RPIXP2400BAT

IC MPU INTEL 600MHZ 1356FCBGA
Part Description

Intel® IXP2400 Microprocessor IC Intel® IXP2400 1 Core, 32-Bit 600MHz 1356-FCBGA (37.5x37.5)

Quantity 879 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesIXP2400
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Core ProcessorIntel® IXP2400Device Package1356-FCBGA (37.5x37.5)Display & Interface ControllersLVDS
ECCN5A991GradeIndustrialGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C
Package / Case1356-BBGA, FCBGARAM ControllersDDR SDRAM, SRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed600MHzSupplier Device Package1356-FCBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of RPIXP2400BAT – IC MPU INTEL 600MHZ 1356FCBGA

The RPIXP2400BAT is an Intel® IXP2400 microprocessor in a 1356-FCBGA (37.5×37.5 mm) package featuring a single 32-bit core running at 600 MHz. Designed for embedded applications, this industrial-grade MPU integrates memory controller support and common I/O interfaces to serve systems that require sustained processing and board-level integration.

Key value propositions include a 600 MHz core performance, on-chip support for DDR SDRAM and SRAM memory types, and industrial temperature operation from −40 °C to 85 °C, making it suitable for robust embedded deployments.

Key Features

  • Core  The Intel® IXP2400 single 32‑bit core runs at 600 MHz to provide deterministic processing for embedded workloads.
  • Memory  Integrated controllers for DDR SDRAM and SRAM enable flexible system memory architectures and support common board-level memory choices.
  • Interfaces  Supports LVDS display interface controllers and includes PCI as an additional interface for peripheral connectivity.
  • Power and I/O  3.3 V I/O voltage compatibility for standard peripheral signaling and board-level design alignment.
  • Package and Mounting  Supplied in a 1356‑FCBGA (37.5×37.5 mm) package with surface-mount mounting type for high-density board layouts.
  • Industrial Grade  Rated for an operating temperature range of −40 °C to 85 °C, suited to demanding environmental conditions.

Typical Applications

  • Embedded systems  Use the IXP2400 core for general-purpose embedded processing where a 600 MHz 32‑bit MPU is required.
  • Memory‑centric designs  Systems that rely on DDR SDRAM or SRAM can utilize the integrated memory controllers for streamlined memory interfaces.
  • Display and I/O subsystems  Designs requiring LVDS display interfaces or PCI connectivity can leverage the MPU’s supported interfaces.
  • Industrial equipment  Applications operating across extended temperatures can take advantage of the device’s industrial-grade temperature rating.

Unique Advantages

  • Deterministic 600 MHz processing: Single 32‑bit core tuned for embedded workloads that need steady processing throughput.
  • Flexible memory support: Native DDR SDRAM and SRAM controller compatibility reduces external logic and simplifies memory subsystem design.
  • Standard I/O compatibility: 3.3 V I/O simplifies integration with common peripherals and board-level interfaces.
  • Rich interface options: LVDS and PCI support enable both display and high-speed peripheral connectivity without additional bridge components.
  • Industrial temperature capability: −40 °C to 85 °C rating supports deployments in harsh environmental conditions.
  • Surface-mount FCBGA package: 1356‑ball FCBGA footprint allows compact, high-density PCB implementation.

Why Choose RPIXP2400BAT?

The RPIXP2400BAT positions itself as a purpose-built MPU for embedded and industrial applications that require a 600 MHz Intel® IXP2400 core combined with integrated memory controllers and common I/O interfaces. Its industrial temperature range and 1356‑FCBGA packaging make it suitable for designs that demand durability and compact board-level integration.

This part is a fit for teams designing systems that need straightforward memory interfacing (DDR SDRAM/SRAM), LVDS display connectivity, and PCI peripheral support while operating across extended temperatures. The Intel® IXP2400 series heritage and the device’s integration help simplify BOM and layout considerations for embedded product development.

Request a quote or submit a purchase inquiry to receive pricing and availability for the RPIXP2400BAT. Our team can provide lead-time information and support for volume requirements.

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