 | | S6E2HE6G0AGV2B000 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 446 | |
 | | S6E2HE6G0AGV2B00M | Infineon Technologies | IC MCU 32BIT 544KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 143 | |
| N/A | | S6E2HG4E0AGV20000 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 952 | |
 | | S6E2HG4E0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,127 | |
 | | S6E2HG4F0AGV20000 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 219 | |
 | | S6E2HG4F0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 651 | |
 | | S6E2HG4G0AGB30000 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 121FBGA | Microcontrollers | 121-FBGA (6x6) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (6×6) | 440 | |
 | | S6E2HG4G0AGB3000A | Infineon Technologies | IC MCU 32BIT 288KB FLASH 121FBGA | Microcontrollers | 121-FBGA (6x6) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (6×6) | 140 | |
 | | S6E2HG4G0AGV20000 | Infineon Technologies | IC MCU 32BIT 288KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,207 | |
 | | S6E2HG4G0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 288KB (288K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 451 | |
| N/A | | S6E2HG6E0AGV20000 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 277 | |
 | | S6E2HG6E0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 333 | |
 | | S6E2HG6F0AGV20000 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,161 | |
 | | S6E2HG6F0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 237 | |
 | | S6E2HG6G0AGB3000A | Infineon Technologies | IC MCU 32BIT 544KB FLASH 121FBGA | Microcontrollers | 121-FBGA (6x6) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-FBGA (6×6) | 369 | |
 | | S6E2HG6G0AGV20000 | Infineon Technologies | IC MCU 32BIT 544KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 285 | |
 | | S6E2HG6G0AGV2000M | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 544KB (544K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 348 | |
| N/A | N/A | S6J3001LSESE1000B | Infineon Technologies | IC MCU 32BIT 216TEQFP | Microcontrollers | N/A | N/A | – | N/A | 232 | |
| N/A | N/A | S6J3001LSJSC1000A | Infineon Technologies | IC MCU AUTO 216EX-LQFP | Microcontrollers | - | N/A | – | N/A | 1,717 | |
| N/A | N/A | S6J3001LSJSC1000B | Infineon Technologies | IC MCU 32BIT AUTO 216-EXLQFP | Microcontrollers | - | N/A | – | N/A | 400 | |