S32G233ASBK0VUCT

S32G233A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 496 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233ASBK0VUCT – ARM Cortex-M7 and -A53 Microprocessor

The S32G233ASBK0VUCT is a microprocessor IC featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a mixed 64-bit and 32-bit architecture. It combines multi-core processing, hardware security primitives and high-speed networking interfaces for embedded and automotive system designs.

Designed for applications that require integration of networking, security and real-time control, the device delivers configurable core topologies and memory interface options to support complex system integration and robust operation across a wide temperature range.

Key Features

  • Core Architecture — ARM® Cortex®-A53 and ARM® Cortex®-M7 processors with a declared core configuration of 1 core (64-bit) and 2 cores (32-bit); clock figures referenced in the product data include 400 MHz and 1 GHz.
  • Co‑processing and Multimedia — Includes multimedia DSP capabilities and NEON support for accelerated signal and media processing tasks.
  • Memory Interfaces — Integrated controllers for DDR3L and LPDDR4 memory technologies to support system memory requirements.
  • Networking and I/O — Four Gigabit Ethernet (GbE) interfaces and one USB 2.0 OTG port, plus DMA for efficient data movement.
  • Security — Hardware security features include ARM TrustZone (TZ), cryptography engines, a random number generator, secure fusebox, secure memory and XRDC to support secure boot and runtime protection models.
  • Automotive Qualification & Grade — Manufactured to Automotive grade and explicitly qualified to AEC‑Q100.
  • Package & Mounting — 525‑FCPBGA (19×19) surface‑mount package (525‑FBGA, FCBGA family) for board-level integration.
  • Operating Range & Compliance — Operating temperature range from −40 °C to 105 °C and RoHS compliant.

Typical Applications

  • Automotive Gateway and Networking — Multi‑core processing with four GbE interfaces supports in-vehicle networking and gateway functions that require high-bandwidth Ethernet connectivity.
  • Secure Edge Compute — On-chip security features such as TrustZone, cryptography and secure memory enable secure edge compute and trusted execution environments.
  • Industrial and Embedded Control — Combined Cortex‑M7 real-time cores and Cortex‑A53 application core topology suit mixed control and higher-level application tasks in embedded systems.

Unique Advantages

  • Heterogeneous Core Mix: Single 64‑bit and dual 32‑bit core topology enables separation of high-level application processing and real‑time control.
  • Integrated Networking Interfaces: Four GbE ports and DMA reduce external bridging components and streamline board-level design for networked systems.
  • Robust Security Building Blocks: Multiple hardware security primitives provide foundations for secure boot, cryptographic operations and runtime isolation.
  • Automotive‑Grade Qualification: AEC‑Q100 qualification and Automotive grade designation support deployment in automotive environments.
  • Memory Flexibility: Support for DDR3L and LPDDR4 controllers allows designers to optimize for performance or power and to match system memory choices.
  • Wide Temperature Operation: −40 °C to 105 °C rating supports demanding environmental conditions.

Why Choose S32G233ASBK0VUCT?

The S32G233ASBK0VUCT positions itself as a versatile, automotive‑grade microprocessor solution that balances application-level processing and real‑time control while integrating advanced security and multi‑port Ethernet connectivity. Its combination of ARM® Cortex® cores, multimedia acceleration and hardware security features makes it suitable for designs that require networking, secure execution and mixed criticality workloads.

Engineers and system designers benefit from the part's memory interface flexibility, surface‑mount 525‑FCPBGA package and AEC‑Q100 qualification for reliable operation in temperature‑challenging environments, enabling scalable, secure embedded platforms with long‑term value.

Request a quote or submit an inquiry to get pricing and availability for the S32G233ASBK0VUCT and evaluate how it fits your next embedded or automotive design project.

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