S32G254AABK0CUCT

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 424 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254AABK0CUCT – ARM Cortex-A53 and Cortex-M7 Microprocessor

The S32G254AABK0CUCT is a multi-core microprocessor from NXP Semiconductors combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a single device. The device provides a heterogeneous core architecture with 64-bit and 32-bit processing capabilities tailored for embedded and automotive-grade applications.

Designed for connected and secure embedded systems, this part integrates high-speed interfaces, memory controller support, and hardware security building blocks to deliver balanced performance, system integration, and reliability for development of networked and safety-aware designs.

Key Features

  • Heterogeneous Core Architecture  ARM Cortex-A53 and ARM Cortex-M7 cores present a mix of 64-bit and 32-bit processing for system and real-time tasks; documented core configuration shows "3 Core, 64-Bit/2 Core, 32-Bit".
  • Performance  Dual published clock points noted in the product description: 400 MHz and 1 GHz for targeted processing roles.
  • Memory Support  Integrated controllers for DDR3L and LPDDR4 memory technologies to support high-bandwidth system memory requirements.
  • Connectivity  Four Gigabit Ethernet ports and one USB 2.0 OTG interface provide multiple high-speed I/O paths for networking and peripheral connectivity.
  • Security  Hardware security features include ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for resource domain control.
  • System and DMA  DMA support and multimedia/NEON co-processor capabilities are documented to accelerate data movement and media processing tasks.
  • Package and Mounting  Supplied in a 525-FCPBGA (19×19) FCBGA package, intended for surface-mount assembly.
  • Operating Range and Qualification  Automotive-grade device qualified to AEC‑Q100 with an operating temperature range of −40 °C to 85 °C.
  • Graphics  No dedicated graphics acceleration is provided.

Typical Applications

  • Automotive gateways and telematics  Automotive-grade qualification (AEC‑Q100) and multiple GbE ports enable use in vehicle networking and telematics modules requiring secure connectivity.
  • Embedded networking devices  Four Gigabit Ethernet interfaces and DMA support suit networked embedded systems, communication appliances, and routers.
  • Industrial and control systems  Wide operating temperature range and robust security features make the device appropriate for industrial embedded controllers and secure edge nodes.
  • Secure connected controllers  Integrated TrustZone, cryptography, and secure memory features support applications that require hardware-enforced isolation and data protection.

Unique Advantages

  • Heterogeneous processing in one device: Enables partitioning of system-level and real-time tasks across ARM Cortex-A53 and Cortex-M7 cores to optimize performance and determinism.
  • Rich wired connectivity: Four GbE ports and USB 2.0 OTG provide multiple high-throughput interfaces for networked designs and peripheral integration.
  • Comprehensive hardware security: Built-in TrustZone, cryptography, RNG, secure fusebox, secure memory, and XRDC support secure system architectures and data protection.
  • Memory flexibility: Support for DDR3L and LPDDR4 memory controllers accommodates a range of performance and power targets.
  • Automotive qualification and extended temperature: AEC‑Q100 qualification and −40 °C to 85 °C rating make the device suitable for automotive and harsh-environment applications.
  • Surface-mount FCBGA package: 525-ball FCPBGA (19×19) package supports compact board-level integration.

Why Choose S32G254AABK0CUCT?

The S32G254AABK0CUCT positions itself as a versatile, automotive-grade microprocessor combining multi-core compute, extensive wired connectivity, and hardware security features in a single FCBGA package. Its heterogeneous ARM Cortex-A53 and Cortex-M7 architecture, supported memory controllers, and multiple Gigabit Ethernet interfaces make it appropriate for embedded and automotive designs that require both application-level processing and real-time control.

Manufactured by NXP Semiconductors and qualified to AEC‑Q100, this device is intended for designers seeking a consolidated platform for secure, networked embedded systems with defined operating temperature and package constraints.

Request a quote or contact sales to discuss availability, lead times, and pricing for the S32G254AABK0CUCT. Provide your project requirements to receive tailored purchasing information.

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