S32G233AABK0VUCR

S32G233A ARM CORTEX-M7 AND -A53
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 780 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233AABK0VUCR – ARM Cortex‑M7 and Cortex‑A53 Microprocessor

The S32G233AABK0VUCR is an embedded microprocessor IC combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores in a single automotive‑grade device. It integrates heterogeneous processing, multiport Ethernet connectivity, and security features to address embedded designs that require both application and real‑time control functions.

Designed for automotive and embedded applications, this device offers high‑performance 64‑bit application processing alongside 32‑bit real‑time cores, flexible memory controller support, and multiple Gigabit Ethernet interfaces for networked systems.

Key Features

  • Heterogeneous CPU Configuration  Combines ARM Cortex‑A53 (64‑bit, single core) and ARM Cortex‑M7 (32‑bit, dual core) processing elements with clock points reported at 1 GHz and 400 MHz respectively.
  • Memory Interfaces  Supports DDR3L and LPDDR4 memory controllers for flexible external memory choices in embedded systems.
  • High‑Speed Networking  Four Gigabit Ethernet (GbE) ports provide extensive wired networking capability for distributed and networked applications.
  • USB Connectivity  Includes one USB 2.0 OTG interface to support host/device peripheral connectivity.
  • Security and Isolation  On‑chip features include ARM TrustZone (ARM TZ), cryptography engines, a true random number generator, secure fusebox, secure memory, and XRDC for zoned resource control.
  • Multimedia Acceleration  DSP and NEON multimedia co‑processor support for accelerated signal and media processing tasks.
  • Package and Mounting  Supplied in a 525‑FCPBGA (19 × 19 mm) surface‑mount package suitable for automated board assembly.
  • Automotive Qualification and Temperature Range  AEC‑Q100 qualification with an operating temperature range of ‑40 °C to 105 °C for automotive‑grade deployments.
  • Compliance  RoHS compliant for environmental regulatory adherence.

Typical Applications

  • Automotive Embedded Systems  Engineered for automotive designs requiring mixed‑domain processing, deterministic control and secure communications.
  • Networked Gateways  Multiple GbE ports enable high‑throughput in-vehicle or embedded gateway and routing applications.
  • Secure Edge Processing  Integrated security primitives and TrustZone support secure boot, cryptographic operations and isolated execution at the edge.
  • Real‑Time Control and Signal Processing  Dual Cortex‑M7 cores with DSP/NEON capabilities serve real‑time control, signal conditioning and multimedia preprocessing tasks.

Unique Advantages

  • Heterogeneous Processing in One Device:  Combines 64‑bit application processing and 32‑bit real‑time cores to consolidate system functions and reduce BOM complexity.
  • Extensive Ethernet Connectivity:  Four GbE ports provide flexible network topologies and high aggregate throughput for connected systems.
  • Comprehensive On‑Chip Security:  Built‑in TrustZone, cryptography, RNG and secure memory features enable layered security without extensive external components.
  • Automotive‑Grade Reliability:  AEC‑Q100 qualification and a wide operating temperature range support deployment in demanding automotive environments.
  • Memory Flexibility:  Support for DDR3L and LPDDR4 allows designers to match performance and power tradeoffs to system requirements.

Why Choose S32G233AABK0VUCR?

The S32G233AABK0VUCR positions itself as a highly integrated solution for embedded and automotive applications that require both application‑level performance and real‑time control. Its combination of ARM Cortex‑A53 and Cortex‑M7 cores, multiport Gigabit Ethernet, robust on‑chip security, and automotive qualification makes it suitable for designs where networking, safety, and secure processing converge.

For engineers targeting networked, secure embedded systems, this part offers scalable performance, flexible memory and interface options, and qualification for automotive deployment, enabling compact, consolidated system architectures.

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