S32G254ASBK0VUCR

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 301 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254ASBK0VUCR – ARM Cortex‑A53 and Cortex‑M7 Microprocessor

The S32G254ASBK0VUCR is a microprocessor IC combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 core architectures. The device lists multi‑core configurations (3 core, 64‑bit and 2 core, 32‑bit) with operating frequencies shown at 400 MHz and 1 GHz.

Designed for embedded and automotive-grade applications, this device integrates multi‑core processing, multi‑port Ethernet and hardware security features to address embedded communication and secure compute tasks in constrained environments.

Key Features

  • Core Architecture  ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores delivered in a multi‑core configuration (3 core, 64‑bit / 2 core, 32‑bit) with documented operating frequencies of 400 MHz and 1 GHz.
  • Co‑Processors  Includes multimedia and NEON co‑processor support for accelerated signal and data processing workloads.
  • Memory Interfaces  Integrated RAM controllers supporting DDR3L and LPDDR4 memory types to accommodate a range of external memory configurations.
  • Connectivity  Four Gigabit Ethernet ports (GbE (4)) provide high‑bandwidth networking capability; one USB 2.0 OTG port is available for peripheral connectivity.
  • Security  Hardware security features include ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for access control.
  • Peripherals & System  Additional system interfaces include DMA for efficient data movement; graphics acceleration is not included.
  • Package & Mounting  Supplied in a 525‑FCPBGA (19×19) package, listed as a 525‑FBGA / FCBGA case, intended for surface‑mount assembly.
  • Automotive Qualification & Temperature Range  Grade: Automotive with AEC‑Q100 qualification; operating temperature range of −40 °C to 105 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • In‑vehicle networking gateways  Multi‑port Gigabit Ethernet and multi‑core processing make the device suitable for embedded networking functions in automotive systems.
  • Secure domain controllers  Built‑in security features such as ARM TrustZone, cryptography and secure memory support secure control and trusted execution environments.
  • Edge communication nodes  Heterogeneous cores and DMA support efficient protocol handling and data movement for embedded communication tasks.

Unique Advantages

  • Heterogeneous multi‑core architecture: Combines 64‑bit and 32‑bit cores in one device to address both high‑level application processing and real‑time embedded tasks.
  • Integrated networking interfaces: Four GbE ports provide high bandwidth connectivity without adding discrete PHYs for basic network topologies.
  • Comprehensive hardware security: Multiple on‑chip security primitives (TrustZone, cryptography, RNG, secure fusebox, secure memory, XRDC) reduce the need for external security components.
  • Automotive qualification: AEC‑Q100 qualification and an operating range of −40 °C to 105 °C support deployment in temperature‑sensitive automotive environments.
  • Flexible memory support: DDR3L and LPDDR4 controller support enables a range of memory performance and power tradeoffs for system designers.

Why Choose S32G254ASBK0VUCR?

The S32G254ASBK0VUCR positions itself as a capable embedded microprocessor that combines heterogeneous ARM core architectures with multi‑port Ethernet and extensive hardware security. Its AEC‑Q100 qualification and extended operating temperature range make it suitable for demanding automotive applications that require integrated networking and trusted execution.

This device is appropriate for designs that need a balance of application‑level processing and real‑time control, integrated connectivity, and on‑chip security primitives—helping reduce system complexity while meeting automotive reliability requirements.

If you would like pricing, lead time or to submit a request for a quote, contact sales to discuss your project requirements and obtain a formal quote.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up