S32G234MSBK0VUCT
| Part Description |
ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 1,599 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G234 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GbE (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 32/64-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | ||
| Speed | 400MHz | Supplier Device Package | 525-FCPBGA (19×19) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G234MSBK0VUCT – ARM CORTEX-M7 Microprocessor
The S32G234MSBK0VUCT is a 3-core ARM® Cortex®-M7 microprocessor IC operating at 400 MHz, designed for embedded applications requiring multi-core processing, hardware security and high-speed wired networking. Manufactured by NXP Semiconductors and offered in a 525-FCPBGA (19×19) surface-mount package, this device targets performance-oriented embedded systems in automotive and industrial markets.
Key value comes from a combination of multi-core Cortex‑M7 performance, on-chip multimedia/NEON co-processing, four Gigabit Ethernet interfaces and a comprehensive security feature set, along with AEC‑Q100 qualification and a wide operating temperature range for robust deployment.
Key Features
- Core Architecture Three ARM® Cortex®-M7 cores with 32/64-bit bus width running at 400 MHz to support parallel real-time and control workloads.
- Co-Processors Integrated multimedia and NEON co-processors for accelerated data processing and signal-handling tasks.
- High-Speed Ethernet Four Gigabit Ethernet interfaces (GbE ×4) for multi-port networking and gateway applications.
- Security Features On-chip cryptography, hardware random number generator, secure fusebox, secure memory and XRDC for enforced resource isolation and secure system designs.
- Interfaces & System Includes DMA support to offload data movement and improve system throughput.
- Package & Mounting 525-FCPBGA (19×19) package in a surface-mount form factor suitable for compact, high-density designs.
- Automotive Qualification & Temperature Range AEC‑Q100 qualified with an operating temperature range of −40°C to 105°C for deployment in demanding environments.
- Regulatory RoHS compliant.
Typical Applications
- Automotive Gateway & Networking Four GbE interfaces and multi-core processing make this device suitable for in-vehicle gateways and domain networking nodes.
- Secure Embedded Systems Integrated cryptography, secure memory and XRDC support designs that require hardware-backed security and resource isolation.
- Real-Time Control & Signal Processing Three Cortex‑M7 cores combined with NEON/multimedia co-processing and DMA enable parallel real-time control and high-throughput signal tasks.
- Industrial Embedded Networking AEC‑Q100 qualification and a wide operating temperature range enable use in industrial and harsh-environment networked systems.
Unique Advantages
- Highly Integrated Multi-Core Platform: Three Cortex‑M7 cores with NEON/multimedia co-processors reduce the need for external processing elements and simplify system partitioning.
- Multi-Port Ethernet Connectivity: Four GbE interfaces provide native high-speed wired networking for gateway, bridge or switch applications.
- Security-First Hardware: Comprehensive on-chip security building blocks (cryptography, RNG, secure fusebox, secure memory, XRDC) support secure boot and runtime protection strategies.
- Automotive-Ready Qualification: AEC‑Q100 qualification and −40°C to 105°C operating range support deployment in automotive and other demanding environments.
- Compact, Surface-Mount Packaging: 525-FCPBGA (19×19) package enables dense PCB designs while maintaining high pin count and signal integrity.
- RoHS Compliant: Meets RoHS requirements for environmentally compliant manufacturing.
Why Choose S32G234MSBK0VUCT?
The S32G234MSBK0VUCT positions itself as a performance-oriented, security-capable microprocessor for embedded systems that require multi-core compute, high-speed Ethernet connectivity and hardware-enforced security. Its combination of Cortex‑M7 cores, NEON/multimedia co-processing, multiple GbE ports and AEC‑Q100 qualification makes it appropriate for networked automotive and industrial designs that demand reliability across temperature extremes.
Engineers and procurement teams seeking a compact, surface-mount solution from NXP Semiconductors will find this device suited to scalable, secure embedded architectures where integrated networking and on-chip security reduce system complexity and support long-term deployments.
Request a quote or submit an inquiry for pricing and availability to move your design forward with the S32G234MSBK0VUCT.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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