Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SC68376BACAB25SC68376BACAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
646
SC68376BAMAB20SC68376BAMAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,103
SC68376BAVAB25SC68376BAVAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
842
SC68376BGCAB20SC68376BGCAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,618
SC68376BGCAB25SC68376BGCAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,150
SC68376BGMAB20SC68376BGMAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,158
SC68376BGMAB20RN/ASC68376BGMAB20RNXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
230
SC68376BGVAB20SC68376BGVAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
66
SC68376BGVAB25SC68376BGVAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
181
SC68376BGVAB25RSC68376BGVAB25RNXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,120
SC74HC4851ADTR2GSC74HC4851ADTR2GonsemiSINGLE-ENDED MULTIPLEXER, 1 FUNCAnalog Switches, Multiplexers, Demultiplexers16-TSSOPN/A-55°C ~ 125°C (TA)
Channel Capacitance (CS(off), CD(off)):
10pF, 40pF
Channel-to-Channel Matching (ΔRon):
60Ohm (Max)
Current – Leakage (IS(off)) (Max):
100nA
Mounting Type:
Surface Mount
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
400Ohm
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
Supplier Device Package:
16-TSSOP
Switch Circuit:
SP8T – Open/Closed
Voltage – Supply, Single (V+):
2V ~ 6V
936
SC82360SLAHC1SC82360SLAHC1IntelMICRO PERIPHERAL IC PQFP208Microprocessors208-PQFPN/AN/A
Voltage – I/O:
5 V
RAM Controllers:
DRAM
Grade:
Commercial
Graphics Acceleration:
No
982
N/AN/ASC8568ECVTATGGNXP SemiconductorsIC MCUMicrocontrollersN/AN/A–

N/A

307
N/AN/ASC8568EVTANGGNXP SemiconductorsIC MCUMicrocontrollersN/AN/A–

N/A

1,176
SC908LL64J0CLKN/ASC908LL64J0CLKNXP SemiconductorsIC MCU 8BIT 64KB FLASH 80LQFPMicrocontrollers80-LQFPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LCD, LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP
557
SCAN182541ASSCSCAN182541ASSCFairchild SemiconductorIC DRIVER BUS 56SSOPDrivers, Receivers, Transceivers56-SSOP4.5V ~ 5.5V-45°C ~ 85°C
Type:
Driver
Protocol:
IEEE 1149.1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-45°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
56-BSSOP (0.295″”, 7.50mm Width)
Supplier Device Package:
56-SSOP
1,130
SCAN92LV090SLCSCAN92LV090SLCTexas InstrumentsIC TRANSCEIVER HALF 9/9Drivers, Receivers, TransceiversN/A3V ~ 3.6V-40°C ~ 85°C
Type:
Transceiver
Protocol:
LVDS
Number of Drivers/Receivers:
9/9
Duplex:
Half
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
64-LFBGA
125
SCAN92LV090SLC/NOPBSCAN92LV090SLC/NOPBTexas InstrumentsIC TRANSCEIVER HALF 9/9 64NFBGADrivers, Receivers, Transceivers64-NFBGA (8x8)3V ~ 3.6V-40°C ~ 85°C
Type:
Transceiver
Protocol:
LVDS
Number of Drivers/Receivers:
9/9
Duplex:
Half
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
64-LFBGA
Supplier Device Package:
64-NFBGA (8×8)
1,414
SCAN92LV090VEH/NOPBSCAN92LV090VEH/NOPBTexas InstrumentsIC TRANSCEIVER HALF 9/9 64TQFPDrivers, Receivers, Transceivers64-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Type:
Transceiver
Protocol:
LVDS
Number of Drivers/Receivers:
9/9
Duplex:
Half
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
Supplier Device Package:
64-TQFP (10×10)
1,176
SCAN92LV090VEHX/NOPBSCAN92LV090VEHX/NOPBTexas InstrumentsIC TRANSCEIVER HALF 9/9 64TQFPDrivers, Receivers, Transceivers64-TQFP (10x10)3V ~ 3.6V-40°C ~ 85°C
Type:
Transceiver
Protocol:
LVDS
Number of Drivers/Receivers:
9/9
Duplex:
Half
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
64-LQFP
Supplier Device Package:
64-TQFP (10×10)
903

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