Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ADUC848BCPZ8-3
ADUC848BCPZ8-3Analog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,616
ADUC848BCPZ8-5
ADUC848BCPZ8-5Analog Devices Inc.IC MCU 8BIT 8KB FLASH 56LFCSPMicrocontrollers56-LFCSP-VQ (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-LFCSP-VQ (8×8)
Package / Case:
56-VFQFN Exposed Pad, CSP
1,168
ADUC848BSZ32-3
ADUC848BSZ32-3Analog Devices Inc.IC MCU 8BIT 32KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
293
ADUC848BSZ32-5
ADUC848BSZ32-5Analog Devices Inc.IC MCU 8BIT 32KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,757
ADUC848BSZ62-3
ADUC848BSZ62-3Analog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
165
ADUC848BSZ62-5
ADUC848BSZ62-5Analog Devices Inc.IC MCU 8BIT 62KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
62KB (62K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
1,874
ADUC848BSZ8-3
ADUC848BSZ8-3Analog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
264
ADUC848BSZ8-5
ADUC848BSZ8-5Analog Devices Inc.IC MCU 8BIT 8KB FLASH 52MQFPMicrocontrollers52-MQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
8052
Core Size:
8-Bit
Speed:
12.58MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
POR, PSM, PWM, Temp Sensor, WDT
Number of I/O:
34
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2.25K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 10x16b; D/A 1x12b, 2x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-MQFP (10×10)
Package / Case:
52-QFP
199
ADUCM300WBCPZ
ADUCM300WBCPZAnalog Devices Inc.IC MCU 32BIT 128KB FLASH 32LFCSPMicrocontrollers32-LFCSP-VQ (6x6)N/A-40°C ~ 115°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16.384Mhz
Connectivity:
LINbus, SPI
Peripherals:
POR, WDT
Number of I/O:
6
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
3.6V ~ 18V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 115°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
32-LFCSP-VQ (6×6)
Package / Case:
32-VFQFN Exposed Pad, CSP
957
ADUCM3027BCBZ-R7
ADUCM3027BCBZ-R7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 54WLCSPMicrocontrollers54-WLCSP (2.76x2.76)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
54-WLCSP (2.76×2.76)
Package / Case:
54-UFBGA, WLCSP
22
ADUCM3027BCBZ-RL
ADUCM3027BCBZ-RLAnalog Devices Inc.IC MCU 32BIT 128KB FLASH 54WLCSPMicrocontrollers54-WLCSP (2.76x2.76)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
54-WLCSP (2.76×2.76)
Package / Case:
54-UFBGA, WLCSP
825
ADUCM3027BCPZ
ADUCM3027BCPZAnalog Devices Inc.IC MCU 32BIT 128KB FLASH 64LFCSPMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
674
ADUCM3027BCPZ-R7
ADUCM3027BCPZ-R7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 64LFCSPMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
675
ADUCM3027BCPZ-RL
ADUCM3027BCPZ-RLAnalog Devices Inc.LOWPWR CORTEXM3 W/128KEMBEDDED FMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
1,142
ADUCM3029BCBZ-R7
ADUCM3029BCBZ-R7Analog Devices Inc.IC MCU 32BIT 256KB FLASH 54WLCSPMicrocontrollers54-WLCSP (2.76x2.76)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, SSC, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
54-WLCSP (2.76×2.76)
Package / Case:
54-UFBGA, WLCSP
19
ADUCM3029BCBZ-RL
ADUCM3029BCBZ-RLAnalog Devices Inc.IC MCU 32BIT 256KB FLASH 54WLCSPMicrocontrollers54-WLCSP (2.76x2.76)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
54-WLCSP (2.76×2.76)
Package / Case:
54-UFBGA, WLCSP
223
ADUCM3029BCPZ
ADUCM3029BCPZAnalog Devices Inc.IC MCU 32BIT 256KB FLASH 64LFCSPMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
631
ADUCM3029BCPZ-R7
ADUCM3029BCPZ-R7Analog Devices Inc.IC MCU 32BIT 256KB FLASH 64LFCSPMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
332
ADUCM3029BCPZ-RL
ADUCM3029BCPZ-RLAnalog Devices Inc.IC MCU 32BIT 256KB FLASH 64LFCSPMicrocontrollers64-LFCSP-WQ (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
26MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
44
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP-WQ (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
800
ADUCM310BBCZ
ADUCM310BBCZAnalog Devices Inc.IC MCU 32B 256KB FLASH 112CSPBGAMicrocontrollers112-CSPBGA (6x6)N/A-10°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
256KB (128K x 8 x 2)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.9V ~ 3.6V
Data Converters:
A/D 22x14b; D/A 8x12b
Oscillator Type:
Internal
Operating Temperature:
-10°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-CSPBGA (6×6)
Package / Case:
112-TFBGA, CSPBGA
995

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