S32G233AABK1VUCR

S32G233A ARM CORTEX-M7 AND -A53
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 267 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time21 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233AABK1VUCR – S32G233A ARM CORTEX-M7 AND -A53

The S32G233AABK1VUCR is a microprocessor IC from the S32G233 series integrating ARM® Cortex®-A53 and ARM® Cortex®-M7 cores for mixed 64-bit and 32-bit processing. The device provides multi-core processing capability with listed clock points of 400 MHz and 1 GHz and is supplied in a 525-FCPBGA (19×19) package for surface-mount applications.

Targeted at embedded markets, this device combines heterogeneous cores, multimedia DSP/NEON support, multi-protocol connectivity and extensive security features, and is qualified to AEC‑Q100 for automotive-grade applications.

Key Features

  • Core architecture — ARM® Cortex®-A53 and ARM® Cortex®-M7 cores offering both 64‑bit and 32‑bit processing in a multi-core configuration (1 Core, 64‑Bit / 2 Core, 32‑Bit).
  • Performance points — Device description lists operating points at 400 MHz and 1 GHz to address differing performance domains within a single device.
  • Multimedia and DSP — Integrated multimedia and NEON co-processor capabilities to accelerate signal and media processing workloads.
  • Memory interfaces — Integrated controllers for DDR3L and LPDDR4 memory types to support system memory requirements.
  • Ethernet connectivity — Four Ethernet interfaces supporting 1 Gb/s and 2.5 Gb/s rates for high-speed networking use cases.
  • USB support — One USB 2.0 OTG interface for host/device connectivity.
  • Security features — Hardware security including ARM TrustZone, cryptography acceleration, random number generator, secure fusebox, secure memory and XRDC for resource partitioning.
  • Interfaces and peripherals — DMA support for efficient data movement and peripheral coordination.
  • Package and mounting — 525‑FCPBGA (19×19) surface-mount package (525‑FBGA, FCBGA family) for compact board integration.
  • Qualification and temperature range — Automotive grade with AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C.

Typical Applications

  • Automotive gateways and controllers — Multi-core processing and multiple 1/2.5 Gb/s Ethernet interfaces enable secure, high-speed in-vehicle networking and gateway functions.
  • Embedded networking appliances — Integrated Ethernet and USB connectivity combined with NEON multimedia acceleration support networked embedded nodes and protocol processing.
  • Secure communications — On-chip ARM TrustZone, cryptography, RNG and secure memory features provide hardware-backed security for communications and data protection.
  • Industrial embedded systems — Automotive qualification and −40 °C to 105 °C operating range allow deployment in temperature-challenging embedded environments.

Unique Advantages

  • Heterogeneous core mix: Combines 64‑bit and 32‑bit ARM cores to address both application and real-time/control workloads within one device.
  • High-speed networking: Four Ethernet ports with 1/2.5 Gb/s capability support demanding connectivity and data-throughput requirements.
  • Hardware security suite: Built-in TrustZone, cryptography, RNG and secure memory features enable robust device-level security and secure boot architectures.
  • Memory flexibility: DDR3L and LPDDR4 memory controller support provides designers choice in memory performance and power tradeoffs.
  • Automotive readiness: AEC‑Q100 qualification and automotive grade designation support deployment in automotive and similarly demanding applications.
  • Wide operating range: −40 °C to 105 °C temperature rating for reliable operation across harsh environments.

Why Choose S32G233AABK1VUCR?

The S32G233AABK1VUCR positions itself as a versatile embedded microprocessor for designs that require mixed 64‑bit and 32‑bit processing, multi-gigabit networking, and hardware-backed security — all in a single 525‑FCPBGA package. With DDR3L/LPDDR4 memory support, USB OTG and multiple Ethernet interfaces, it provides the integration needed to reduce external component count while addressing connectivity and performance needs.

With AEC‑Q100 qualification and an extended operating temperature range, this device is suited for automotive and other rugged embedded applications that demand reliability and long-term operational stability.

Request a quote or contact sales to discuss pricing, lead times and how the S32G233AABK1VUCR can fit into your next embedded or automotive design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up