S32G399ASAK1VUCT

8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC S32G3 4 Core, 64-Bit/8 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)

Quantity 1,290 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesS32G399
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEONCore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package525-FCPBGA (19x19)
ECCNN/AEthernet2.5Gbps (3)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/8 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case525-FBGA, FCBGARAM ControllersDDR3L SDRAM, LPDDR4 DRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, TRNGSpeed400MHz, 1GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 OTG (1)Voltage – I/O1.8V, 3.3V

Overview of S32G399ASAK1VUCT – 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2

The S32G399ASAK1VUCT is a multi-core microprocessor from the NXP S32G399 series combining ARM® Cortex®-A53 and ARM® Cortex®-M7 cores. Its architecture integrates 64-bit and 32-bit processing with core frequencies up to 1.0 GHz for A53 and 400 MHz for M7, targeting embedded applications that require mixed‑domain processing and connectivity.

Designed for industrial qualification and wide operating temperatures, the device offers on-chip memory controllers, high-speed Ethernet, security primitives, and multiple peripheral interfaces to support embedded networking and secure system designs.

Key Features

  • Cores and Architecture  The device combines ARM® Cortex®-A53 (64-bit) and ARM® Cortex®-M7 (32-bit) cores with reported configurations of 8 core (32-bit) and 4 core (64-bit); core frequencies include 1.0 GHz and 400 MHz.
  • Memory Controllers  Integrated controllers for DDR3L SDRAM and LPDDR4 DRAM enable external system memory support suitable for embedded workloads.
  • High‑Speed Ethernet  Multiple 2.5 Gbps Ethernet interfaces (3) provide high-throughput networking capability for data‑centric embedded systems.
  • USB  USB 2.0 OTG interface (1) for device and host connectivity.
  • Additional Interfaces  On-chip CANbus support for vehicle or industrial fieldbus connectivity.
  • Security  Hardware security features including ARM TrustZone, boot security, and a true random number generator (TRNG) to support secure boot and trusted execution environments.
  • Co-Processing  Multimedia and NEON co-processor support for accelerated signal and media processing tasks.
  • Package and Mounting  Supplied in a 525-FCPBGA (19×19) surface-mount package compatible with FCBGA mounting.
  • Qualification and Environmental  Industrial qualification with RoHS compliance and an operating temperature range of -40 °C to 105 °C.
  • Graphics  No graphics acceleration is provided, focusing the device on processing and connectivity functions.

Typical Applications

  • Embedded Networking  Use in networked embedded systems that require multi-gigabit Ethernet connectivity and mixed 64/32-bit processing.
  • Industrial Control  Industrial-qualified temperature range and CANbus support make the device suitable for industrial control and automation gateways.
  • Secure Edge Processing  Hardware security features (ARM TZ, boot security, TRNG) support secure boot and trusted execution for edge devices.
  • Communication Gateways  Multiple Ethernet interfaces and USB OTG support integration in communication gateway and protocol-bridging applications.

Unique Advantages

  • Heterogeneous core mix: Combines 64-bit Cortex‑A53 and 32-bit Cortex‑M7 cores to address both application and real‑time control tasks on a single device.
  • Integrated memory support: On-chip controllers for DDR3L and LPDDR4 simplify memory selection and board design for a range of performance requirements.
  • High-throughput connectivity: Multiple 2.5 Gbps Ethernet interfaces and CANbus support reduce the need for external networking ASICs.
  • Built-in security primitives: TrustZone, boot security, and TRNG provide hardware-level building blocks for secure system design.
  • Industrial-rated operation: RoHS compliance and an operating range of -40 °C to 105 °C enable deployment in temperature‑challenging environments.
  • Compact package: 525-FCPBGA (19×19) surface-mount package supports high-density board designs.

Why Choose S32G399ASAK1VUCT?

The S32G399ASAK1VUCT positions itself as a versatile embedded microprocessor that balances multicore application processing and real-time control in a single footprint. Its combination of Cortex‑A53 and Cortex‑M7 cores, integrated memory interfaces, multiple high-speed Ethernet links, and hardware security features make it suitable for industrial and embedded designs that require connectivity and trusted execution.

For designers seeking a rugged, integrated solution with industrial qualification and a broad set of peripheral interfaces, this device offers a foundation for scalable, secure embedded systems with long-term deployment in temperature-stressed environments.

Request a quote or submit an inquiry to obtain pricing and availability for S32G399ASAK1VUCT and to discuss how it fits your embedded design requirements.

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