S32G233AABK1VUCT

S32G233A ARM CORTEX-M7 AND -A53
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 415 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceUnknown
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233AABK1VUCT – ARM Cortex-A53 and Cortex-M7 Microprocessor

The S32G233AABK1VUCT from NXP Semiconductors is a mixed‑architecture microprocessor combining 64‑bit and 32‑bit processing capability in a single device. It features ARM® Cortex®‑A53 and ARM® Cortex®‑M7 architectures and is presented for embedded applications requiring integrated processing, connectivity and security.

Designed for embedded and automotive‑grade systems, the device pairs high‑speed processing points (1 GHz and 400 MHz), multiple high‑speed Ethernet interfaces and comprehensive security features to address connected, safety‑conscious designs.

Key Features

  • Core Architecture  Includes 1 core with 64‑bit bus width and 2 cores with 32‑bit bus width, providing a mix of application and real‑time processing capabilities in one device.
  • Performance  Operating points include 1 GHz and 400 MHz to support a range of processing tasks across cores.
  • Memory Interfaces  On‑chip controllers for DDR3L and LPDDR4 memory enable flexible system memory configurations.
  • Connectivity  Up to four Ethernet ports supporting 1/2.5 Gbps operation and one USB 2.0 OTG interface provide high bandwidth I/O for networked applications.
  • Security  Integrated security capabilities include ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for hardware‑level isolation.
  • Co‑processing  Multimedia and NEON co‑processor support for acceleration of media and SIMD workloads.
  • System Interfaces  Includes DMA and other embedded interfaces to simplify data movement and peripheral integration.
  • Package & Mounting  Supplied in a 525‑FCPBGA (19×19) FCBGA package for surface‑mount assembly.
  • Operating Range & Qualification  Rated for operation from −40 °C to 105 °C and qualified to AEC‑Q100; RoHS compliant.
  • Graphics  No graphics acceleration included, focusing device resources on processing, connectivity and security.

Typical Applications

  • Automotive networking and gateways  Multi‑port Ethernet and AEC‑Q100 qualification make this device suitable for in‑vehicle networking and domain gateway functions.
  • Industrial connectivity appliances  High‑speed Ethernet and robust security features support industrial edge gateways and secure communications.
  • Embedded control and processing  Mixed 64‑bit and 32‑bit cores allow consolidation of application and control tasks in compact embedded systems.
  • Secure communication endpoints  On‑chip cryptography, RNG and secure memory enable protected data transactions and secure boot/firmware flows.

Unique Advantages

  • Heterogeneous processing in one package: Combines 64‑bit and 32‑bit cores to consolidate application and control workloads, reducing system complexity.
  • Integrated high‑speed networking: Four Ethernet ports with 1/2.5 Gbps capability deliver the bandwidth needed for modern connected applications.
  • Comprehensive hardware security: Multiple built‑in security primitives (TrustZone, cryptography, RNG, fusebox, secure memory, XRDC) support layered protection strategies.
  • Automotive‑grade qualification: AEC‑Q100 qualification and extended temperature rating support deployment in demanding automotive and industrial environments.
  • Flexible memory support: DDR3L and LPDDR4 controller support enables designers to choose memory technologies that match performance and cost targets.
  • Compact surface‑mount package: 525‑FCPBGA (19×19) package offers high pin density for rich I/O in a compact footprint.

Why Choose S32G233AABK1VUCT?

The S32G233AABK1VUCT positions itself as a versatile, automotive‑qualified embedded microprocessor combining mixed‑architecture compute, multi‑gigabit networking and robust security features from NXP Semiconductors. Its blend of 64‑bit and 32‑bit cores, supported memory interfaces and multiple Ethernet ports make it suitable for designs that require integration of application processing, control tasks and secure communications.

With AEC‑Q100 qualification, extended temperature rating and RoHS compliance, the device targets long‑lifecycle, reliability‑focused deployments where integration and hardware security reduce BOM and streamline system design.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the S32G233AABK1VUCT. Our team can help with procurement and configuration details to match your project requirements.

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