 | | SCANPSC100FSC | onsemi | IC SCAN CTRLR EMB BOUNDRY 28SOIC | Controllers | 28-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Package / Case: 28-SOIC (0.295″, 7.50mm Width) Supplier Device Package: 28-SOIC | 932 | |
 | | SCANPSC100FSCX | onsemi | IC SCAN CTRLR EMB BOUNDRY 28SOIC | Controllers | 28-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Package / Case: 28-SOIC (0.295″, 7.50mm Width) Supplier Device Package: 28-SOIC | 229 | |
| N/A | N/A | SCCNLVHC4851ADTR2G | onsemi | LDO REGULATOR, ULTRA-LOW NOISE, | Analog Switches, Multiplexers, Demultiplexers | N/A | N/A | – | N/A | 839 | |
 | | SCD240110QCM | Intel | SERIAL I/O CONTROLLER | Controllers | 100-MQFP (14x20) | N/A | N/A | Supplier Device Package: 100-MQFP (14×20) | 540 | |
 | N/A | SCD240210QCM | Intel | COMMUNICATION CONTROLLER 100PIN | Controllers | - | 4.75V ~ 5.25V | 0°C ~ 70°C | Voltage – Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C | 838 | |
| N/A | N/A | SCE81E82HC4851ADTR2G | onsemi | ANALOG MULTIPLEXER DEMULTIPLEXER | Analog Switches, Multiplexers, Demultiplexers | N/A | N/A | – | N/A | 696 | |
 | N/A | SCF5234F4CVM150 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 937 | |
 | N/A | SCF5235F4CVM150 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256MAPBGA | Microcontrollers | 256-MAPBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.4V ~ 1.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-MAPBGA (17×17) | 1,000 | |
 | N/A | SCF5249LAG120 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x12b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,412 | |
 | N/A | SCF5249LAG133 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x12b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 649 | |
| N/A | N/A | SCF5249VF140 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160MAPBGA | Microcontrollers | 160-MAPBGA (15x15) | N/A | -20°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x12b Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-MAPBGA (15×15) | 1,591 | |
 | N/A | SCF5249VM140 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160MAPBGA | Microcontrollers | 160-MAPBGA (15x15) | N/A | 0°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 4x12b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-MAPBGA (15×15) | 838 | |
 | | SCF5250AG120 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -20°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 1.32V Data Converters: A/D 6x12b Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 314 | |
 | | SCF5250CAG120 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 1.32V Data Converters: A/D 6x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,021 | |
 | | SCF5250LAG100 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -20°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 1.32V Data Converters: A/D 6x12b Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 346 | |
 | | SCF5250VM120 | NXP Semiconductors | IC MCU 32BIT ROMLESS 196MAPBGA | Microcontrollers | 196-LBGA (15x15) | N/A | -20°C ~ 70°C (TA) | Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 1.32V Data Converters: A/D 6x12b Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-LBGA (15×15) | 515 | |
 | | SCIMX6G3CVML5AA | NXP Semiconductors | CORTEX A7 RISC MICROPROCESSOR 32 | Microprocessors | N/A | N/A | N/A | Voltage – I/O: 1.8 V – 3.15 V Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD | 7 | |
| N/A | | SCIMX6S6AVM083C | NXP Semiconductors | I.MX 6 SERIES 32-BIT MPU ARM COR | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: Keypad, LCD | 896 | |
| N/A | | SCIMX6S6AVM083CR | NXP Semiconductors | I.MX 6 SERIES 32-BIT MPU ARM COR | Microprocessors | - | N/A | – | Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100/1000Mbps (1) Graphics Acceleration: Yes Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: Keypad, LCD | 1,651 | |
 | | SCIMX6X3EVK10ABR | NXP Semiconductors | IC MPU I.MX6SX 1GHZ 400MAPBGA | Microprocessors | 400-MAPBGA (14x14) | N/A | -20°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage – I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Mounting Type: Surface Mount Supplier Device Package: 400-MAPBGA (14×14) | 206 | |