Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
ADUCM360BCPZ128-R7
ADUCM360BCPZ128-R7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20 MIPS
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 11x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
895
ADUCM361BCPZ128
ADUCM361BCPZ128Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20 MIPS
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 11x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
49
ADUCM361BCPZ128-R7
ADUCM361BCPZ128-R7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
20 MIPS
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 11x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
76
ADUCM362BCPZ128
ADUCM362BCPZ128Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
45
ADUCM362BCPZ128RL7
ADUCM362BCPZ128RL7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)1.8V - 3.6V-40°C – 125°C
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Program Memory Size:
128KB (128K x 8)
Mounting Type:
Surface Mount
1,186
ADUCM362BCPZ256
ADUCM362BCPZ256Analog Devices Inc.IC MCU 32BIT 256KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
14
ADUCM362BCPZ256RL7
ADUCM362BCPZ256RL7Analog Devices Inc.IC MCU 32BIT 256KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
1,590
ADUCM363BCPZ128
ADUCM363BCPZ128Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
1,859
ADUCM363BCPZ128RL7
ADUCM363BCPZ128RL7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
1,505
ADUCM363BCPZ256
ADUCM363BCPZ256Analog Devices Inc.IC MCU 32BIT 256KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
144
ADUCM4050BCBZ-R7
ADUCM4050BCBZ-R7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 72WLCSPMicrocontrollers72-WLCSP (3.57x3.16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
72-WLCSP (3.57×3.16)
Package / Case:
72-UFBGA, WLCSP
1,194
ADUCM4050BCBZ-RL
ADUCM4050BCBZ-RLAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 72WLCSPMicrocontrollers72-WLCSP (3.57x3.16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
72-WLCSP (3.57×3.16)
Package / Case:
72-UFBGA, WLCSP
1,346
ADUCM4050BCPZ
ADUCM4050BCPZAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
1,265
ADUCM4050BCPZ-R7
ADUCM4050BCPZ-R7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
373
ADUCM4050BCPZ-RL
ADUCM4050BCPZ-RLAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
1,231
ADUCM410BBCZ
ADUCM410BBCZAnalog Devices Inc.IC MCU 32BIT 1MB FLASH 81CSPBGAMicrocontrollers81-CSPBGA (5x5)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
81-CSPBGA (5×5)
Package / Case:
81-VFBGA, CSPBGA
434
ADUCM410BBCZ-RL7
ADUCM410BBCZ-RL7Analog Devices Inc.IC MCU 32BIT 1MB FLASH 81CSPBGAMicrocontrollers81-CSPBGA (5x5)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
81-CSPBGA (5×5)
Package / Case:
81-VFBGA, CSPBGA
1,513
N/A
ADUCM410BCBZ-RL7Analog Devices Inc.IC MCU 32BIT 1MB FLASH 64WLCSPMicrocontrollers64-WLCSP (3.46x3.46)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
64-WLCSP (3.46×3.46)
Package / Case:
64-UFBGA, WLCSP
57
N/A
ADUCM420BCBZ-RL7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 64WLCSPMicrocontrollers64-WLCSP (3.46x3.46)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-WLCSP (3.46×3.46)
Package / Case:
64-UFBGA, WLCSP
1,261
ADV3000ASTZ
ADV3000ASTZAnalog Devices Inc.IC HDMI/DVI SWITCH 3.1 80LQFPAnalog Switches, Multiplexers, Demultiplexers80-LQFP (14x14)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
80-LQFP
Supplier Device Package:
80-LQFP (14×14)
770

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