Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Total Products: 134,055

Image	Data Sheet	Part Number	Manufacturer	Description	Category	Device Package	Voltage	Operating Temp	Additional Specifications	Qty	Get A Quote
		SAL-XC886-8FFA 5V AC	Infineon Technologies	IC MCU 8BIT 32KB FLASH 48TQFP	Microcontrollers	PG-TQFP-48	N/A	-40°C ~ 150°C (TA)	Core Processor: XC800 Core Size: 8-Bit Speed: 24MHz Connectivity: SSI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 1.75K x 8 Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-48 Package / Case: 48-LQFP	1,623	GET A QUOTE
		SAM9X60-V/DWB	Microchip Technology	IC MPU SAM9X60 600MHZ 228TFBGA	Microprocessors	228-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial	885	GET A QUOTE
	N/A	SAM9X60-V/DWBVAO	Microchip Technology	IC MPU SAM9X 600MHZ 228TFBGA	Microprocessors	228-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial	108	GET A QUOTE
		SAM9X60D1G-I/4FB	Microchip Technology	IC MPU SAM9X60 600MHZ 233TFBGA	Microprocessors	233-TFBGA (14x14)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial	1,108	GET A QUOTE
	N/A	SAM9X60D1G-I/LZB	Microchip Technology	IC MPU SAM9X 600MHZ	Microprocessors	-	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Grade: Industrial	118	GET A QUOTE
		SAM9X60D1GT-I/4FB	Microchip Technology	IC MPU SAM9X60 600MHZ 233TFBGA	Microprocessors	233-TFBGA (14x14)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial	1,349	GET A QUOTE
		SAM9X60D5M-I/4FB	Microchip Technology	IC MPU SAM9X60 600MHZ 233TFBGA	Microprocessors	233-TFBGA (14x14)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial	896	GET A QUOTE
		SAM9X60D5MT-I/4FB	Microchip Technology	IC MPU SAM9X60 600MHZ 233TFBGA	Microprocessors	233-TFBGA (14x14)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 233-TFBGA Supplier Device Package: 233-TFBGA (14×14) Grade: Industrial	327	GET A QUOTE
		SAM9X60D6K-I/4GB	Microchip Technology	IC MPU SAM9X 600MHZ 196TFBGA	Microprocessors	196-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Grade: Industrial	637	GET A QUOTE
		SAM9X60D6KT-I/4GB	Microchip Technology	IC MPU SAM9X 600MHZ 196TFBGA	Microprocessors	196-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: SDR, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 196-TFBGA Supplier Device Package: 196-TFBGA (11×11) Grade: Industrial	1,175	GET A QUOTE
		SAM9X60T-V/DWB	Microchip Technology	IC MPU SAM9X60 600MHZ 228TFBGA	Microprocessors	228-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial	959	GET A QUOTE
	N/A	SAM9X60T-V/DWBVAO	Microchip Technology	IC MPU SAM9X 600MHZ 228TFBGA	Microprocessors	228-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Mounting Type: Surface Mount Package / Case: 228-TFBGA Supplier Device Package: 228-TFBGA (11×11) Grade: Industrial	1,823	GET A QUOTE
		SAM9X70-I/4PB	Microchip Technology	ARM926 MPU,BGA,I TEMP,TRAY	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	1,140	GET A QUOTE
N/A		SAM9X70-V/4PB	Microchip Technology	ARM926 MPU,BGA,EXT TEMP	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	273	GET A QUOTE
		SAM9X70T-I/4PB	Microchip Technology	ARM926 MPU,BGA,I TEMP,T&R	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	540	GET A QUOTE
N/A		SAM9X70T-V/4PB	Microchip Technology	ARM926 MPU,BGA,EXT TEMP,T&R	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	66	GET A QUOTE
		SAM9X72-I/4PB	Microchip Technology	ARM926 MPU,LVDS,CAN-FD,BGA,I TEM	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	537	GET A QUOTE
N/A		SAM9X72-V/4PB	Microchip Technology	ARM926 MPU,LVDS,CAN-FD,BGA,EXT T	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	207	GET A QUOTE
		SAM9X72T-I/4PB	Microchip Technology	ARM926 MPU,LVDS,CAN-FD,BGA,I TEM	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 85°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	297	GET A QUOTE
N/A		SAM9X72T-V/4PB	Microchip Technology	ARM926 MPU,LVDS,CAN-FD,BGA,EXT T	Microprocessors	240-TFBGA (11x11)	N/A	-40°C ~ 105°C (TA)	Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR2, DDR3, DDR3L, SDRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS Ethernet: 10/100/1000Mbps (1) USB: USB (3) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, Boot Security, Cryptography, DES, SHA, TRNG Mounting Type: Surface Mount Package / Case: 240-LFBGA Supplier Device Package: 240-TFBGA (11×11) Grade: Industrial	352	GET A QUOTE