S32G254AABK1VUCT

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 19 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254AABK1VUCT – ARM Cortex-A53 and Cortex-M7 Microprocessor IC

The S32G254AABK1VUCT from NXP Semiconductors is a multi-core microprocessor IC combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a single embedded device. It targets embedded and automotive applications that require multi-core processing, high-speed networking, and integrated security.

This device provides a combination of 64-bit and 32-bit cores, on-chip multimedia acceleration elements, multiple high-speed Ethernet interfaces, and hardware security features, all supplied in a 525-FCPBGA (19×19) surface-mount package qualified to AEC-Q100.

Key Features

  • Core architecture and performance ARM® Cortex®-A53 and ARM® Cortex®-M7 core processors with a multi-core configuration listed as "3 Core, 64-Bit / 2 Core, 32-Bit" and documented clocking including 400 MHz and 1 GHz values.
  • Memory controllers Integrated support for DDR3L and LPDDR4 memory controllers to accommodate a range of system memory requirements.
  • High-speed networking Four Ethernet interfaces capable of 1/2.5 Gbps operation (4), enabling multi-port, high-throughput network connectivity.
  • Peripheral interfaces USB 2.0 OTG (1) and DMA support for flexible peripheral connectivity and efficient data movement.
  • Security features On-chip ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for hardware-enforced security domains.
  • Package and mounting Available in a 525-FCPBGA (19×19) / 525-FBGA package for surface-mount applications.
  • Automotive qualification and environmental range AEC-Q100 qualification and an operating temperature range of −40 °C to 105 °C support deployment in automotive-grade embedded systems.
  • Co-processors and acceleration Multimedia and NEON co-processor capability for vector and media processing tasks.
  • Regulatory compliance RoHS compliant.

Typical Applications

  • Automotive networking and gateways — Multi-port 1/2.5 Gbps Ethernet interfaces and AEC-Q100 qualification make the device suitable for in-vehicle network processing and gateway functions.
  • Secure edge compute — Multi-core ARM® Cortex® processors combined with hardware security features support secure localized processing and encrypted communications.
  • Embedded connectivity platforms — DDR3L/LPDDR4 memory support, DMA and USB OTG enable robust connectivity and data handling in embedded systems.
  • Industrial and harsh-environment systems — Operating range from −40 °C to 105 °C and automotive-grade qualification allow deployment in temperature-challenging environments.

Unique Advantages

  • Multi-core heterogeneous architecture: Combines 64-bit and 32-bit ARM cores in one device to address diverse processing tasks without additional host processors.
  • Integrated high-speed network I/O: Four Ethernet interfaces at 1/2.5 Gbps help consolidate networking functions and reduce external PHY count.
  • Comprehensive hardware security: ARM TrustZone, cryptography, RNG, secure fusebox, secure memory and XRDC provide layered security mechanisms for protected systems.
  • Automotive-grade qualification: AEC-Q100 qualification and a wide operating temperature range support reliable deployment in automotive and demanding embedded applications.
  • Flexible memory options: Support for DDR3L and LPDDR4 memory types enables design flexibility for performance and power trade-offs.
  • Compact surface-mount packaging: 525-FCPBGA (19×19) package provides a high-density solution for space-constrained boards.

Why Choose S32G254AABK1VUCT?

The S32G254AABK1VUCT positions itself as a multi-core, security-capable microprocessor for embedded and automotive designs that require integrated networking, memory flexibility, and hardware-enforced security. Its combination of ARM® Cortex®-A53 and Cortex®-M7 cores, multiple Ethernet ports, and a broad operating temperature range make it suitable for systems demanding both compute and connectivity.

Backed by NXP Semiconductors and AEC-Q100 qualification, this device offers an integrated platform approach that can simplify BOM, consolidate functions, and support long-term deployment in automotive and industrial environments.

Request a quote or submit an inquiry to receive pricing and availability information for the S32G254AABK1VUCT.

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