RPIXP2400BAT
| Part Description |
Intel® IXP2400 Microprocessor IC Intel® IXP2400 1 Core, 32-Bit 600MHz 1356-FCBGA (37.5x37.5) |
|---|---|
| Quantity | 879 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | IXP2400 |
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | Intel® IXP2400 | Device Package | 1356-FCBGA (37.5x37.5) | Display & Interface Controllers | LVDS | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991 | Grade | Industrial | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C | ||
| Package / Case | 1356-BBGA, FCBGA | RAM Controllers | DDR SDRAM, SRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 600MHz | Supplier Device Package | 1356-FCBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of RPIXP2400BAT – IC MPU INTEL 600MHZ 1356FCBGA
The RPIXP2400BAT is an Intel® IXP2400 microprocessor in a 1356-FCBGA (37.5×37.5 mm) package featuring a single 32-bit core running at 600 MHz. Designed for embedded applications, this industrial-grade MPU integrates memory controller support and common I/O interfaces to serve systems that require sustained processing and board-level integration.
Key value propositions include a 600 MHz core performance, on-chip support for DDR SDRAM and SRAM memory types, and industrial temperature operation from −40 °C to 85 °C, making it suitable for robust embedded deployments.
Key Features
- Core The Intel® IXP2400 single 32‑bit core runs at 600 MHz to provide deterministic processing for embedded workloads.
- Memory Integrated controllers for DDR SDRAM and SRAM enable flexible system memory architectures and support common board-level memory choices.
- Interfaces Supports LVDS display interface controllers and includes PCI as an additional interface for peripheral connectivity.
- Power and I/O 3.3 V I/O voltage compatibility for standard peripheral signaling and board-level design alignment.
- Package and Mounting Supplied in a 1356‑FCBGA (37.5×37.5 mm) package with surface-mount mounting type for high-density board layouts.
- Industrial Grade Rated for an operating temperature range of −40 °C to 85 °C, suited to demanding environmental conditions.
Typical Applications
- Embedded systems Use the IXP2400 core for general-purpose embedded processing where a 600 MHz 32‑bit MPU is required.
- Memory‑centric designs Systems that rely on DDR SDRAM or SRAM can utilize the integrated memory controllers for streamlined memory interfaces.
- Display and I/O subsystems Designs requiring LVDS display interfaces or PCI connectivity can leverage the MPU’s supported interfaces.
- Industrial equipment Applications operating across extended temperatures can take advantage of the device’s industrial-grade temperature rating.
Unique Advantages
- Deterministic 600 MHz processing: Single 32‑bit core tuned for embedded workloads that need steady processing throughput.
- Flexible memory support: Native DDR SDRAM and SRAM controller compatibility reduces external logic and simplifies memory subsystem design.
- Standard I/O compatibility: 3.3 V I/O simplifies integration with common peripherals and board-level interfaces.
- Rich interface options: LVDS and PCI support enable both display and high-speed peripheral connectivity without additional bridge components.
- Industrial temperature capability: −40 °C to 85 °C rating supports deployments in harsh environmental conditions.
- Surface-mount FCBGA package: 1356‑ball FCBGA footprint allows compact, high-density PCB implementation.
Why Choose RPIXP2400BAT?
The RPIXP2400BAT positions itself as a purpose-built MPU for embedded and industrial applications that require a 600 MHz Intel® IXP2400 core combined with integrated memory controllers and common I/O interfaces. Its industrial temperature range and 1356‑FCBGA packaging make it suitable for designs that demand durability and compact board-level integration.
This part is a fit for teams designing systems that need straightforward memory interfacing (DDR SDRAM/SRAM), LVDS display connectivity, and PCI peripheral support while operating across extended temperatures. The Intel® IXP2400 series heritage and the device’s integration help simplify BOM and layout considerations for embedded product development.
Request a quote or submit a purchase inquiry to receive pricing and availability for the RPIXP2400BAT. Our team can provide lead-time information and support for volume requirements.

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