S32G254ASBK0VUCR
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 301 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G254 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GbE (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit/2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1GHz | Supplier Device Package | 525-FCPBGA (19×19) | ||
| USB | USB 2.0 OTG (1) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G254ASBK0VUCR – ARM Cortex‑A53 and Cortex‑M7 Microprocessor
The S32G254ASBK0VUCR is a microprocessor IC combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 core architectures. The device lists multi‑core configurations (3 core, 64‑bit and 2 core, 32‑bit) with operating frequencies shown at 400 MHz and 1 GHz.
Designed for embedded and automotive-grade applications, this device integrates multi‑core processing, multi‑port Ethernet and hardware security features to address embedded communication and secure compute tasks in constrained environments.
Key Features
- Core Architecture ARM® Cortex®‑A53 and ARM® Cortex®‑M7 cores delivered in a multi‑core configuration (3 core, 64‑bit / 2 core, 32‑bit) with documented operating frequencies of 400 MHz and 1 GHz.
- Co‑Processors Includes multimedia and NEON co‑processor support for accelerated signal and data processing workloads.
- Memory Interfaces Integrated RAM controllers supporting DDR3L and LPDDR4 memory types to accommodate a range of external memory configurations.
- Connectivity Four Gigabit Ethernet ports (GbE (4)) provide high‑bandwidth networking capability; one USB 2.0 OTG port is available for peripheral connectivity.
- Security Hardware security features include ARM TrustZone (ARM TZ), cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for access control.
- Peripherals & System Additional system interfaces include DMA for efficient data movement; graphics acceleration is not included.
- Package & Mounting Supplied in a 525‑FCPBGA (19×19) package, listed as a 525‑FBGA / FCBGA case, intended for surface‑mount assembly.
- Automotive Qualification & Temperature Range Grade: Automotive with AEC‑Q100 qualification; operating temperature range of −40 °C to 105 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- In‑vehicle networking gateways Multi‑port Gigabit Ethernet and multi‑core processing make the device suitable for embedded networking functions in automotive systems.
- Secure domain controllers Built‑in security features such as ARM TrustZone, cryptography and secure memory support secure control and trusted execution environments.
- Edge communication nodes Heterogeneous cores and DMA support efficient protocol handling and data movement for embedded communication tasks.
Unique Advantages
- Heterogeneous multi‑core architecture: Combines 64‑bit and 32‑bit cores in one device to address both high‑level application processing and real‑time embedded tasks.
- Integrated networking interfaces: Four GbE ports provide high bandwidth connectivity without adding discrete PHYs for basic network topologies.
- Comprehensive hardware security: Multiple on‑chip security primitives (TrustZone, cryptography, RNG, secure fusebox, secure memory, XRDC) reduce the need for external security components.
- Automotive qualification: AEC‑Q100 qualification and an operating range of −40 °C to 105 °C support deployment in temperature‑sensitive automotive environments.
- Flexible memory support: DDR3L and LPDDR4 controller support enables a range of memory performance and power tradeoffs for system designers.
Why Choose S32G254ASBK0VUCR?
The S32G254ASBK0VUCR positions itself as a capable embedded microprocessor that combines heterogeneous ARM core architectures with multi‑port Ethernet and extensive hardware security. Its AEC‑Q100 qualification and extended operating temperature range make it suitable for demanding automotive applications that require integrated networking and trusted execution.
This device is appropriate for designs that need a balance of application‑level processing and real‑time control, integrated connectivity, and on‑chip security primitives—helping reduce system complexity while meeting automotive reliability requirements.
If you would like pricing, lead time or to submit a request for a quote, contact sales to discuss your project requirements and obtain a formal quote.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016