S32G234MSBK1VUCT
| Part Description |
ARM® Cortex®-M7 Microprocessor IC - 3 Core, 32/64-Bit 400MHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 787 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G234 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | 1/2.5Gbps (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 32/64-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | Unknown | Security Features | Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | ||
| Speed | 400MHz | Supplier Device Package | 525-FCPBGA (19×19) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G234MSBK1VUCT – S32G234M ARM CORTEX-M7, HSE W/PR
The S32G234MSBK1VUCT is an ARM® Cortex®-M7 microprocessor IC from NXP Semiconductors featuring a 3-core, 32/64-bit architecture running at 400 MHz. It is provided in a 525-FCPBGA (19×19) surface-mount package and is targeted at automotive-grade embedded applications where multi-core processing, high-speed networking and on-chip security are required.
With integrated Ethernet capability, dedicated multimedia/NEON co-processing and a comprehensive set of security features, this device is designed to combine performance, system integration and qualification for demanding operational environments.
Key Features
- Core Architecture Triple ARM® Cortex®-M7 cores, 32/64-bit operation at 400 MHz to address parallel embedded processing tasks.
- Co-Processors / DSP Multimedia and NEON support for accelerated signal processing and compute-heavy workloads.
- Connectivity (Ethernet) 1/2.5Gbps Ethernet (4) interfaces for high-speed networking and data transport.
- Security Features On-chip cryptography, random number generator, secure fusebox, secure memory and XRDC for hardware-based security and isolation.
- Interfaces and System Includes DMA and other embedded interfaces to support efficient data movement and system integration.
- Package & Mounting 525-FCPBGA (19×19) package case, surface mount, supplied in a 525-FBGA/FCBGA family package.
- Operating Range Qualified for operation from -40 °C to 105 °C to meet broad embedded environmental requirements.
- Qualification & Grade Automotive grade with AEC-Q100 qualification.
- Graphics No graphics acceleration.
Typical Applications
- Automotive systems — Suited for automotive embedded systems that require AEC-Q100 qualification and extended temperature operation from -40 °C to 105 °C.
- In-vehicle networking — Provides 1/2.5Gbps Ethernet interfaces (4) to support high-speed vehicle networking and data exchange.
- Secure embedded processing — Built-in cryptography, secure memory and XRDC enable hardware-level security for sensitive in-vehicle functions.
Unique Advantages
- Multi-core performance: Three ARM® Cortex®-M7 cores at 400 MHz enable parallel task execution and improved throughput for embedded workloads.
- Integrated security: Comprehensive security features reduce the need for external security components and simplify system-level secure design.
- High-speed Ethernet support: 1/2.5Gbps Ethernet interfaces (4) provide robust bandwidth for in-vehicle communication and data aggregation.
- Automotive qualification: AEC-Q100 qualification and automotive grade designation support deployment in regulated automotive environments.
- Wide temperature operation: Rated from -40 °C to 105 °C to support demanding thermal conditions typical of embedded automotive applications.
Why Choose S32G234MSBK1VUCT?
The S32G234MSBK1VUCT positions itself where multi-core processing performance, integrated networking and hardware security converge for automotive-grade embedded designs. Its combination of three Cortex-M7 cores, multimedia/NEON co-processing and multiple Ethernet interfaces addresses designs that require parallel processing, high data throughput and secure operation.
Manufactured by NXP Semiconductors and supplied in a 525-FCPBGA (19×19) surface-mount package with AEC-Q100 qualification and extended temperature support, this device is suitable for engineers building scalable, robust automotive embedded systems that prioritize integration, security and reliable network connectivity.
Request a quote or contact sales to discuss availability, pricing and to submit RFQs for the S32G234MSBK1VUCT.

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