S32G254ASBK0VUCT
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 477 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G254 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON | Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| ECCN | N/A | Ethernet | GbE (4) | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 3 Core, 64-Bit/2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Package / Case | 525-FBGA, FCBGA | Qualification | AEC-Q100 | ||
| RAM Controllers | DDR3L, LPDDR4 | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC | Speed | 400MHz, 1GHz | Supplier Device Package | 525-FCPBGA (19×19) | ||
| USB | USB 2.0 OTG (1) | Voltage – I/O | 1.2V, 1.8V, 2.5V, 3.3V |
Overview of S32G254ASBK0VUCT – ARM Cortex‑A53 and Cortex‑M7 Microprocessor IC, 3+2 Cores, 525‑FCPBGA (19×19)
The S32G254ASBK0VUCT from NXP Semiconductors is a multicore microprocessor IC combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processor cores. The device integrates 64‑bit and 32‑bit processing elements in a single package to address embedded and automotive applications requiring mixed high‑level and real‑time processing.
Designed for environments that require reliable operation, the device lists operating speeds of 400 MHz and 1 GHz, multiple Gigabit Ethernet ports, and integrated security features to support connected and safety‑conscious embedded systems.
Key Features
- Core Architecture Dual‑architecture multicore design with ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processor cores and a core configuration described as 3 cores (64‑bit) and 2 cores (32‑bit).
- Performance Documented operating speeds include 400 MHz and 1 GHz to cover a range of processing requirements.
- Memory Interfaces Integrated RAM controller support for DDR3L and LPDDR4 memory technologies to enable external memory expansion.
- Networking and I/O Four Gigabit Ethernet (GbE) interfaces and one USB 2.0 OTG port, plus DMA support for high‑throughput data movement.
- Security On‑chip security capabilities include ARM TrustZone (TZ), cryptography, a random number generator (RNG), secure fusebox, secure memory, and XRDC.
- Package and Mounting Supplied in a 525‑FCPBGA (19×19) package, surface‑mountable for compact board designs.
- Automotive Grade and Qualification Grade listed as Automotive with qualification specified as AEC‑Q100.
- Operating Temperature Specified operating range from −40 °C to 105 °C for deployment in temperature‑challenging environments.
- Compliance RoHS compliant.
- Graphics No graphics acceleration is present, focusing the device on compute, networking, and secure processing tasks.
Typical Applications
- Automotive Systems Suitable for automotive electronic designs that require AEC‑Q100 qualification and an extended operating temperature range from −40 °C to 105 °C.
- Embedded Networking Multi‑GbE interfaces and DMA support make the device applicable to embedded networked systems and communication modules.
- Secure Edge Processing Integrated security features such as ARM TZ, cryptography, RNG, secure fusebox, secure memory, and XRDC support secure execution and data protection.
- Memory‑Intensive Control DDR3L and LPDDR4 controller support enables external memory configurations for applications with larger datasets or buffering needs.
Unique Advantages
- Multicore Mixed‑Architecture Combines 64‑bit and 32‑bit cores in one device to consolidate high‑level and real‑time processing on a single IC.
- Rich Networking I/O Four GbE ports and USB 2.0 OTG provide flexible connectivity options for networked embedded designs.
- Comprehensive On‑Chip Security Multiple hardware security blocks reduce the need for external security components and simplify secure system design.
- Automotive Qualification AEC‑Q100 qualification and an extended temperature range align the device with automotive program requirements.
- Compact BGA Footprint 525‑FCPBGA (19×19) package enables a compact board footprint while supporting surface‑mount assembly.
- Standards‑Oriented Memory Support DDR3L and LPDDR4 controller support allows designers to choose memory types that match performance and power targets.
Why Choose S32G254ASBK0VUCT?
The S32G254ASBK0VUCT positions itself as a coordinated solution for embedded and automotive applications needing both application‑level compute and deterministic real‑time control. Its combination of 64‑bit and 32‑bit cores, documented operating speeds, multiple Gigabit Ethernet interfaces, and a suite of hardware security features make it suitable for designs that require integrated processing, connectivity, and security.
Manufactured by NXP Semiconductors and supplied in a compact 525‑FCPBGA package with AEC‑Q100 qualification and RoHS compliance, the device supports deployments where temperature range, qualification, and integrated memory and I/O support are critical considerations.
Request a quote or submit an inquiry to obtain pricing, lead‑time, and availability information for the S32G254ASBK0VUCT. Contact sales to discuss your application requirements and volume needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016