S32G254ASBK1VUCR
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 703 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G254 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 21 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 1/2.5Gbps (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit/2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | Unknown | ||
| Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1GHz | Supplier Device Package | 525-FCPBGA (19×19) | ||
| USB | USB 2.0 OTG (1) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G254ASBK1VUCR – ARM Cortex-A53 and -M7 Microprocessor
The S32G254ASBK1VUCR is a microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores, designed for embedded applications with automotive-grade qualification. It combines a mixed core architecture with integrated memory controllers, multi-gigabit Ethernet connectivity and on-chip security features to support robust embedded system designs.
Key Features
- Core architecture ARM® Cortex®-A53 and ARM® Cortex®-M7 cores with a listed core configuration of "3 Core, 64-Bit/2 Core, 32-Bit" and a specified speed of 400 MHz.
- Memory support Integrated RAM controllers for DDR3L and LPDDR4 to interface with common high-performance memory types.
- High-speed networking Four Ethernet ports supporting 1/2.5 Gbps to enable multi-link Ethernet connectivity for networked embedded systems.
- USB and DMA USB 2.0 OTG (1) and DMA for peripheral connectivity and efficient data movement.
- Security On-chip security features including ARM TrustZone (TZ), cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for hardware-enforced resource partitioning.
- Co-processing Multimedia and NEON co-processor support for accelerated signal and multimedia processing tasks.
- Package and mounting Supplied in a 525-FCPBGA (19×19) package; package cases listed as 525-FBGA and FCBGA and designed for surface-mount assembly.
- Automotive qualification Grade: Automotive with AEC-Q100 qualification for designs requiring automotive-grade components.
- Operating range Rated for an operating temperature range of -40 °C to 105 °C for deployment in demanding environments.
Typical Applications
- Automotive control systems Automotive-grade qualification and the operating temperature range make this device suitable for embedded control modules in automotive environments.
- In-vehicle networking and gateways Multiple 1/2.5 Gbps Ethernet ports enable use in Ethernet-based vehicle networks and gateway functions.
- Secure embedded platforms Comprehensive on-chip security primitives support designs that require hardware-backed isolation and cryptographic services.
- Mixed 64-/32-bit processing The combined 64-bit and 32-bit core configuration supports heterogeneous processing workloads within a single device.
Unique Advantages
- Heterogeneous core mix: Combines ARM Cortex-A53 and Cortex-M7 cores in one device to address both application-level and real-time processing needs.
- Integrated high-speed connectivity: Four Ethernet ports at 1/2.5 Gbps and USB 2.0 OTG reduce external component count for networked systems.
- Hardware security suite: Built-in TrustZone, cryptography, RNG, secure fusebox and secure memory provide multiple layers of security for protected execution and data.
- Memory flexibility: DDR3L and LPDDR4 memory controller support facilitates selection of memory types to match performance and power requirements.
- Automotive-ready qualification: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive-grade designs.
Why Choose S32G254ASBK1VUCR?
The S32G254ASBK1VUCR positions itself as a highly integrated embedded microprocessor combining mixed 64-bit and 32-bit cores, multi-gigabit Ethernet connectivity, flexible memory interfaces and a broad set of hardware security features. Its automotive grade and AEC-Q100 qualification, together with an extended -40 °C to 105 °C operating range, make it suitable for demanding automotive and industrial embedded systems.
This device is suited for designers seeking a single-chip platform that addresses networking, secure processing and mixed-criticality workloads while reducing external components. Its integration and qualification support longer-term design stability and supply-chain consistency for production deployments.
Request a quote or contact sales to check availability, pricing and support for integrating the S32G254ASBK1VUCR into your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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