S32G233ASBK1VUCT

S32G233A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 1,369 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time21 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233ASBK1VUCT – ARM Cortex‑M7 and Cortex‑A53 Microprocessor

The S32G233ASBK1VUCT is a dual‑architecture microprocessor featuring ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores designed for embedded systems. It combines heterogeneous processing elements, hardware security primitives, multiple high‑speed interfaces, and automotive‑grade qualification for use in demanding environments.

Targeted at embedded and automotive applications, the device delivers a mix of 64‑bit and 32‑bit processing, integrated memory controller support, multi‑Gbit Ethernet connectivity, and a package and temperature range suitable for robust system designs.

Key Features

  • Processor Cores  ARM® Cortex®‑A53 and ARM® Cortex®‑M7 core combination with multi‑core configuration listed as "1 Core, 64‑Bit/2 Core, 32‑Bit".
  • Performance  Operating frequencies documented at 1 GHz and 400 MHz to support a range of control and application processing tasks.
  • Memory Interfaces  Integrated controllers for DDR3L and LPDDR4 memory technologies to support system memory requirements.
  • Network Connectivity  High‑speed Ethernet capability listed as 1/2.5 Gbps (4) to enable multiport networked designs.
  • USB  Includes USB 2.0 OTG (1) for host/device USB connectivity.
  • Security  On‑chip security features include ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for hardware‑assisted isolation.
  • Co‑processing  Multimedia and NEON DSP capabilities for accelerated signal and media processing workloads.
  • Package and Mounting  525‑FCPBGA (19×19) FCBGA package in a surface‑mount form factor for integration into compact assemblies.
  • Automotive Qualification & Temperature  Grade listed as Automotive with AEC‑Q100 qualification and an operating temperature range of −40 °C to 105 °C for use in temperature‑stressed environments.
  • Standards & Compliance  RoHS compliant, supporting environmental regulatory requirements.

Typical Applications

  • Automotive Systems  Automotive‑grade qualification and wide operating temperature make the device suitable for electronic control units and networked vehicle modules.
  • Embedded Networking  Multiport 1/2.5 Gbps Ethernet and integrated security features suit gateways, routers, and edge network processors.
  • Secure Edge Processing  Hardware cryptography, TrustZone, and secure memory enable secure data handling and trusted execution at the edge.
  • Industrial Embedded Control  Heterogeneous core options and support for DDR3L/LPDDR4 memory provide flexibility for real‑time control and application processing in industrial equipment.

Unique Advantages

  • Heterogeneous Processing: Combines ARM Cortex‑A53 and Cortex‑M7 cores for flexible partitioning of application and control tasks across 64‑bit and 32‑bit domains.
  • Integrated Networking: Multiport 1/2.5 Gbps Ethernet capability supports high‑throughput, multiport network designs without added external controllers.
  • Robust Security Building Blocks: On‑chip cryptography, RNG, TrustZone, secure fusebox, and XRDC provide multiple layers of hardware security for sensitive applications.
  • Automotive‑Grade Reliability: AEC‑Q100 qualification and −40 °C to 105 °C operating range address reliability needs for temperature‑challenging deployments.
  • Memory Flexibility: Support for DDR3L and LPDDR4 memory types enables designers to choose memory solutions that match performance and power targets.
  • Compact Packaging: 525‑FCPBGA (19×19) package supports high integration in space‑constrained system designs.

Why Choose S32G233ASBK1VUCT?

The S32G233ASBK1VUCT combines mixed 64‑bit and 32‑bit processing, high‑speed networking, and comprehensive hardware security in an automotive‑qualified package. Its combination of multicore processing, memory controller flexibility, and multi‑Gbit Ethernet makes it suited to embedded and vehicle‑grade systems that require integrated connectivity and security.

This device is appropriate for engineers designing networked embedded systems, automotive ECUs, and secure edge processors who need a qualified, compact, and feature‑rich microprocessor platform with clear hardware security primitives and memory interface options.

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