S32G234MSBK0VUCR
| Part Description |
ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 190 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G234 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GbE (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 32/64-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | ||
| Speed | 400MHz | Supplier Device Package | 525-FCPBGA (19×19) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G234MSBK0VUCR – S32G234M ARM CORTEX‑M7, HSE W/PR
The S32G234MSBK0VUCR is an ARM® Cortex®‑M7 microprocessor IC featuring a 3‑core, 32/64‑bit architecture running at 400 MHz. It targets embedded and automotive designs that require multi‑core processing, networking connectivity and integrated security.
Qualified to AEC‑Q100 and specified for operation from ‑40 °C to 105 °C, this device combines on‑chip multimedia/NEON co‑processing, multiple Gigabit Ethernet interfaces, and a suite of hardware security functions to support robust, networked embedded systems.
Key Features
- Core and Performance 3‑core ARM® Cortex®‑M7 architecture with 32/64‑bit support and a 400 MHz operating frequency for concurrent embedded processing tasks.
- Co‑Processors Integrated multimedia and NEON co‑processors to accelerate signal and media processing workloads.
- Ethernet Connectivity Four Gigabit Ethernet (GbE) interfaces to support high‑bandwidth networked applications.
- Security Subsystem Hardware security features including cryptography engines, a random number generator, secure fusebox, secure memory, and XRDC for access control.
- Interfaces and System Support On‑chip DMA and additional interfaces to simplify data movement and peripheral integration.
- Automotive Qualification AEC‑Q100 qualification and an automotive grade designation suitable for vehicle electronics design flows.
- Package and Mounting 525‑FCPBGA supplier device package (19 × 19 mm) in a surface‑mount format for high‑density board designs.
- Operating Range and Compliance Industrial/automotive operating temperature range of ‑40 °C to 105 °C and RoHS compliance for environmental restriction requirements.
Typical Applications
- Automotive Embedded Systems Use in vehicle control and electronic subsystems where AEC‑Q100 qualification and extended temperature operation are required.
- In‑Vehicle Networking and Gateways Multi‑GbE interfaces enable high‑bandwidth network aggregation and communication tasks between domains.
- Secure Communications Hardware cryptography, secure memory and RNG support secure data handling and encrypted channels in embedded networks.
- High‑Performance Embedded Processing Multi‑core Cortex‑M7 plus NEON/multimedia co‑processing for concurrent control, signal processing and data‑path tasks.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 certification and a specified ‑40 °C to 105 °C operating range support deployment in vehicle environments.
- Multi‑core throughput: Three ARM® Cortex®‑M7 cores at 400 MHz enable parallel processing for complex embedded workloads.
- Integrated security: On‑chip cryptography, RNG, secure fusebox, secure memory and XRDC provide layered hardware security primitives.
- High‑bandwidth networking: Four Gigabit Ethernet interfaces simplify design of networked systems and gateways.
- Compact, surface‑mount package: 525‑FCPBGA (19 × 19 mm) package supports high‑density PCB layouts and automated assembly.
- Standards compliance: RoHS compliance supports environmental and regulatory requirements for production.
Why Choose S32G234MSBK0VUCR?
The S32G234MSBK0VUCR positions multi‑core Cortex‑M7 performance alongside extensive networking and hardware security features, packaged and qualified for automotive use. Its combination of three 32/64‑bit cores, NEON/multimedia co‑processing, four GbE interfaces and secure hardware elements addresses designs that require concurrent processing, secure communications and robust connectivity.
Backed by NXP Semiconductors, this device is suited for engineers developing automotive and embedded networked systems that need a balanced mix of performance, integration and temperature‑rated reliability for long‑term deployments.
Request a quote or submit a sales inquiry to learn more about availability, lead times and volume pricing for the S32G234MSBK0VUCR.

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