S32G234MABK0VUCT

S32G234M ARM CORTEX-M7, HSE, LLC
Part Description

ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19)

Quantity 1,275 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G234
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32/64-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed400MHzSupplier Device Package525-FCPBGA (19×19)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G234MABK0VUCT – ARM Cortex‑M7 Microprocessor

The S32G234MABK0VUCT is an ARM® Cortex®‑M7 microprocessor IC featuring a 3‑core, 32/64‑bit architecture running at 400 MHz. It is presented as an embedded-class device designed for applications requiring multi‑core processing, high‑speed Ethernet connectivity, and integrated security.

Manufactured by NXP Semiconductors and offered in a 525‑FCPBGA (19×19) surface‑mount package, the device is automotive grade and qualified to AEC‑Q100, with an operating temperature range of ‑40 °C to 105 °C.

Key Features

  • Core & Performance ARM® Cortex®‑M7 architecture with a 3‑core, 32/64‑bit configuration and a 400 MHz core clock to support concurrent real‑time processing tasks.
  • Multimedia & DSP Includes multimedia and NEON DSP capabilities for accelerated signal processing and compute‑intensive routines.
  • Ethernet & Interfaces Four Gigabit Ethernet ports provide high‑bandwidth networking options; additional interfaces include DMA for efficient data movement.
  • Security Built‑in security features include cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC to help protect data and system resources.
  • Package & Mounting Supplied in a 525‑FCPBGA (19×19) package suitable for surface mount assembly.
  • Automotive Qualification & Temperature Range Automotive grade with AEC‑Q100 qualification and an operating temperature range of ‑40 °C to 105 °C for demanding environments.
  • Compliance RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

  • Automotive network gateways — Multi‑core processing coupled with four GbE ports enables high‑throughput network and gateway functions in automotive systems.
  • Embedded control systems — Real‑time processing and DMA support centralized control tasks in embedded platforms.
  • Secure edge processing — Integrated cryptography, secure memory and RNG facilitate secure data handling at the edge.
  • Signal processing and multimedia offload — NEON and multimedia DSP features accelerate compute‑intensive algorithms.

Unique Advantages

  • Multi‑core performance: Three Cortex‑M7 cores at 400 MHz provide parallel processing capability for complex embedded workloads.
  • High‑bandwidth connectivity: Four Gigabit Ethernet ports enable robust network throughput for data‑intensive applications.
  • Comprehensive security: On‑chip cryptography, RNG, secure fusebox, secure memory and XRDC enhance system security without external components.
  • Automotive‑ready qualification: AEC‑Q100 qualification and automotive grade designation support deployment in automotive environments.
  • Wide operating temperature: Rated from ‑40 °C to 105 °C for reliable operation across extended temperature ranges.
  • Surface‑mount BGA packaging: 525‑FCPBGA (19×19) package enables compact board integration and standard assembly processes.

Why Choose S32G234MABK0VUCT?

The S32G234MABK0VUCT combines multi‑core Cortex‑M7 performance with extensive networking and security features in an automotive‑qualified package. Its integration of GbE connectivity, DMA support and hardened security elements makes it suitable for embedded and automotive applications that demand concurrent processing, secure data handling and robust communications.

Backed by NXP Semiconductors and offered in a 525‑FCPBGA package with a wide operating temperature range and AEC‑Q100 qualification, this device is positioned for designs requiring long‑term reliability and scalable multi‑core capability.

Request a quote or submit a quote request to begin specifying the S32G234MABK0VUCT for your next embedded or automotive design.

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