Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ADUC816BSZ
ADUC816BSZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,830
ADUC816BSZ-REEL
ADUC816BSZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,044
ADUC824BCP
ADUC824BCPAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,386
ADUC824BCPZ
ADUC824BCPZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
59
ADUC824BS
ADUC824BSAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
546
ADUC824BS-REEL
ADUC824BS-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,381
ADUC824BSZ
ADUC824BSZAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
50
ADUC824BSZ-REEL
ADUC824BSZ-REELAnalog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
640 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
816
ADUC831BCPZ
ADUC831BCPZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
657
ADUC831BCPZ-REEL
ADUC831BCPZ-REELAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,111
ADUC831BSZ
ADUC831BSZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,709
ADUC831BSZ-REEL
ADUC831BSZ-REELAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
889
ADUC832BCPZ
ADUC832BCPZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
416
ADUC832BCPZ-REEL
ADUC832BCPZ-REELAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
123
ADUC832BSZ
ADUC832BSZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
81
ADUC832BSZ-REEL
ADUC832BSZ-REELAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
PSM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
824
ADUC834BCP
ADUC834BCPAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
451
ADUC834BCPZ
ADUC834BCPZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
80
ADUC834BCPZ-REEL
ADUC834BCPZ-REELAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,458
ADUC834BSZ
ADUC834BSZAnalog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
EBI/EMI, I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.25V
Data Converters:
A/D 3x16b, 4x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
939

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