S32G254AABK1VUCT
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 19 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G254 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 1/2.5Gbps (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit/2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | Unknown | ||
| Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1GHz | Supplier Device Package | 525-FCPBGA (19×19) | ||
| USB | USB 2.0 OTG (1) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G254AABK1VUCT – ARM Cortex-A53 and Cortex-M7 Microprocessor IC
The S32G254AABK1VUCT from NXP Semiconductors is a multi-core microprocessor IC combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a single embedded device. It targets embedded and automotive applications that require multi-core processing, high-speed networking, and integrated security.
This device provides a combination of 64-bit and 32-bit cores, on-chip multimedia acceleration elements, multiple high-speed Ethernet interfaces, and hardware security features, all supplied in a 525-FCPBGA (19×19) surface-mount package qualified to AEC-Q100.
Key Features
- Core architecture and performance ARM® Cortex®-A53 and ARM® Cortex®-M7 core processors with a multi-core configuration listed as "3 Core, 64-Bit / 2 Core, 32-Bit" and documented clocking including 400 MHz and 1 GHz values.
- Memory controllers Integrated support for DDR3L and LPDDR4 memory controllers to accommodate a range of system memory requirements.
- High-speed networking Four Ethernet interfaces capable of 1/2.5 Gbps operation (4), enabling multi-port, high-throughput network connectivity.
- Peripheral interfaces USB 2.0 OTG (1) and DMA support for flexible peripheral connectivity and efficient data movement.
- Security features On-chip ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for hardware-enforced security domains.
- Package and mounting Available in a 525-FCPBGA (19×19) / 525-FBGA package for surface-mount applications.
- Automotive qualification and environmental range AEC-Q100 qualification and an operating temperature range of −40 °C to 105 °C support deployment in automotive-grade embedded systems.
- Co-processors and acceleration Multimedia and NEON co-processor capability for vector and media processing tasks.
- Regulatory compliance RoHS compliant.
Typical Applications
- Automotive networking and gateways — Multi-port 1/2.5 Gbps Ethernet interfaces and AEC-Q100 qualification make the device suitable for in-vehicle network processing and gateway functions.
- Secure edge compute — Multi-core ARM® Cortex® processors combined with hardware security features support secure localized processing and encrypted communications.
- Embedded connectivity platforms — DDR3L/LPDDR4 memory support, DMA and USB OTG enable robust connectivity and data handling in embedded systems.
- Industrial and harsh-environment systems — Operating range from −40 °C to 105 °C and automotive-grade qualification allow deployment in temperature-challenging environments.
Unique Advantages
- Multi-core heterogeneous architecture: Combines 64-bit and 32-bit ARM cores in one device to address diverse processing tasks without additional host processors.
- Integrated high-speed network I/O: Four Ethernet interfaces at 1/2.5 Gbps help consolidate networking functions and reduce external PHY count.
- Comprehensive hardware security: ARM TrustZone, cryptography, RNG, secure fusebox, secure memory and XRDC provide layered security mechanisms for protected systems.
- Automotive-grade qualification: AEC-Q100 qualification and a wide operating temperature range support reliable deployment in automotive and demanding embedded applications.
- Flexible memory options: Support for DDR3L and LPDDR4 memory types enables design flexibility for performance and power trade-offs.
- Compact surface-mount packaging: 525-FCPBGA (19×19) package provides a high-density solution for space-constrained boards.
Why Choose S32G254AABK1VUCT?
The S32G254AABK1VUCT positions itself as a multi-core, security-capable microprocessor for embedded and automotive designs that require integrated networking, memory flexibility, and hardware-enforced security. Its combination of ARM® Cortex®-A53 and Cortex®-M7 cores, multiple Ethernet ports, and a broad operating temperature range make it suitable for systems demanding both compute and connectivity.
Backed by NXP Semiconductors and AEC-Q100 qualification, this device offers an integrated platform approach that can simplify BOM, consolidate functions, and support long-term deployment in automotive and industrial environments.
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Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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