S32G378ASAK1VUCR

MICROPROCESSORS - MPU 4X CORTEX-
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 32/64-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 968 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G378
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L, LPDDR4REACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDCSpeed400MHz, 1GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G378ASAK1VUCR – MICROPROCESSORS - MPU 4X CORTEX-

The S32G378ASAK1VUCR is a microprocessor IC in the S32G378 series from NXP Semiconductors featuring ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. It provides a 4-core, 32/64-bit architecture and is designed for embedded and industrial applications that require integrated networking, security, and real-time control.

With multi-gigabit Ethernet connectivity, a USB 2.0 OTG interface, CANbus support and a broad set of security features, this device targets systems that demand integration of high-speed interfaces and hardware security while operating across a wide industrial temperature range.

Key Features

  • CPU Architecture Dual-core architecture combining ARM® Cortex®-A53 and ARM® Cortex®-M7 processors in a 4-core, 32/64-bit configuration for mixed application and real-time processing.
  • Operating Frequency Specified speed of 400 MHz to support system processing demands.
  • Multimedia & DSP Includes multimedia co-processor capability and NEON support for media and signal processing acceleration.
  • Memory Interfaces Integrated RAM controllers for DDR3L and LPDDR4 memory types to support flexible memory subsystem choices.
  • High‑Speed Networking Multiple 2.5 Gbps Ethernet interfaces (3) enabling high-throughput wired connectivity for networking and communication applications.
  • Peripheral Interfaces On-chip USB 2.0 OTG (1) and CANbus support for common peripheral and vehicle/industrial network interfaces.
  • Security Hardware security features including ARM TrustZone, cryptography engines, a random number generator, secure fusebox, secure memory and XRDC for access control.
  • Package & Mounting Supplied in a 525-FCPBGA (19×19) package, 525-FBGA / FCBGA family, designed for surface-mount assembly.
  • Industrial Qualification & Temperature Range Industrial-qualified device specified for operation from −40 °C to 105 °C.
  • Regulatory Compliance RoHS compliant to meet environmental substance requirements.

Typical Applications

  • Industrial Control Systems — Real-time processing and connectivity for control, monitoring and automation tasks supported by Cortex‑M7 real-time capability and Ethernet/CANbus interfaces.
  • Networking & Communication Appliances — Multi-port 2.5 Gbps Ethernet and USB OTG allow deployment in routers, gateways and edge network devices requiring high-throughput links.
  • Secure Embedded Gateways — Integrated hardware security features and secure memory make the device suitable for secure data aggregation and protocol bridging in embedded systems.

Unique Advantages

  • Heterogeneous Processing — Combines ARM Cortex‑A53 application cores with a Cortex‑M7 core to separate high-level OS tasks from deterministic real-time functions.
  • Integrated High‑Speed I/O — Multiple 2.5 Gbps Ethernet ports plus USB OTG and CANbus reduce external interface components and simplify board design.
  • Hardware Security Stack — On-chip TrustZone, cryptography, RNG and secure fusebox provide a layered approach to device and data protection.
  • Industrial‑Ready Temperature Range — Specified −40 °C to 105 °C operation supports deployment in demanding environmental conditions.
  • Flexible Memory Support — DDR3L and LPDDR4 controllers enable designers to choose memory options that match performance and cost targets.
  • Compact Surface‑Mount Package — 525-FCPBGA (19×19) package enables high-density board layouts while supporting robust assembly processes.

Why Choose S32G378ASAK1VUCR?

The S32G378ASAK1VUCR positions itself as a highly integrated microprocessor for embedded and industrial designs that require a mix of application processing, real-time control and secure, high-speed connectivity. Its combination of ARM® Cortex® cores, multimedia acceleration, multiple 2.5 Gbps Ethernet ports, USB OTG, CANbus and an extensive hardware security feature set delivers a coherent platform for connected, secure embedded systems.

Engineers and procurement teams looking for a compact, RoHS-compliant solution with industrial temperature qualification will find this device suitable for designs that demand performance, integration and robust operation over a wide temperature range.

Request a quote or submit an RFQ today to evaluate S32G378ASAK1VUCR for your next embedded or industrial project.

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