SCIMX6X3EVK10ABR

IC MPU I.MX6SX 1GHZ 400MAPBGA
Part Description

ARM® Cortex®-A9, ARM® Cortex®-M4 Microprocessor IC i.MX6SX 2 Core, 32-Bit 227MHz, 1GHz 400-MAPBGA (14x14)

Quantity 468 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6X
ManufacturerNXP USA Inc.
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A9, ARM® Cortex®-M4Device Package400-MAPBGA (14x14)
Display & Interface ControllersKeypad, LCD, LVDSECCN5A992CEthernet10/100/1000Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-20°C ~ 105°C (TJ)Package / Case400-LFBGARAM ControllersLPDDR2, LVDDR3, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Speed227MHz, 1GHzSupplier Device Package400-MAPBGA (14×14)USBUSB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.5V, 2.8V, 3.15V

Overview of SCIMX6X3EVK10ABR – IC MPU I.MX6SX 1GHZ 400MAPBGA

The SCIMX6X3EVK10ABR is a dual-core microprocessor IC featuring ARM® Cortex®-A9 and ARM® Cortex®-M4 processor cores in a 400-MAPBGA (14×14) surface-mount package. It integrates multi‑domain interfaces and security blocks to address embedded applications that require networking, multimedia and system-level protection.

Designed for embedded systems, this device pairs multi‑core processing with integrated memory controllers, Ethernet and USB connectivity, and display interfaces to simplify system design and reduce external component count.

Key Features

  • Cores and Performance — Dual ARM® Cortex® cores (Cortex‑A9 and Cortex‑M4) with documented clock rates of 1 GHz and 227 MHz, providing separate processing domains for application and real‑time tasks.
  • Memory Support — Integrated controllers for LPDDR2, LVDDR3 and DDR3 memory technologies to support a range of system memory configurations.
  • Connectivity — Dual 10/100/1000 Mbps Ethernet ports and multiple USB interfaces (USB 2.0 + PHY ×1 and USB 2.0 OTG + PHY ×2) for high‑bandwidth networking and peripheral connectivity.
  • Display and UI — Display interface controllers including keypad, LCD and LVDS to support user interfaces and graphical displays; graphics acceleration is available.
  • Security and Debug — On‑chip security and system management features including A‑HAB, ARM TrustZone (ARM TZ), CAAM, CSU, SNVS, System JTAG and TVDECODE.
  • Package and Thermal — Supplier device package: 400‑MAPBGA (14×14) in a surface‑mount format; rated operating temperature range −20 °C to 105 °C.
  • Multimedia Acceleration — Co‑processor support for multimedia functions and NEON™ MPE to accelerate signal and media processing tasks.
  • Additional Interfaces — Built‑in AC'97 support for legacy audio codec integration.

Typical Applications

  • Networked Embedded Systems — Dual Gigabit Ethernet ports and multiple USB interfaces enable high‑bandwidth connectivity for networked controllers and gateways.
  • Multimedia and HMI — Integrated display controllers, graphics acceleration and multimedia co‑processors support user interfaces, LCD panels and LVDS displays.
  • Secure Embedded Platforms — On‑chip security features (A‑HAB, ARM TZ, CAAM, CSU, SNVS) allow implementation of protected boot and secure data handling in embedded devices.
  • Real‑Time Control — The combination of dual cores permits separation of application and real‑time control tasks within a single device for industrial and embedded control use cases.

Unique Advantages

  • Dual‑Core Integration: Combines two ARM® cores in one package to consolidate application and real‑time processing without multiple discrete processors.
  • Broad Memory Compatibility: Native controllers for LPDDR2, LVDDR3 and DDR3 simplify board design across different memory choices.
  • Comprehensive Connectivity: Built‑in Gigabit Ethernet and multiple USB PHYs reduce the need for external controllers and lower BOM complexity.
  • System Security Suite: Extensive on‑chip security blocks provide the building blocks for secure boot, encrypted storage and trusted execution environments.
  • Display and Multimedia Ready: Display interfaces, graphics acceleration and multimedia co‑processors enable rich user interfaces and media processing in a compact solution.
  • Wide Operating Range: Rated from −20 °C to 105 °C to support deployment in a variety of embedded environments.

Why Choose SCIMX6X3EVK10ABR?

SCIMX6X3EVK10ABR positions itself as a highly integrated embedded processor that brings together multicore processing, memory flexibility, high‑speed networking and comprehensive security in a single 400‑MAPBGA package. The combination of ARM® Cortex® cores, multimedia acceleration and multiple interface controllers helps reduce system complexity and component count.

This device is well suited for designers building networked, display‑oriented or security‑sensitive embedded products who require on‑chip integration of Ethernet, USB, display and memory controllers. Its documented thermal range and surface‑mount package support robust deployment in a range of embedded applications.

To request a quote or submit a purchase inquiry for SCIMX6X3EVK10ABR, please contact our sales team with your requirements and projected volumes. A sales specialist will respond with availability and pricing details.

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