Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,055
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
SCANPSC100FSCSCANPSC100FSConsemiIC SCAN CTRLR EMB BOUNDRY 28SOICControllers28-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Function:
Controller
Interface:
Parallel
Standards:
IEEE 1149.1
Voltage – Supply:
4.5V ~ 5.5V
Current – Supply:
8µA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
28-SOIC (0.295″, 7.50mm Width)
Supplier Device Package:
28-SOIC
932
SCANPSC100FSCXSCANPSC100FSCXonsemiIC SCAN CTRLR EMB BOUNDRY 28SOICControllers28-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Function:
Controller
Interface:
Parallel
Standards:
IEEE 1149.1
Voltage – Supply:
4.5V ~ 5.5V
Current – Supply:
8µA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
28-SOIC (0.295″, 7.50mm Width)
Supplier Device Package:
28-SOIC
229
N/AN/ASCCNLVHC4851ADTR2GonsemiLDO REGULATOR, ULTRA-LOW NOISE,Analog Switches, Multiplexers, DemultiplexersN/AN/A–

N/A

839
SCD240110QCMSCD240110QCMIntelSERIAL I/O CONTROLLERControllers100-MQFP (14x20)N/AN/A
Package / Case:
100-BQFP
Supplier Device Package:
100-MQFP (14×20)
540
SCD240210QCMN/ASCD240210QCMIntelCOMMUNICATION CONTROLLER 100PINControllers-4.75V ~ 5.25V0°C ~ 70°C
Voltage – Supply:
4.75V ~ 5.25V
Current – Supply:
50mA
Operating Temperature:
0°C ~ 70°C
Package / Case:
160-QFP
838
N/AN/ASCE81E82HC4851ADTR2GonsemiANALOG MULTIPLEXER DEMULTIPLEXERAnalog Switches, Multiplexers, DemultiplexersN/AN/A–

N/A

696
SCF5234F4CVM150N/ASCF5234F4CVM150NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
937
SCF5235F4CVM150N/ASCF5235F4CVM150NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
97
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,000
SCF5249LAG120N/ASCF5249LAG120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
34
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,412
SCF5249LAG133N/ASCF5249LAG133NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
34
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
649
N/AN/ASCF5249VF140NXP SemiconductorsIC MCU 32BIT ROMLESS 160MAPBGAMicrocontrollers160-MAPBGA (15x15)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-MAPBGA (15×15)
1,591
SCF5249VM140N/ASCF5249VM140NXP SemiconductorsIC MCU 32BIT ROMLESS 160MAPBGAMicrocontrollers160-MAPBGA (15x15)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
140MHz
Connectivity:
I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-MAPBGA (15×15)
Package / Case:
160-BGA
838
SCF5250AG120SCF5250AG120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
57
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
314
SCF5250CAG120SCF5250CAG120NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
57
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,021
SCF5250LAG100SCF5250LAG100NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
57
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
346
SCF5250VM120SCF5250VM120NXP SemiconductorsIC MCU 32BIT ROMLESS 196MAPBGAMicrocontrollers196-LBGA (15x15)N/A-20°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART
Peripherals:
DMA, I2S, POR, Serial Audio, WDT
Number of I/O:
57
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.08V ~ 1.32V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
196-LBGA (15×15)
Package / Case:
196-LBGA
515
SCIMX6G3CVML5AASCIMX6G3CVML5AANXP SemiconductorsCORTEX A7 RISC MICROPROCESSOR 32MicroprocessorsN/AN/AN/A
Voltage – I/O:
1.8 V – 3.15 V
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Qualification:
Industrial
7
N/ASCIMX6S6AVM083CNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU ARM CORMicroprocessors-N/A–
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Display & Interface Controllers:
Keypad, LCD
896
N/ASCIMX6S6AVM083CRNXP SemiconductorsI.MX 6 SERIES 32-BIT MPU ARM CORMicroprocessors-N/A–
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Ethernet:
10/100/1000Mbps (1)
USB:
USB 2.0 + PHY (4)
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ SIMD
Display & Interface Controllers:
Keypad, LCD
1,651
SCIMX6X3EVK10ABRSCIMX6X3EVK10ABRNXP SemiconductorsIC MPU I.MX6SX 1GHZ 400MAPBGAMicroprocessors400-MAPBGA (14x14)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
227MHz, 1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD, LVDS
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-MAPBGA (14×14)
206

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