S32G234MABK0VUCR

S32G234M ARM CORTEX-M7, HSE, LLC
Part Description

ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19)

Quantity 885 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G234
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32/64-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed400MHzSupplier Device Package525-FCPBGA (19×19)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G234MABK0VUCR – S32G234M ARM CORTEX‑M7, HSE, LLC

The S32G234MABK0VUCR is an NXP Semiconductors S32G234 series microprocessor IC featuring an ARM® Cortex®‑M7 core architecture. It is a 3‑core, 32/64‑bit device running at 400 MHz in a 525‑FCPBGA (19×19) package.

Designed for embedded applications that demand multi‑core performance, integrated high‑speed networking and hardware security, the device offers four Gigabit Ethernet interfaces and a suite of security features. The part is automotive‑grade and AEC‑Q100 qualified, with an operating temperature range of ‑40 °C to 105 °C and RoHS compliance.

Key Features

  • Core and Performance ARM® Cortex®‑M7 architecture with a 3‑core, 32/64‑bit configuration and a 400 MHz operating frequency for deterministic embedded processing.
  • Co‑Processors / Multimedia Integrated multimedia and NEON capabilities to accelerate DSP and media processing workloads.
  • High‑Speed Networking Four Gigabit Ethernet (GbE) interfaces for multi‑port network connectivity and high‑throughput data paths.
  • Hardware Security On‑chip cryptography, a random number generator, secure fusebox, secure memory, and XRDC for isolated resource control and protection.
  • System Interfaces Integrated DMA support to improve data movement efficiency between peripherals and memory.
  • Package and Mounting 525‑FCPBGA (19×19) FCBGA package in a surface‑mount form factor suitable for compact board designs.
  • Automotive Qualification & Temperature Automotive grade with AEC‑Q100 qualification and an operating temperature range of ‑40 °C to 105 °C for use in harsh environments.
  • Regulatory Compliance RoHS compliant.

Typical Applications

  • Automotive Networking — Multi‑GbE interfaces and automotive qualification make this device suitable for vehicle network controllers and communication subsystems.
  • Secure Embedded Systems — Built‑in cryptography, RNG, secure fusebox and secure memory support designs that require hardware security and isolation.
  • Embedded Signal Processing — Multi‑core Cortex‑M7 plus NEON/multimedia co‑processors provide compute capacity for real‑time processing tasks.
  • Harsh‑Environment Embedded Devices — AEC‑Q100 qualification and a wide operating temperature range support deployment in demanding conditions.

Unique Advantages

  • High multi‑core performance: A 3‑core ARM® Cortex®‑M7 design running at 400 MHz delivers scalable embedded compute capacity.
  • Integrated multi‑port Ethernet: Four GbE interfaces reduce the need for external networking components and simplify system architecture.
  • Comprehensive hardware security: On‑chip cryptography, RNG, secure fusebox, secure memory and XRDC provide layered protection for sensitive applications.
  • Automotive‑grade reliability: AEC‑Q100 qualification ensures the device meets automotive stress and quality requirements.
  • Wide temperature tolerance: Rated from ‑40 °C to 105 °C for reliable operation in temperature‑extreme environments.
  • Compact surface‑mount package: 525‑FCPBGA (19×19) packaging supports dense, space‑constrained board layouts.

Why Choose S32G234MABK0VUCR?

The S32G234MABK0VUCR positions itself as a performance‑oriented, highly integrated microprocessor for embedded and automotive applications. Its combination of a 3‑core ARM® Cortex®‑M7 architecture, multi‑GbE connectivity and robust on‑chip security features offers a balanced solution for designs that require compute, networking and protection in a single device.

As part of the NXP S32G234 series and backed by NXP Semiconductors, the device is suited to engineers developing automotive or embedded systems that demand AEC‑Q100 qualification, deterministic processing and compact packaging for production‑grade deployments.

Request a quote or submit a procurement inquiry for S32G234MABK0VUCR to receive pricing and availability information.

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