Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ADUC7128BSTZ126
ADUC7128BSTZ126Analog Devices Inc.IC MCU 16/32B 126KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
41.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PLA, POR, PWM, PSM, Temp Sensor, WDT
Number of I/O:
28
Program Memory Size:
126KB (63K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,318
ADUC7128BSTZ126-RL
ADUC7128BSTZ126-RLAnalog Devices Inc.IC MCU 16/32B 126KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
41.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PLA, POR, PWM, PSM, Temp Sensor, WDT
Number of I/O:
28
Program Memory Size:
126KB (63K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
737
ADUC7129BSTZ126
ADUC7129BSTZ126Analog Devices Inc.IC MCU 16/32B 126KB FLASH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
41.78MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, POR, PWM, PSM, Temp Sensor, WDT
Number of I/O:
38
Program Memory Size:
126KB (63K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
249
ADUC7129BSTZ126-RL
ADUC7129BSTZ126-RLAnalog Devices Inc.IC MCU 16/32B 126KB FLASH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
41.78MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PLA, POR, PWM, PSM, Temp Sensor, WDT
Number of I/O:
38
Program Memory Size:
126KB (63K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 32
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
891
ADUC812BCP
ADUC812BCPAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
798
ADUC812BCPZ
ADUC812BCPZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,629
ADUC812BSZ
ADUC812BSZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
491
ADUC812BSZ-REEL
ADUC812BSZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,124
N/AN/AADUC814ANAnalog Devices Inc.IC MCU 8BIT 8KB FLASHMicrocontrollers-N/AN/A
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
1,989
ADUC814ARU
ADUC814ARUAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
156
ADUC814ARUZ
ADUC814ARUZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
772
ADUC814ARUZ-REEL
ADUC814ARUZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
796
ADUC814ARUZ-REEL7
ADUC814ARUZ-REEL7Analog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,050
ADUC814BRU
ADUC814BRUAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,279
ADUC814BRUZ
ADUC814BRUZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
987
ADUC814BRUZ-REEL
ADUC814BRUZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
77
ADUC814BRUZ-REEL7
ADUC814BRUZ-REEL7Analog Devices Inc.IC MCU 8BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16.78MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 6x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
783
ADUC816BCP
ADUC816BCPAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP (8×8)
Package / Case:
56-WFQFN Exposed Pad, CSP
1,194
ADUC816BCPZ
ADUC816BCPZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP (8×8)
Package / Case:
56-WFQFN Exposed Pad, CSP
41
ADUC816BCPZ-REEL
ADUC816BCPZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP (8×8)
Package / Case:
56-WFQFN Exposed Pad, CSP
1,664

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