

  • Heterogeneous core mix: Combines ARM Cortex-A53 and Cortex-M7 cores in one device to address both application-level and real-time processing needs.
  • Integrated high-speed connectivity: Four Ethernet ports at 1/2.5 Gbps and USB 2.0 OTG reduce external component count for networked systems.
  • Hardware security suite: Built-in TrustZone, cryptography, RNG, secure fusebox and secure memory provide multiple layers of security for protected execution and data.
  • Memory flexibility: DDR3L and LPDDR4 memory controller support facilitates selection of memory types to match performance and power requirements.
  • Automotive-ready qualification: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive-grade designs.

Why Choose S32G254ASBK1VUCR?

The S32G254ASBK1VUCR positions itself as a highly integrated embedded microprocessor combining mixed 64-bit and 32-bit cores, multi-gigabit Ethernet connectivity, flexible memory interfaces and a broad set of hardware security features. Its automotive grade and AEC-Q100 qualification, together with an extended -40 °C to 105 °C operating range, make it suitable for demanding automotive and industrial embedded systems.

This device is suited for designers seeking a single-chip platform that addresses networking, secure processing and mixed-criticality workloads while reducing external components. Its integration and qualification support longer-term design stability and supply-chain consistency for production deployments.

Request a quote or contact sales to check availability, pricing and support for integrating the S32G254ASBK1VUCR into your next embedded design.

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