RPIXP2800BA

IC MPU IXP2800 1GHZ 1356FCBGA
Part Description

Intel® IXP2800 Microprocessor IC IXP2800 1 Core, 32-Bit 1GHz 1356-FCBGA (37.5x37.5)

Quantity 720 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesIXP2800
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Core ProcessorIntel® IXP2800Device Package1356-FCBGA (37.5x37.5)Display & Interface ControllersLVDS
ECCNPENDING ECCNGradeIndustrialGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C
Package / Case1356-BBGA, FCBGARAM ControllersSRAMREACH ComplianceREACH not applicable
RoHS ComplianceRoHS non-compliantSecurity Features3DES, AES, SHA-1Speed1GHz
Supplier Device Package1356-FCBGA (37.5×37.5)Voltage – I/O3.3V

Overview of RPIXP2800BA – IC MPU IXP2800 1GHZ 1356FCBGA

The RPIXP2800BA is an Intel® IXP2800 series microprocessor IC featuring a single 32-bit core running at 1 GHz. Packaged in a 1356-ball FCBGA (37.5 × 37.5 mm) and rated for industrial operation, it targets embedded system designs that require a compact, surface-mount processing solution.

Key on-chip capabilities include SRAM memory controller support, LVDS display interface controllers, PCI connectivity and hardware security functions (3DES, AES, SHA-1). The device uses 3.3 V I/O and operates across an extended temperature range from −40 °C to 85 °C, with RoHS compliance.

Key Features

  • Core & Architecture  Single Intel® IXP2800 32‑bit core running at 1 GHz, suitable for deterministic embedded compute tasks.
  • Memory Subsystem  SRAM controller support for on-board fast memory interfacing and low-latency data access.
  • Display Interface  LVDS display interface controllers integrated for direct support of LVDS display links.
  • Security Engines  Hardware security features including 3DES, AES and SHA-1 to enable cryptographic operations on-chip.
  • Peripheral Interfaces  PCI interface available for peripheral connectivity and system expansion.
  • Package & Mounting  1356‑FBGA (1356‑FCBGA) 37.5 × 37.5 mm package, designed for surface-mount assembly.
  • Power & I/O  Standard 3.3 V I/O signaling for compatibility with common embedded peripherals.
  • Industrial Temperature Range  Rated for −40 °C to 85 °C operation for deployment in industrial environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Embedded Systems  Industrial control and automation designs that require a rugged, industrial‑grade processor with extended temperature capability.
  • LVDS Display Systems  Embedded display controllers and interfaces leveraging the integrated LVDS display interface controllers.
  • Secure Embedded Appliances  Applications needing on-chip cryptographic support using 3DES, AES and SHA-1 for data protection functions.
  • PCI‑Connected Peripherals  Systems that require PCI connectivity for expansion or high‑speed peripheral interfacing.

Unique Advantages

  • Industrial temperature rating: Rated from −40 °C to 85 °C to support deployment in temperature‑sensitive embedded environments.
  • Integrated cryptographic support: On-chip 3DES, AES and SHA-1 engines reduce external security hardware and simplify secure design.
  • Compact FCBGA package: 1356‑ball FCBGA (37.5 × 37.5 mm) provides a high‑density, surface‑mount footprint for space-constrained boards.
  • Standard 3.3 V I/O: Compatible I/O voltage simplifies integration with common embedded peripherals and interfaces.
  • Dedicated display and memory controllers: LVDS display interface and SRAM controller support streamline system architecture for display and memory subsystems.
  • RoHS compliant: Environmentally compliant manufacturing support for regulated markets.

Why Choose RPIXP2800BA?

The RPIXP2800BA combines a 1 GHz Intel® IXP2800 core with integrated security, LVDS display controllers and SRAM interface support in a rugged industrial‑grade FCBGA package. Its 3.3 V I/O and PCI connectivity make it suitable for embedded designs that require a compact, surface‑mount processor with on‑chip cryptographic capabilities and extended temperature operation.

This part is well suited for engineering teams designing industrial embedded systems, display‑centric devices, secure appliances or PCI‑based peripheral platforms that need a specific set of integrated interfaces and industrial reliability backed by Intel’s IXP2800 series architecture.

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