S32G234MSBK1VUCT

S32G234M ARM CORTEX-M7, HSE W/PR
Part Description

ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19)

Quantity 787 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G234
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet1/2.5Gbps (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 32/64-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
REACH ComplianceREACH UnaffectedRoHS ComplianceUnknownSecurity FeaturesCryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Speed400MHzSupplier Device Package525-FCPBGA (19×19)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G234MSBK1VUCT – S32G234M ARM CORTEX-M7, HSE W/PR

The S32G234MSBK1VUCT is an ARM® Cortex®-M7 microprocessor IC from NXP Semiconductors featuring a 3-core, 32/64-bit architecture running at 400 MHz. It is provided in a 525-FCPBGA (19×19) surface-mount package and is targeted at automotive-grade embedded applications where multi-core processing, high-speed networking and on-chip security are required.

With integrated Ethernet capability, dedicated multimedia/NEON co-processing and a comprehensive set of security features, this device is designed to combine performance, system integration and qualification for demanding operational environments.

Key Features

  • Core Architecture Triple ARM® Cortex®-M7 cores, 32/64-bit operation at 400 MHz to address parallel embedded processing tasks.
  • Co-Processors / DSP Multimedia and NEON support for accelerated signal processing and compute-heavy workloads.
  • Connectivity (Ethernet) 1/2.5Gbps Ethernet (4) interfaces for high-speed networking and data transport.
  • Security Features On-chip cryptography, random number generator, secure fusebox, secure memory and XRDC for hardware-based security and isolation.
  • Interfaces and System Includes DMA and other embedded interfaces to support efficient data movement and system integration.
  • Package & Mounting 525-FCPBGA (19×19) package case, surface mount, supplied in a 525-FBGA/FCBGA family package.
  • Operating Range Qualified for operation from -40 °C to 105 °C to meet broad embedded environmental requirements.
  • Qualification & Grade Automotive grade with AEC-Q100 qualification.
  • Graphics No graphics acceleration.

Typical Applications

  • Automotive systems — Suited for automotive embedded systems that require AEC-Q100 qualification and extended temperature operation from -40 °C to 105 °C.
  • In-vehicle networking — Provides 1/2.5Gbps Ethernet interfaces (4) to support high-speed vehicle networking and data exchange.
  • Secure embedded processing — Built-in cryptography, secure memory and XRDC enable hardware-level security for sensitive in-vehicle functions.

Unique Advantages

  • Multi-core performance: Three ARM® Cortex®-M7 cores at 400 MHz enable parallel task execution and improved throughput for embedded workloads.
  • Integrated security: Comprehensive security features reduce the need for external security components and simplify system-level secure design.
  • High-speed Ethernet support: 1/2.5Gbps Ethernet interfaces (4) provide robust bandwidth for in-vehicle communication and data aggregation.
  • Automotive qualification: AEC-Q100 qualification and automotive grade designation support deployment in regulated automotive environments.
  • Wide temperature operation: Rated from -40 °C to 105 °C to support demanding thermal conditions typical of embedded automotive applications.

Why Choose S32G234MSBK1VUCT?

The S32G234MSBK1VUCT positions itself where multi-core processing performance, integrated networking and hardware security converge for automotive-grade embedded designs. Its combination of three Cortex-M7 cores, multimedia/NEON co-processing and multiple Ethernet interfaces addresses designs that require parallel processing, high data throughput and secure operation.

Manufactured by NXP Semiconductors and supplied in a 525-FCPBGA (19×19) surface-mount package with AEC-Q100 qualification and extended temperature support, this device is suitable for engineers building scalable, robust automotive embedded systems that prioritize integration, security and reliable network connectivity.

Request a quote or contact sales to discuss availability, pricing and to submit RFQs for the S32G234MSBK1VUCT.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up