Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SAM9X75-I/4PBSAM9X75-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
345
N/ASAM9X75-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
686
SAM9X75D1G-I/4TBN/ASAM9X75D1G-I/4TBMicrochip TechnologyARM926 MPU, 1GBIT DDR3L,MIPI,LVDMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Grade:
Industrial
610
SAM9X75D1GT-I/4TBN/ASAM9X75D1GT-I/4TBMicrochip TechnologyARM926 MPU,1GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Grade:
Industrial
1,815
SAM9X75D2G-I/4TBN/ASAM9X75D2G-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Grade:
Industrial
844
SAM9X75D2GT-I/4TBN/ASAM9X75D2GT-I/4TBMicrochip TechnologyARM926 MPU,2GBIT DDR3L,MIPI,LVDSMicroprocessors243-TFBGA (16x16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
243-LFBGA
Supplier Device Package:
243-TFBGA (16×16)
Grade:
Industrial
457
SAM9X75T-I/4PBSAM9X75T-I/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
1,210
N/ASAM9X75T-V/4PBMicrochip TechnologyARM926 MPU,MIPI,LVDS,CAN-FD,BGA,Microprocessors240-TFBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
RAM Controllers:
DDR2, DDR3, DDR3L, SDRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, LVDS, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, Boot Security, Cryptography, DES, SHA, TRNG
Mounting Type:
Surface Mount
Package / Case:
240-LFBGA
Supplier Device Package:
240-TFBGA (11×11)
Grade:
Industrial
420
N/ASAMA7G54-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Grade:
Automotive
1,103
SAMA7G54-V/4HBSAMA7G54-V/4HBMicrochip TechnologyIC MPU SAMA7G5 1GHZ 343TFBGAMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB 2.0 PHY (3), USB Type-C (2)
Voltage – I/O:
3.3V, 5V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Grade:
Industrial
478
SAMA7G54D1G-I/4UBSAMA7G54D1G-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Grade:
Industrial
207
SAMA7G54D1GT-I/4UBSAMA7G54D1GT-I/4UBMicrochip TechnologyCORTEX-A7,MPU, 1GBIT DDR3,BGA,INMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Grade:
Industrial
577
SAMA7G54D2G-I/4UBSAMA7G54D2G-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Grade:
Industrial
498
SAMA7G54D2GT-I/4UBSAMA7G54D2GT-I/4UBMicrochip TechnologyCORTEX-A7 MPU, 2GBIT DDR3, BGA,IMicroprocessors427-TFBGA (21x18)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB (3)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
427-TFBGA
Supplier Device Package:
427-TFBGA (21×18)
Grade:
Industrial
1,613
N/ASAMA7G54T-E/4HBMicrochip TechnologyCORTEX-A7 MPU, BGA, EXT. TEMP (TMicroprocessors343-TFBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR2, DDR3, DDR3L, LPDDR2, LPDDR3
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1), 10/100/1000Mbps (1)
USB:
USB Typ-C (2)
Voltage – I/O:
1.35V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512
Mounting Type:
Surface Mount
Package / Case:
343-TFBGA
Supplier Device Package:
343-TFBGA (14×14)
Grade:
Automotive
46
N/ASAMRH71F20C-00-SVMicrochip TechnologyIC MCU 32BIT 128MB FLASH DIEMicrocontrollersWaferN/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Wafer
Package / Case:
Die
721
N/ASAMRH71F20C-7GB-EMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A–
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
1,165
N/ASAMRH71F20C-7GB-MQMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
1,116
N/ASAMRH71F20C-7GB-SRMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
680
N/ASAMRH71F20C-7GB-SVMicrochip TechnologyIC MCU 32BIT 128MB FLASH 625TBGAMicrocontrollers625-TFBGA (6x8)N/A-55°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M7
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
194
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
1.125M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
625-TFBGA (6×8)
Package / Case:
625-TBGA
163

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up