RPIXP2800BB

The RPIXP2800BB is an Intel® IXP2800 microprocessor supplied in a 1356‑FCBGA package. It integrates a single 32‑bit core running at 1.4 GHz and is targeted for embedded applications.

On‑chip features include SRAM controllers, LVDS display interface controllers, PCI connectivity and hardware security engines (3DES, AES, SHA‑1). The device uses 3.3 V I/O and is specified for industrial operation from −40 °C to 85 °C.

Key Features

• Processor Core — Intel® IXP2800 single 32‑bit core operating at 1.4 GHz for embedded processing tasks.
• Memory — Integrated SRAM controllers to support on‑board SRAM interfaces.
• Display and Connectivity — LVDS display interface controllers and PCI as an additional interface for system integration.
• Security — Hardware cryptographic support including 3DES, AES and SHA‑1.
• Power and I/O — 3.3 V I/O voltage for interfacing with standard embedded peripherals.
• Package & Mounting — 1356‑FCBGA (37.5×37.5) / 1356‑BBGA package, surface‑mount mounting type.
• Graphics — No graphics acceleration (suitable for designs that do not require on‑chip GPU).
• Temperature & Grade — Industrial grade device specified for operation from −40 °C to 85 °C.

Typical Applications

• Industrial Embedded Systems — Suited for embedded controllers and processing modules requiring industrial temperature rating and robust packaging.
• Display and HMI Platforms — Systems that require LVDS display interfaces for panel connectivity.
• Secure Communications Appliances — Designs that need on‑chip cryptographic engines (3DES, AES, SHA‑1) and PCI connectivity.
• SRAM‑based Control Systems — Applications that leverage on‑chip SRAM controllers for deterministic memory access.

Unique Advantages

• Single 32‑bit 1.4 GHz Core: Delivers a defined processing clock rate for embedded workloads using the Intel® IXP2800 core.
• Integrated Security Engines: Hardware support for 3DES, AES and SHA‑1 simplifies secure data handling on‑chip.
• LVDS and PCI Connectivity: Built‑in LVDS display controllers and PCI interface provide flexible system I/O options.
• Industrial Temperature Rating: Specified −40 °C to 85 °C for use in industrial environments.
• Compact FCBGA Package: 1356‑FCBGA (37.5×37.5) surface‑mount package suitable for dense board layouts.
• SRAM Controller Support: On‑chip SRAM controllers reduce external memory interface complexity.

Why Choose RPIXP2800BB?

The RPIXP2800BB combines a single Intel® IXP2800 32‑bit core at 1.4 GHz with integrated memory controllers, display and PCI interfaces, and hardware security features, packaged for industrial use. Its specification set addresses embedded designs that require defined processing capability, on‑chip cryptography, and LVDS/PCI connectivity within an industrial temperature window.

This device is suited to engineers and procurement teams building embedded systems that prioritize rugged operation, on‑chip security, and compact FCBGA packaging from a recognized manufacturer.

Request a quote or submit an RFQ for the RPIXP2800BB to obtain pricing and availability information tailored to your project needs.