S32G254AABK0CUCR

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 687 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254AABK0CUCR – ARM Cortex‑A53 and Cortex‑M7 Microprocessor

The S32G254AABK0CUCR is a multi‑core microprocessor IC from NXP Semiconductors featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores. It combines 64‑bit and 32‑bit processing elements, integrated memory controllers, multiple Gigabit Ethernet ports and security hardware to address embedded and automotive‑grade applications.

Designed for systems requiring mixed‑architecture compute, deterministic microcontroller-class tasks and network connectivity, this device delivers integrated peripherals and automotive qualification for robust deployment in temperature ranges from -40 °C to 85 °C.

Key Features

  • Core Architecture Multi‑core configuration combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processors; device description lists 3 core, 64‑bit and 2 core, 32‑bit arrangements with frequency points noted at 400 MHz and 1 GHz.
  • Memory and DMA Integrated memory controller support for DDR3L and LPDDR4 and additional DMA interfaces to support high‑throughput data movement.
  • Networking Interfaces Four Gigabit Ethernet (GbE) ports provide robust wired networking capability for high‑bandwidth communication tasks.
  • USB Connectivity USB 2.0 OTG support for peripheral connectivity and device/host role flexibility.
  • Security Features Built‑in security includes ARM TrustZone, cryptography acceleration, a random number generator, secure fusebox, secure memory and XRDC to help protect software and data.
  • Automotive Qualification & Grade Classified as Automotive grade with AEC‑Q100 qualification for designs that require automotive qualification status.
  • Package and Mounting Available in a 525‑FCPBGA (19×19) package, surface mount, with supplier package references 525‑FBGA/FCBGA.
  • Operating Range & Compliance Specified operating temperature from -40 °C to 85 °C and RoHS compliant.

Typical Applications

  • Automotive electronic systems — Use the AEC‑Q100 qualified device where automotive grade multi‑core processing and secure operation are required.
  • In‑vehicle networking — Leverage four GbE ports for high‑bandwidth vehicle network connectivity and data distribution.
  • Embedded systems with mixed workloads — Combine 64‑bit and 32‑bit cores for applications that need both application processing and real‑time control.
  • USB‑enabled peripheral integration — USB 2.0 OTG supports device and host connections for accessory and diagnostic interfaces.

Unique Advantages

  • Multi‑architecture flexibility: Offers both ARM® Cortex®‑A53 and Cortex®‑M7 cores to consolidate application and real‑time control on a single device.
  • Integrated networking: Four GbE interfaces reduce the need for external PHYs and simplify high‑bandwidth system design.
  • Security hardware included: On‑chip TrustZone, cryptography, RNG and secure storage primitives help protect IP and system data.
  • Automotive readiness: AEC‑Q100 qualification and automotive grade designation support deployment in automotive programs.
  • Memory interface options: DDR3L and LPDDR4 controller support enables flexible memory subsystem choices for performance or power optimization.

Why Choose S32G254AABK0CUCR?

The S32G254AABK0CUCR positions itself as a highly integrated microprocessor solution combining 64‑bit and 32‑bit ARM cores with multiple networking ports and comprehensive security features. Its automotive grade qualification and wide operating temperature range make it suitable for demanding embedded and vehicle environments where integration, connectivity and secure operation are priorities.

From designs that require consolidated application and real‑time processing to networked embedded systems that demand multiple GbE links, this NXP device offers a platform that simplifies system architecture while maintaining qualification and compliance attributes relevant to production programs.

Request a quote or submit an inquiry to get pricing, availability and detailed ordering information for the S32G254AABK0CUCR.

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