S32G233AABK0CUCR

S32G233A ARM CORTEX-M7 AND -A53
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 1 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 762 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G233
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G233AABK0CUCR – ARM CORTEX-M7 AND -A53

The S32G233AABK0CUCR is a microprocessor IC from NXP Semiconductors featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 processor cores. It is presented as a multi-core solution combining 64‑bit and 32‑bit architectures in a single device.

Designed for embedded and automotive applications, the device integrates multi-GbE connectivity, memory controller support and a comprehensive hardware security feature set, together with automotive grading and AEC‑Q100 qualification for use in demanding environments.

Key Features

  • Core architecture  ARM® Cortex®-A53 and ARM® Cortex®-M7 processor cores; documented as 1 Core, 64‑Bit and 2 Core, 32‑Bit configurations.
  • Operating frequencies  Frequencies referenced in the product data include 400 MHz and 1 GHz.
  • Memory controllers  Integrated controllers for DDR3L and LPDDR4 memory types.
  • High-speed networking  Four GbE ports and one USB 2.0 OTG interface provide multiple high-bandwidth connectivity options; DMA support is available for efficient data movement.
  • Security features  Hardware security capabilities include ARM TrustZone, cryptography accelerators, a random number generator, secure fusebox, secure memory and XRDC.
  • Co-processors / DSP  Multimedia and NEON capabilities are indicated for advanced data processing tasks.
  • Package & mounting  525‑FCPBGA (19×19) supplier device package; also listed as 525‑FBGA / FCBGA; surface-mount mounting type.
  • Qualification & grade  Automotive grade device with AEC‑Q100 qualification.
  • Operating range & compliance  Operating temperature range of −40 °C to 85 °C and RoHS compliant.

Typical Applications

  • Automotive systems  Suitable for automotive electronic applications that require AEC‑Q100 qualification combined with multi-core processing and on-chip connectivity.
  • In-vehicle networking  Four Gigabit Ethernet interfaces support high-bandwidth in-vehicle network topologies and data routing tasks.
  • Industrial embedded systems  Multi-core processing, robust temperature range and memory controller support enable deployment in embedded industrial environments.
  • Secure connectivity gateways  On-chip security primitives and cryptographic features make the device appropriate for applications requiring hardware-based security and secure communications.

Unique Advantages

  • Automotive-qualified platform: AEC‑Q100 qualification and automotive grade designation support use in automotive environments.
  • Dual-architecture flexibility: Combination of ARM Cortex‑A53 and Cortex‑M7 cores enables heterogeneous processing for control and application tasks.
  • Integrated networking interfaces: Four GbE ports plus USB OTG and DMA reduce the need for external networking components.
  • Comprehensive hardware security: ARM TrustZone, cryptography, RNG, secure fusebox, secure memory and XRDC provide layered security capabilities in hardware.
  • Memory compatibility: Support for DDR3L and LPDDR4 memory types gives design flexibility across performance and cost targets.
  • Surface-mount BGA package: 525‑FCPBGA (19×19) package delivers a compact form factor suitable for space-constrained board designs.

Why Choose S32G233AABK0CUCR?

The S32G233AABK0CUCR positions a multi-core ARM® solution with integrated networking, memory interfaces and a robust set of hardware security features in an automotive‑qualified package. Its combination of 64‑bit and 32‑bit cores, multiple GbE ports and memory controller support makes it well suited for embedded and automotive designs that require integrated compute, connectivity and security.

With AEC‑Q100 qualification, a −40 °C to 85 °C operating range and RoHS compliance, the device addresses long-term deployment needs in regulated and industrial environments while offering flexibility for designers targeting complex, connected systems.

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