S32G234MSBK1VUCR
| Part Description |
ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 238 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G234 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 1/2.5Gbps (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 32/64-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | Unknown | Security Features | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | ||
| Speed | 400MHz | Supplier Device Package | 525-FCPBGA (19×19) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G234MSBK1VUCR – ARM Cortex‑M7 3‑Core 400 MHz Microprocessor
The S32G234M ARM CORTEX‑M7, HSE W/PR (S32G234MSBK1VUCR) is a 3‑core ARM® Cortex®‑M7 microprocessor IC designed for embedded applications. It delivers up to 400 MHz core performance with 32/64‑bit processing and integrates multicore DSP/NEON co‑processor capabilities for multimedia workloads.
With integrated high‑speed Ethernet connectivity, hardware security primitives and automotive‑grade qualification (AEC‑Q100), this device targets embedded and automotive designs that require deterministic processing, secure operation and robust thermal tolerance from ‑40 °C to 105 °C.
Key Features
- Core Architecture 3 cores based on the ARM® Cortex®‑M7 architecture providing 32/64‑bit processing at up to 400 MHz.
- Co‑processing and DSP Multimedia and NEON co‑processor support to accelerate signal processing and computational workloads.
- Networking Integrated Ethernet capability listed as 1/2.5Gbps (4), enabling high‑speed network connectivity options.
- Security Built‑in security features including Cryptography, Random Number Generator, Secure Fusebox, Secure Memory and XRDC for hardware‑level protection.
- Interfaces and System Support Includes DMA and other system interfaces for efficient data movement and peripheral integration.
- Package and Mounting Supplied in a 525‑FCPBGA (19×19) package / 525‑FBGA FCBGA family; designed for surface‑mount assembly.
- Automotive Qualification and Temperature Range AEC‑Q100 qualified and specified for operation from ‑40 °C to 105 °C, supporting automotive and harsh‑environment applications.
- Environmental Compliance RoHS compliant for regulatory and manufacturing considerations.
Typical Applications
- Automotive Systems Compute nodes and control modules that require AEC‑Q100 qualification, hardware security, and extended temperature operation.
- Networked Embedded Controllers Devices that need multi‑core processing combined with high‑speed Ethernet connectivity for real‑time data exchange.
- Secure Embedded Platforms Applications demanding on‑chip cryptography, secure memory and RNG for trusted boot, secure storage and protected execution.
Unique Advantages
- Multicore Performance: 3 ARM® Cortex®‑M7 cores at up to 400 MHz deliver parallel processing headroom for control and signal tasks.
- DSP and NEON Acceleration: Multimedia and NEON co‑processor support accelerates compute‑intensive algorithms without external accelerators.
- Integrated High‑Speed Ethernet: 1/2.5Gbps (4) connectivity options simplify networked system designs requiring high throughput.
- Comprehensive Hardware Security: On‑chip cryptography, RNG, secure fusebox, secure memory and XRDC provide layered protection for sensitive applications.
- Automotive‑Ready Reliability: AEC‑Q100 qualification and a ‑40 °C to 105 °C operating range support deployment in demanding environments.
- Production‑Ready Packaging: 525‑FCPBGA (19×19) surface‑mount package supports modern assembly and thermal profiles.
Why Choose S32G234MSBK1VUCR?
The S32G234MSBK1VUCR combines multicore ARM® Cortex®‑M7 processing, DSP/NEON acceleration and extensive hardware security features in a single, automotive‑qualified device. Its integrated Ethernet capability and DMA support make it well suited for embedded systems that require secure, networked real‑time processing across a wide temperature range.
This part is appropriate for designers targeting embedded and automotive applications that demand determinism, security and reliability. With AEC‑Q100 qualification and RoHS compliance, it provides a robust platform for long‑lifecycle deployments where environmental and regulatory considerations are critical.
Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for S32G234MSBK1VUCR. Our team can assist with ordering and technical details specific to your design requirements.

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