 | | SAM9X75-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) | 345 | |
| N/A | | SAM9X75-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) | 686 | |
 | N/A | SAM9X75D1G-I/4TB | Microchip Technology | ARM926 MPU, 1GBIT DDR3L,MIPI,LVD | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 243-TFBGA (16×16) | 610 | |
 | N/A | SAM9X75D1GT-I/4TB | Microchip Technology | ARM926 MPU,1GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 243-TFBGA (16×16) | 1,815 | |
 | N/A | SAM9X75D2G-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 243-TFBGA (16×16) | 844 | |
 | N/A | SAM9X75D2GT-I/4TB | Microchip Technology | ARM926 MPU,2GBIT DDR3L,MIPI,LVDS | Microprocessors | 243-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 243-TFBGA (16×16) | 457 | |
 | | SAM9X75T-I/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) | 1,210 | |
| N/A | | SAM9X75T-V/4PB | Microchip Technology | ARM926 MPU,MIPI,LVDS,CAN-FD,BGA, | Microprocessors | 240-TFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI/DSI Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Supplier Device Package: 240-TFBGA (11×11) | 420 | |
| N/A | | SAMA7G54-E/4HB | Microchip Technology | CORTEX-A7 MPU, BGA, EXT. TEMP (T | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 343-TFBGA (14×14) | 1,103 | |
 | | SAMA7G54-V/4HB | Microchip Technology | IC MPU SAMA7G5 1GHZ 343TFBGA | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) USB: USB 2.0 PHY (3), USB Type-C (2) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 343-TFBGA (14×14) | 478 | |
 | | SAMA7G54D1G-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 427-TFBGA (21×18) | 207 | |
 | | SAMA7G54D1GT-I/4UB | Microchip Technology | CORTEX-A7,MPU, 1GBIT DDR3,BGA,IN | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 427-TFBGA (21×18) | 577 | |
 | | SAMA7G54D2G-I/4UB | Microchip Technology | CORTEX-A7 MPU, 2GBIT DDR3, BGA,I | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 427-TFBGA (21×18) | 498 | |
 | | SAMA7G54D2GT-I/4UB | Microchip Technology | CORTEX-A7 MPU, 2GBIT DDR3, BGA,I | Microprocessors | 427-TFBGA (21x18) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 427-TFBGA (21×18) | 1,613 | |
| N/A | | SAMA7G54T-E/4HB | Microchip Technology | CORTEX-A7 MPU, BGA, EXT. TEMP (T | Microprocessors | 343-TFBGA (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 Ethernet: 10/100Mbps (1), 10/100/1000Mbps (1) Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Cryptography, 3DES, AES, SHA1, SHA-256, SHA-384, SHA-512 Mounting Type: Surface Mount Supplier Device Package: 343-TFBGA (14×14) | 46 | |
| N/A | | SAMRH71F20C-00-SV | Microchip Technology | IC MCU 32BIT 128MB FLASH DIE | Microcontrollers | Wafer | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: Wafer | 721 | |
| N/A | | SAMRH71F20C-7GB-E | Microchip Technology | IC MCU 32BIT 128MB FLASH 625TBGA | Microcontrollers | 625-TFBGA (6x8) | N/A | – | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External, Internal Mounting Type: Surface Mount Supplier Device Package: 625-TFBGA (6×8) | 1,165 | |
| N/A | | SAMRH71F20C-7GB-MQ | Microchip Technology | IC MCU 32BIT 128MB FLASH 625TBGA | Microcontrollers | 625-TFBGA (6x8) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 625-TFBGA (6×8) | 1,116 | |
| N/A | | SAMRH71F20C-7GB-SR | Microchip Technology | IC MCU 32BIT 128MB FLASH 625TBGA | Microcontrollers | 625-TFBGA (6x8) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 625-TFBGA (6×8) | 680 | |
| N/A | | SAMRH71F20C-7GB-SV | Microchip Technology | IC MCU 32BIT 128MB FLASH 625TBGA | Microcontrollers | 625-TFBGA (6x8) | N/A | -55°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M7 Connectivity: CANbus, Ethernet, FIFO, I2C, QSPI, SPI, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Oscillator Type: External, Internal Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 625-TFBGA (6×8) | 163 | |