S32G233ASBK0VUCR

S32G233A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 175 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233ASBK0VUCR – ARM Cortex‑M7 and Cortex‑A53 Microprocessor

The S32G233ASBK0VUCR is a microprocessor from NXP Semiconductors combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a single high-integration device. The part is presented with both 32‑bit and 64‑bit processing architectures and frequency points referenced in the product description.

Designed for embedded and automotive system use, the device integrates multi-port Ethernet, memory controllers, security features and a compact 525‑FCPBGA (19×19) package to address networked, secure and temperature‑challenging applications.

Key Features

  • Core Architecture Dual-architecture design featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 processors, providing both 64‑bit and 32‑bit processing options as listed in the product description.
  • Performance Points Frequency information is provided in the product description and reflects 400 MHz and 1 GHz operating points for the listed cores.
  • Memory Interfaces Integrated RAM controllers for DDR3L and LPDDR4 memories enable flexible system memory choices and high-bandwidth data handling.
  • Ethernet Connectivity Four GbE ports provide multi‑port wired networking capability for high-throughput embedded networking tasks.
  • USB and Peripheral DMA USB 2.0 OTG is available for host/device connectivity and DMA support is provided for efficient data movement.
  • Security Features On‑chip security building blocks include ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC to support secure system designs.
  • Automotive Qualification & Temperature Range AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C support deployment in automotive and other harsh environments.
  • Package & Mounting Supplied in a 525‑FCPBGA (19×19) surface‑mount package (525‑FBGA / FCBGA style), suitable for compact board designs.
  • Regulatory RoHS compliant.

Typical Applications

  • Automotive networking and gateways — Multi‑GbE ports and AEC‑Q100 qualification make the device suitable for in‑vehicle networking, domain controllers and gateway functions.
  • Secure embedded controllers — On‑chip TrustZone, cryptography, RNG and secure memory support secure boot, trusted execution and protected storage in embedded systems.
  • Industrial connectivity and edge nodes — DDR3L/LPDDR4 memory support, multi‑port Ethernet and DMA enable real‑time data aggregation and edge processing in industrial applications.

Unique Advantages

  • Heterogeneous core combination: ARM Cortex‑A53 and Cortex‑M7 architectures in one device provide flexibility to partition high‑level application tasks and real‑time control functions.
  • Integrated wired networking: Four Gigabit Ethernet interfaces reduce external components for multi‑port networking designs.
  • Comprehensive security: Multiple security primitives (ARM TZ, cryptography, RNG, secure fusebox, secure memory, XRDC) support layered protection schemes.
  • Automotive‑grade qualification: AEC‑Q100 qualification and wide operating temperature range (−40 °C to 105 °C) support deployment in automotive environments.
  • Memory flexibility: Support for DDR3L and LPDDR4 memory controllers allows designers to select the memory technology that matches performance and cost targets.
  • Compact BGA packaging: The 525‑FCPBGA (19×19) package enables dense PCB layouts while maintaining surface‑mount assembly compatibility.

Why Choose S32G233ASBK0VUCR?

The S32G233ASBK0VUCR positions itself as an integrated solution for embedded systems that require a combination of application‑level processing and real‑time control, while also addressing networking and security requirements. Its mix of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multi‑port GbE, memory controller support and automotive qualification make it suitable for designs where processing diversity, connectivity and reliability are central.

Engineers building automotive or industrial networked systems can leverage the device’s security features, qualified temperature range and compact package to achieve robust, scalable designs aligned with industry requirements.

Request a quote or contact sales to discuss pricing, availability and how S32G233ASBK0VUCR can fit into your next design.

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