SAM9X60D1G-I/4FB
| Part Description |
ARM926EJ-S Microprocessor IC SAM9X60 1 Core, 32-Bit 600MHz 233-TFBGA (14x14) |
|---|---|
| Quantity | 1,716 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SAM9X6 |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 4 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | ARM926EJ-S | Device Package | 233-TFBGA (14x14) | Display & Interface Controllers | Keyboard, LCD, Touchscreen | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A992C | Ethernet | 10/100Mbps (2) | Grade | Industrial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 233-TFBGA | RAM Controllers | LPDDR, LPSDR, DDR2, SDR, SRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins | ||
| Speed | 600MHz | Supplier Device Package | 233-TFBGA (14×14) | USB | USB 2.0 (3) | ||
| Voltage – I/O | 3.3V |
Overview of SAM9X60D1G-I/4FB – IC MPU SAM9X60 600MHZ 233TFBGA
The SAM9X60D1G-I/4FB is a single-core ARM926EJ-S microprocessor IC running at 600 MHz, designed for embedded and industrial applications. It combines a 32-bit ARM core with a broad set of memory controllers, multiple connectivity interfaces and an extensive security feature set to address secure, connected embedded designs.
Key Features
- Core and Performance ARM926EJ-S core, 1 core, 32-bit running at 600 MHz for deterministic embedded processing.
- Memory Support Integrated controllers supporting LPDDR, LPSDR, DDR2, SDR and SRAM memory types for flexible system memory configurations.
- Interfaces and Connectivity Dual 10/100 Mbps Ethernet controllers and three USB 2.0 interfaces provide on-board networking and peripheral connectivity. Display interface controllers include keyboard, LCD and touchscreen support, and the device includes graphics acceleration.
- Security Features Hardware features include Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC and Tamper Pins for secured system operation.
- Power and I/O 3.3 V I/O voltage signaling for compatibility with common embedded I/O levels.
- Package and Mounting 233-TFBGA (14 × 14 mm) package, surface-mount mounting type, enabling compact board designs.
- Industrial Grade and Temperature Range Industrial grade device rated for operation from -40 °C to 85 °C.
- Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Industrial Control Embedded controllers and automation equipment that require industrial temperature range and secure boot capability.
- Human-Machine Interfaces (HMI) Systems with LCD, keyboard or touchscreen interfaces that benefit from the integrated display controllers and graphics acceleration.
- Networked Embedded Devices Devices needing wired connectivity and peripheral support using dual 10/100 Mbps Ethernet and multiple USB 2.0 interfaces.
- Secure Embedded Systems Applications requiring on-chip cryptography, secure key storage and tamper detection for enhanced system protection.
Unique Advantages
- High-performance ARM core: 600 MHz ARM926EJ-S core delivers predictable 32-bit processing for embedded workloads.
- Versatile memory support: Multiple supported memory types (LPDDR, LPSDR, DDR2, SDR, SRAM) let designers choose the best memory topology for cost and performance.
- Integrated connectivity: Dual 10/100 Mbps Ethernet and three USB 2.0 interfaces reduce external controller requirements and simplify board design.
- Comprehensive security: Built-in boot security, cryptography, secure JTAG and secure key storage improve device-level protection without added components.
- Industrial robustness: Industrial grade classification and wide operating temperature range (-40 °C to 85 °C) support deployment in harsh environments.
- Compact, surface-mount package: 233-TFBGA (14 × 14 mm) package enables high-density PCB layouts.
Why Choose SAM9X60D1G-I/4FB?
The SAM9X60D1G-I/4FB positions itself as a capable, industrial-grade microprocessor offering a balance of processing performance, broad memory support and integrated connectivity. Its extensive security features and graphics/display support make it suitable for embedded products that require secure operation, user interfaces and wired connectivity.
Backed by Microchip Technology and specified for industrial environments, this device is appropriate for designers seeking a single-chip solution that simplifies BOM, supports diverse memory and interface options, and delivers long-term robustness in embedded applications.
Request a quote or submit a purchase inquiry for SAM9X60D1G-I/4FB to evaluate its fit for your embedded or industrial design needs.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D