S32G234MSBK0VUCT

S32G234M ARM CORTEX-M7, HSE W/PR
Part Description

ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19)

Quantity 1,599 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G234
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32/64-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed400MHzSupplier Device Package525-FCPBGA (19×19)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G234MSBK0VUCT – ARM CORTEX-M7 Microprocessor

The S32G234MSBK0VUCT is a 3-core ARM® Cortex®-M7 microprocessor IC operating at 400 MHz, designed for embedded applications requiring multi-core processing, hardware security and high-speed wired networking. Manufactured by NXP Semiconductors and offered in a 525-FCPBGA (19×19) surface-mount package, this device targets performance-oriented embedded systems in automotive and industrial markets.

Key value comes from a combination of multi-core Cortex‑M7 performance, on-chip multimedia/NEON co-processing, four Gigabit Ethernet interfaces and a comprehensive security feature set, along with AEC‑Q100 qualification and a wide operating temperature range for robust deployment.

Key Features

  • Core Architecture  Three ARM® Cortex®-M7 cores with 32/64-bit bus width running at 400 MHz to support parallel real-time and control workloads.
  • Co-Processors  Integrated multimedia and NEON co-processors for accelerated data processing and signal-handling tasks.
  • High-Speed Ethernet  Four Gigabit Ethernet interfaces (GbE ×4) for multi-port networking and gateway applications.
  • Security Features  On-chip cryptography, hardware random number generator, secure fusebox, secure memory and XRDC for enforced resource isolation and secure system designs.
  • Interfaces & System  Includes DMA support to offload data movement and improve system throughput.
  • Package & Mounting  525-FCPBGA (19×19) package in a surface-mount form factor suitable for compact, high-density designs.
  • Automotive Qualification & Temperature Range  AEC‑Q100 qualified with an operating temperature range of −40°C to 105°C for deployment in demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Automotive Gateway & Networking  Four GbE interfaces and multi-core processing make this device suitable for in-vehicle gateways and domain networking nodes.
  • Secure Embedded Systems  Integrated cryptography, secure memory and XRDC support designs that require hardware-backed security and resource isolation.
  • Real-Time Control & Signal Processing  Three Cortex‑M7 cores combined with NEON/multimedia co-processing and DMA enable parallel real-time control and high-throughput signal tasks.
  • Industrial Embedded Networking  AEC‑Q100 qualification and a wide operating temperature range enable use in industrial and harsh-environment networked systems.

Unique Advantages

  • Highly Integrated Multi-Core Platform: Three Cortex‑M7 cores with NEON/multimedia co-processors reduce the need for external processing elements and simplify system partitioning.
  • Multi-Port Ethernet Connectivity: Four GbE interfaces provide native high-speed wired networking for gateway, bridge or switch applications.
  • Security-First Hardware: Comprehensive on-chip security building blocks (cryptography, RNG, secure fusebox, secure memory, XRDC) support secure boot and runtime protection strategies.
  • Automotive-Ready Qualification: AEC‑Q100 qualification and −40°C to 105°C operating range support deployment in automotive and other demanding environments.
  • Compact, Surface-Mount Packaging: 525-FCPBGA (19×19) package enables dense PCB designs while maintaining high pin count and signal integrity.
  • RoHS Compliant: Meets RoHS requirements for environmentally compliant manufacturing.

Why Choose S32G234MSBK0VUCT?

The S32G234MSBK0VUCT positions itself as a performance-oriented, security-capable microprocessor for embedded systems that require multi-core compute, high-speed Ethernet connectivity and hardware-enforced security. Its combination of Cortex‑M7 cores, NEON/multimedia co-processing, multiple GbE ports and AEC‑Q100 qualification makes it appropriate for networked automotive and industrial designs that demand reliability across temperature extremes.

Engineers and procurement teams seeking a compact, surface-mount solution from NXP Semiconductors will find this device suited to scalable, secure embedded architectures where integrated networking and on-chip security reduce system complexity and support long-term deployments.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the S32G234MSBK0VUCT.

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