S32G254ASBK0VUCT

S32G254A ARM CORTEX-M7 AND -A53,
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 3 Core, 64-Bit/2 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 477 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G254
ManufacturerNXP USA Inc.
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernetGbE (4)GradeAutomotive
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width3 Core, 64-Bit/2 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case525-FBGA, FCBGAQualificationAEC-Q100
RAM ControllersDDR3L, LPDDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHzSupplier Device Package525-FCPBGA (19×19)
USBUSB 2.0 OTG (1)Voltage – I/O1.2V, 1.8V, 2.5V, 3.3V

Overview of S32G254ASBK0VUCT – ARM Cortex‑A53 and Cortex‑M7 Microprocessor IC, 3+2 Cores, 525‑FCPBGA (19×19)

The S32G254ASBK0VUCT from NXP Semiconductors is a multicore microprocessor IC combining ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processor cores. The device integrates 64‑bit and 32‑bit processing elements in a single package to address embedded and automotive applications requiring mixed high‑level and real‑time processing.

Designed for environments that require reliable operation, the device lists operating speeds of 400 MHz and 1 GHz, multiple Gigabit Ethernet ports, and integrated security features to support connected and safety‑conscious embedded systems.

Key Features

  • Core Architecture Dual‑architecture multicore design with ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processor cores and a core configuration described as 3 cores (64‑bit) and 2 cores (32‑bit).
  • Performance Documented operating speeds include 400 MHz and 1 GHz to cover a range of processing requirements.
  • Memory Interfaces Integrated RAM controller support for DDR3L and LPDDR4 memory technologies to enable external memory expansion.
  • Networking and I/O Four Gigabit Ethernet (GbE) interfaces and one USB 2.0 OTG port, plus DMA support for high‑throughput data movement.
  • Security On‑chip security capabilities include ARM TrustZone (TZ), cryptography, a random number generator (RNG), secure fusebox, secure memory, and XRDC.
  • Package and Mounting Supplied in a 525‑FCPBGA (19×19) package, surface‑mountable for compact board designs.
  • Automotive Grade and Qualification Grade listed as Automotive with qualification specified as AEC‑Q100.
  • Operating Temperature Specified operating range from −40 °C to 105 °C for deployment in temperature‑challenging environments.
  • Compliance RoHS compliant.
  • Graphics No graphics acceleration is present, focusing the device on compute, networking, and secure processing tasks.

Typical Applications

  • Automotive Systems Suitable for automotive electronic designs that require AEC‑Q100 qualification and an extended operating temperature range from −40 °C to 105 °C.
  • Embedded Networking Multi‑GbE interfaces and DMA support make the device applicable to embedded networked systems and communication modules.
  • Secure Edge Processing Integrated security features such as ARM TZ, cryptography, RNG, secure fusebox, secure memory, and XRDC support secure execution and data protection.
  • Memory‑Intensive Control DDR3L and LPDDR4 controller support enables external memory configurations for applications with larger datasets or buffering needs.

Unique Advantages

  • Multicore Mixed‑Architecture Combines 64‑bit and 32‑bit cores in one device to consolidate high‑level and real‑time processing on a single IC.
  • Rich Networking I/O Four GbE ports and USB 2.0 OTG provide flexible connectivity options for networked embedded designs.
  • Comprehensive On‑Chip Security Multiple hardware security blocks reduce the need for external security components and simplify secure system design.
  • Automotive Qualification AEC‑Q100 qualification and an extended temperature range align the device with automotive program requirements.
  • Compact BGA Footprint 525‑FCPBGA (19×19) package enables a compact board footprint while supporting surface‑mount assembly.
  • Standards‑Oriented Memory Support DDR3L and LPDDR4 controller support allows designers to choose memory types that match performance and power targets.

Why Choose S32G254ASBK0VUCT?

The S32G254ASBK0VUCT positions itself as a coordinated solution for embedded and automotive applications needing both application‑level compute and deterministic real‑time control. Its combination of 64‑bit and 32‑bit cores, documented operating speeds, multiple Gigabit Ethernet interfaces, and a suite of hardware security features make it suitable for designs that require integrated processing, connectivity, and security.

Manufactured by NXP Semiconductors and supplied in a compact 525‑FCPBGA package with AEC‑Q100 qualification and RoHS compliance, the device supports deployments where temperature range, qualification, and integrated memory and I/O support are critical considerations.

Request a quote or submit an inquiry to obtain pricing, lead‑time, and availability information for the S32G254ASBK0VUCT. Contact sales to discuss your application requirements and volume needs.

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