S32G233AABK0VUCT

S32G233A ARM CORTEX-M7 AND -A53
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 195 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233AABK0VUCT – ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC

The S32G233AABK0VUCT is a highly integrated embedded microprocessor combining ARM® Cortex®-A53 and ARM® Cortex®-M7 processor technologies. The device offers both 64‑bit and 32‑bit processing options with listed operating frequencies of 400 MHz and 1 GHz, making it suitable for mixed-control and application processing tasks.

Designed for embedded and automotive applications, this AEC‑Q100 qualified, automotive-graded component delivers a blend of connectivity, security, and memory interfacing to support networked, secure, and robust designs in demanding temperature environments.

Key Features

  • Core and Performance ARM® Cortex®-A53 and ARM® Cortex®-M7 cores are provided; device listing includes 1 core at 64‑bit and 2 cores at 32‑bit with operating frequencies noted at 400 MHz and 1 GHz.
  • Memory Interface Integrated memory controller support for DDR3L and LPDDR4 memory technologies to address a range of performance and power tradeoffs.
  • High-Speed Connectivity Four Gigabit Ethernet (GbE) interfaces and one USB 2.0 OTG port enable high-bandwidth networking and peripheral connectivity.
  • Security and Trust Comprehensive on-chip security features including ARM TrustZone (TZ), cryptographic hardware, a random number generator, secure fusebox, secure memory, and XRDC for access control.
  • System and I/O DMA support for efficient data movement and system-level integration; additional on-chip peripherals to support embedded designs.
  • Package and Mounting Offered in a 525‑FCPBGA (19×19) supplier device package (525‑FBGA/FCBGA) with surface-mount capability for compact board-level integration.
  • Automotive Grade and Qualification Grade: Automotive with AEC‑Q100 qualification, and an operating temperature range of −40 °C to 105 °C to meet demanding environmental requirements.
  • Compliance RoHS compliant for environmental and manufacturing considerations.

Typical Applications

  • Automotive Networking and Gateway Leverages multiple Gigabit Ethernet ports and security features to support secure in-vehicle networking and gateway functions in automotive systems.
  • Embedded Control and Application Processing Mixed 64‑bit and 32‑bit cores suit designs that require both application-level processing and real-time control tasks.
  • Secure Edge Compute On-chip cryptography, secure memory, and XRDC enable deployments where data protection and controlled access are required at the edge.

Unique Advantages

  • Mixed 64‑bit and 32‑bit processing: Combines ARM® Cortex®-A53 and Cortex®-M7 cores to address diverse processing needs within a single device.
  • Multiple high‑speed network interfaces: Four GbE ports provide substantial bandwidth for connected embedded and automotive applications.
  • Comprehensive on‑chip security: Hardware crypto, TRNG, secure fusebox, secure memory, and XRDC enable robust security architectures without relying solely on external components.
  • Automotive qualification: AEC‑Q100 qualification and automotive grade designation support use in temperature- and reliability-sensitive applications.
  • Flexible memory support: DDR3L and LPDDR4 controller support helps designers optimize for cost, performance, and power.
  • Compact, surface‑mount package: 525‑FCPBGA (19×19) package facilitates dense board layouts for space-constrained designs.

Why Choose S32G233AABK0VUCT?

The S32G233AABK0VUCT positions itself as an integrated embedded processor option where mixed-processing performance, automotive qualification, and extensive connectivity are essential. Its combination of ARM® Cortex®-A53 and Cortex®-M7 processing resources, multiple Gigabit Ethernet interfaces, and a broad set of security features make it suitable for designs that require networked communication, secure operation, and reliable performance across a wide temperature range.

This device is well suited for engineers and design teams building embedded and automotive systems that demand consolidation of application and control processing, built-in security primitives, and AEC‑Q100‑level qualification for robust field operation.

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