| N/A | N/A | S109014BC2PZPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,358 | |
| N/A | N/A | S1201024B0PLPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 79 | |
| N/A | N/A | S1404002A1NPMR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 1,890 | |
| N/A | N/A | S301030AB2PZPR | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 416 | |
| N/A | N/A | S301044APFPRG4 | Texas Instruments | PROTOTYPE | Microcontrollers | N/A | N/A | N/A | N/A | 952 | |
| N/A | | S32G233AABK0CUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 67 | |
| N/A | | S32G233AABK0CUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 216 | |
| N/A | | S32G233AABK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 291 | |
| N/A | | S32G233AABK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,853 | |
| N/A | | S32G233AABK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 395 | |
| N/A | | S32G233AABK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53 | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,773 | |
| N/A | | S32G233ASBK0VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,421 | |
| N/A | | S32G233ASBK0VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 5 | |
| N/A | | S32G233ASBK1VUCR | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 1,254 | |
| N/A | | S32G233ASBK1VUCT | NXP Semiconductors | S32G233A ARM CORTEX-M7 AND -A53, | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 570 | |
| N/A | | S32G234MABK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 411 | |
| N/A | | S32G234MABK0VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 774 | |
| N/A | | S32G234MABK1VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 507 | |
| N/A | | S32G234MABK1VUCT | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE, LLC | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 272 | |
| N/A | | S32G234MSBK0VUCR | NXP Semiconductors | S32G234M ARM CORTEX-M7, HSE W/PR | Microprocessors | 525-FCPBGA (19x19) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON Voltage – I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19×19) | 567 | |