S32G274AABK0CUCT
| Part Description |
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC - 4 Core, 64-Bit/3 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19) |
|---|---|
| Quantity | 413 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | S32G274 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 | Device Package | 525-FCPBGA (19x19) | ECCN | OBSOLETE | ||
|---|---|---|---|---|---|---|---|
| Ethernet | MII, RGMII, RMII, SGMII | Grade | Automotive | HTS Code | N/A | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 4 Core, 64-Bit/3 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 525-FBGA, FCBGA | ||
| Qualification | AEC-Q100 | RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | HSE-H | Speed | 400MHz, 1GHz | ||
| Supplier Device Package | 525-FCPBGA (19×19) | USB | USB OTG (1) |
Overview of S32G274AABK0CUCT – IC MPU AEC-Q100 1GHZ 525FCPBGA
The S32G274AABK0CUCT is an embedded microprocessor IC from NXP Semiconductors featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It combines multi-core 64‑bit and 32‑bit processing with integrated peripherals and security features for embedded and automotive-grade applications.
Designed for environments requiring robust networking, memory support and hardware security, this device delivers a blend of performance and integration with AEC‑Q100 qualification and an extended operating temperature range of −40 °C to 85 °C.
Key Features
- Core Architecture – Includes ARM® Cortex®-A53 and ARM® Cortex®-M7 processors with multi-core configurations supporting both 64‑bit and 32‑bit workloads and core speeds up to 1 GHz and 400 MHz.
- Memory Interfaces – Integrated memory controllers for DDR3L SDRAM and LPDDR4 DRAM to support high-bandwidth system memory requirements.
- Networking Interfaces – Multiple Ethernet MAC interfaces including MII, RGMII, RMII and SGMII for flexible wired connectivity options.
- Peripheral Connectivity – On‑chip USB OTG (1) and CAN interfaces to support common embedded and vehicle networks.
- Security – Hardware security features listed as HSE‑H to support secure boot and cryptographic functions.
- Automotive Qualification & Temperature Range – AEC‑Q100 qualified and specified for operation from −40 °C to 85 °C for use in regulated automotive and industrial environments.
- Packaging & Mounting – Supplied in a 525‑FCPBGA (19×19) surface‑mount package (525‑FBGA / FCBGA family) for board-level integration.
- Graphics – No dedicated graphics acceleration included.
Typical Applications
- Automotive Gateway & Networking – Multi‑Ethernet and CAN interfaces enable use in vehicle networking and gateway modules.
- Telematics & Infotainment Control – Multi‑core processing and memory support accommodate control and communication tasks in telematics and infotainment subsystems.
- Embedded Control Systems – Combination of 64‑bit and 32‑bit cores with hardware security suited for embedded controllers requiring mixed workloads and secure operation.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 listing provides traceable qualification for automotive and similarly demanding applications.
- Heterogeneous multi‑core architecture: ARM® Cortex®-A53 and Cortex®-M7 cores allow partitioning of high‑level application tasks and real‑time control on a single device.
- Comprehensive networking support: Multiple Ethernet modes plus CAN and USB OTG reduce the need for additional interface controllers.
- Flexible memory options: Onboard controllers for DDR3L and LPDDR4 enable designers to choose memory types that match performance and power targets.
- Security hardware: Built‑in HSE‑H security capabilities help implement secure boot and cryptographic services within the device.
- Board‑level integration: 525‑FCPBGA (19×19) surface‑mount package simplifies placement in compact, high‑density PCB designs.
Why Choose S32G274AABK0CUCT?
The S32G274AABK0CUCT positions itself as a versatile embedded processor combining mixed 64‑bit and 32‑bit cores, extensive networking and peripheral interfaces, and hardware security within an AEC‑Q100 qualified package. It is intended for designs that require integrated connectivity, real‑time control capability and automotive‑level qualification.
Engineers and procurement teams seeking a scalable platform for embedded and automotive applications will find this device suitable for systems where multi‑core performance, supported memory types and robust networking options deliver long‑term value and simplified board integration.
Request a quote or submit an inquiry to receive pricing, availability and application support for the S32G274AABK0CUCT.

Date Founded: 2006
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